STPS5L25B-1

® STPS5L25B/B-1 LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) 5A 25 V 150°C 0.35 V 4 4 2 3 4 (TAB) FEATURES AND BENEFITS VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION AND REDUCED HEATSINK OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH MEANS THE HIGHEST EFFICIENCY IN THE APPLICATIONS HIGH POWER SURFACE MOUNT MINIATURE PACKAGE AVALANCHE RATED DESCRIPTION Single Schottky rectifier suited to Switched Mode Power Supplies and high frequency DC to DC converters. This device is especially intended for use as a Rectifier at the secondary of 3.3V SMPS units. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM Tstg Tj dV/dt *: RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Tc = 145°C δ = 0.5 tp = 10 ms Sinusoidal tp=2 µs square F=1kHz tp = 100 µs square Parameter Repetitive peak reverse voltage Value 25 7 5 75 1 2 - 65 to + 150 150 10000 Unit V A A A A A °C °C V/µs 2 1 NC 3 3 2 1 NC DPAK STPS5L25B IPAK STPS5L25B-1 dPtot 1 < thermal runaway condition for a diode on its own heatsink Rth(j−a) dTj 1/5 August 1999 - Ed: 3A STPS5L25B/B-1 THERMAL RESISTANCES Symbol Rth(j-c) Junction to case Parameter Value 2.5 Unit °C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * VF * Tests Conditions Reverse leakage current Forward voltage drop Tests Conditions Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Pulse test : * tp = 380 µs, δ < 2% Min. Typ. 55 Max. 350 115 0.47 0.35 0.59 0.50 Unit µA mA V VR = VRRM IF = 5 A IF = 5 A IF = 1 0 A IF = 1 0 A 0.41 0.31 To evaluate the maximum conduction losses use the following equation : P = 0.2 x IF(AV) + 0.030 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 2.5 2.0 1.5 1.0 T Fig. 2: Average forward current versus ambient temperature (δ=0.5). 6 IF(av)(A) Rth(j-a)=Rth(j-c) δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 5 4 δ=1 3 2 Rth(j-a)=70°C/W T 0.5 IF(av) (A) 0.0 0 1 2 3 4 δ=tp/T tp 1 5 6 0 δ=tp/T tp Tamb(°C) 50 75 100 125 150 0 25 2/5 STPS5L25B/B-1 Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). 100 80 60 40 Tc=100°C Tc=25°C Tc=75°C Fig. 4: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 0.4 δ = 0.5 IM(A) δ = 0.2 T 20 0 1E-3 IM t 0.2 δ=0.5 Single pulse δ = 0.1 t(s) 1E-2 1E-1 1E+0 tp(s) 0.0 1.0E-4 1.0E-3 1.0E-2 δ=tp/T tp 1.0E-1 1.0E+0 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). 3E+2 1E+2 1E+1 1E+0 1E-1 Tj=25°C Fig. 6: Junction capacitance versus reverse voltage applied (typical values). C(pF) IR(mA) Tj=150°C 2000 F=1MHz Tj=25°C Tj=125°C 1000 500 1E-2 VR(V) 1E-3 0 5 10 15 20 25 200 VR(V) 100 1 2 5 10 20 30 Fig. 7: Forward voltage drop versus forward current (maximum values). Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm). Rth(j-a) (°C/W) 100 100.0 IFM(A) Typical values Tj=150°C 80 Tj=125°C 10.0 60 40 1.0 Tj=25°C 20 VFM(V) 0.1 0.0 0 0 2 4 6 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 8 10 12 S(Cu) (cm²) 14 16 18 20 3/5 STPS5L25B/B-1 PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. A A1 A2 B B2 C C2 D E G H L2 L4 V2 FOOT PRINT DIMENSIONS (in millimeters) 6.7 Millimeters Min. Max 2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 0° 8° Inches Min. Max. 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039 0° 8° 6.7 3 3 1.6 2.3 2.3 1.6 4/5 STPS5L25B/B-1 PACKAGE MECHANICAL DATA IPAK DIMENSIONS REF. A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 V1 Millimeters Min. A E B2 L2 C2 Inches Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.033 0.035 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.031 0.039 10° 0.086 0.035 0.027 0.025 0.204 Typ. Max. Min. 2.4 1.1 1.3 0.9 5.4 0.85 0.3 0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1 2.2 0.9 0.7 0.64 5.2 D H L L1 B6 B3 B V1 A1 B5 G C A3 0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 10° 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 Ordering type STPS5L25B STPS15LB-TR STPS5L25B-1 Marking STPS5L25B STPS5L25B STPS5L25B Package DPAK DPAK IPAK Weight 0.30g 0.30g 0.35g Base qty 75 2500 75 Delivery mode Tube Tape & reel Tube Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 5/5