STPS5L25B-TR

STPS5L25 Low drop power Schottky rectifier Datasheet  production data Description Single Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. . $ Packaged in DPAK, this device is intended for use as a rectifier at the secondary of 3.3 V SMPS units. . . . $ 1& . $ 1& Table 1. Device summary '3$. Features Symbol Value IF(AV) 5A VRRM 25 V Tj (max) 150 °C VF(typ) 0.31 V  Very low forward voltage drop for less power dissipation and reduced heatsink  Optimized conduction/reverse losses trade-off which means the highest efficiency in the applications  High power surface mount miniature package  Avalanche specification  ECOPACK®2 compliant component for DPAK on demand May 2017 This is information on a product in full production. DocID3626 Rev 8 1/8 www.st.com 8 Characteristics 1 STPS5L25 Characteristics Table 2. Absolute ratings (limiting values, at 25 °C unless otherwise stated) Symbol Value Unit VRRM Repetitive peak reverse voltage 25 V IF(RMS) Forward rms current 7 A IF(AV) Average forward current, δ 0.5 square wave Tc = 140 °C, 5 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 s, Tj = 125 °C 215 W -65 to +150 °C 150 °C Tstg Storage temperature range Maximum operating junction Tj 1. Parameter 1 dPtot < Rth(j-a) dTj temperature(1) condition to avoid thermal runaway for a diode on its own heatsink Table 3. Thermal resistance Symbol Rth(j-c) Parameter Junction to case Max. value Unit 2.5 °C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions IR(1) Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(1) Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C Min. Typ. Max. Unit - - 350 A - 55 115 mA - - 0.47 - 0.31 0.35 - - 0.59 - 0.41 0.50 VR = VRRM IF = 5 A V IF = 10 A 1. Pulse test: tp = 380 µs,  < 2% To evaluate the conduction losses use the following equation: P = 0.2 x IF(AV) + 0.03 x IF2(RMS) 2/8 DocID3626 Rev 8 STPS5L25 Characteristics Figure 1. Average forward power dissipation versus average forward current   Figure 2. Average forward current versus ambient temperature (δ = 0.5) 3)$9 : , į   į  )$9 $ į  5WKMD 5WKMF į     į     5WKMD ƒ&:    7 7    , )$9     $  WS į WS7   į WS7      3$50W33$50—V 7 DPE ƒ&       Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Figure 3. Normalized avalanche power derating versus pulse duration at Tj = 125 °C  WS = 5  WKMF WKMF       į    W3—V    7 į   ( į WS7 6LQJOHSXOVH ( ( WS ,5P$ ( Figure 6. Junction capacitance versus reverse voltage applied (typical values)  &S) ( ) 0+] 7  ƒ& M 7M ƒ& ( W3V (   Figure 5. Reverse leakage current versus reverse voltage applied (typical values) ( į       7M ƒ& (  (  ( 7M ƒ& 959 (         DocID3626 Rev 8 9 9 5      3/8 Characteristics STPS5L25 Figure 7. Forward voltage drop versus forward current (maximum values)   ,)$ Figure 8. Thermal resistance junction to ambient versus copper surface under tab  5WKMDƒ&: (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P  7  ƒ& M W\SLFDOYDOXHV  '3$.   7  ƒ&   M   7  ƒ& M       4/8 9 9 )                 6 FPð &8   DocID3626 Rev 8         STPS5L25 2 Package Information Package Information  Epoxy meets UL94,V0  Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DPAK package information Figure 9. DPAK package outline ( $ E 7KHUPDOSDG ( / F ' ' + 5 / $ E H H 5 F $ / / 9  Note: *DXJH SODQH This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID3626 Rev 8 5/8 Package Information STPS5L25 Table 5. DPAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.214 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.264 E1 4.32 5.50 0.170 0.216 e 2.28 0.090 e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.00 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° 8° Figure 10. DPAK footprint dimensions (in mm)      % 7KHGHYLFHPXVWEHSRVLWLRQHGZLWKLQ 6/8 DocID3626 Rev 8   $ % $ STPS5L25 3 Ordering information Ordering information Table 6. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STPS5L25B-TR STPS5 L25B DPAK 0.32 g 2500 Tape and reel Revision history Table 7. Document revision history Date Revision Changes Jul-2003 5A 15-Apr-2008 6 Reformatted to current standard. Corrected order code in Table 5. 08-Jan-2015 7 Updated package information and reformatted to current standard. 15-May-2017 8 Updated DPAK package information and reformatted to current standard. Previous release. DocID3626 Rev 8 7/8 STPS5L25 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 8/8 DocID3626 Rev 8