STPS5L60RL

STPS5L60 Power Schottky rectifier Features ● ● ● ● Negligible switching losses Low forward voltage drop for higher efficiency Low thermal resistance Avalanche capability specified K A A K Description Power Schottky rectifier suited for switch mode power supplies and high frequency inverters. This device is intended for use in low voltage output for small battery chargers and consumer SMPS such as DVD and set-top-box. SMC STPS5L60S DO-201AD STPS5L60 Table 1. Device summary IF(AV) VRRM Tj (max) VF (max) 5A 60 V 150 °C 0.53 V May 2008 Rev 3 1/8 www.st.com 8 Characteristics STPS5L60 1 Table 2. Symbol VRRM IF(RMS) IF(AV) Characteristics Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage RMS forward current DO-201AD Average forward current SMC Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature(1) Tl = 100 °C δ = 0.5 Tl = 100 °C δ = 0.5 Value 60 15 5 Unit V A A IFSM PARM Tstg Tj dV/dt 1. dPtot --------------dTj Half wave, single phase tp = 10 ms tp = 1 µs Tj = 25 °C 150 4000 -65 to + 175 150 10000 A W °C °C V/µs Critical rate of rise of reverse voltage (rated VR, Tj = 25 °C) 1 < -------------------------- condition to avoid thermal runaway for a diode on its own heatsink Rth ( j – a ) Table 3. Symbol Rth (j-a) Rth (j-l) Rth (j-l) Thermal parameters Parameter Junction to ambient DO-201AD Junction to leads Junction to leads SMC Lead length = 10mm 15 15 Value 75 °C/W Unit Table 4. Symbol Static electrical characteristics Parameter Tests conditions Tj = 25 °C Min. Typ. Max. 0.22 VR = VRRM 10 40 0.47 IF = 5 A 0.43 0.42 25 100 0.52 0.49 0.48 V mA Unit IR (1) Reverse leakage current Tj = 100 °C Tj = 125 °C Tj = 25 °C VF (1) Forward voltage drop Tj = 100 °C Tj = 125 °C 1. Pulse test : tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.39 x IF(AV) + 0.028x IF2(RMS) 2/8 STPS5L60 Characteristics Figure 1. PF(av)(W) 3.5 Conduction losses versus average Figure 2. current δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Average forward current versus ambient temperature (δ = 0.5) 6 IF(av)(A) Rth(j-a)=Rth(j-l) 3.0 2.5 2.0 δ=1 5 4 3 1.5 2 DO-201AD Rth(j-a)=75°C/W 1.0 T T 0.5 1 SMC Rth(j-a)=90°C/W IF(av)(A) 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 δ=tp/T 5.0 5.5 tp δ=tp/T 0 tp Tamb(°C) 50 75 100 125 150 6.0 0 25 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 PARM (t j ) PARM (25°C) 1 0.1 0.01 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj (°C) 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) DO-201AD DO-201AD Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) SMC SMC 16 14 12 IM(A) 14 12 10 IM(A) 10 8 6 Ta=25 °C 8 Ta=75 °C Ta=25 °C 6 4 Ta=75 °C 4 IM Ta=125 °C Ta=125 °C 2 0 1.E-03 2 t IM t δ =0.5 δ =0.5 t(s) 1.E-02 1.E-01 1.E+00 t(s) 1.E-02 1.E-01 1.E+00 0 1.E-03 3/8 Characteristics STPS5L60 Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration, DO-201AD Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration, SMC Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 DO-201AD Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 SMC tp(s) 0.1 0.0 1.E-01 1.E+00 tp(s) 1.E+01 1.E+02 1.E+03 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) Figure 10. Junction capacitance versus reverse voltage applied (typical values) 1000 1.E+03 IR(mA) Tj=150°C C(pF) F=1MHz Vosc=30mV Tj=25°C 1.E+02 Tj=125°C 1.E+01 Tj=100°C 1.E+00 Tj=75°C Tj=50°C 1.E-01 Tj=25°C 1.E-02 VR(V) 1.E-03 0 5 10 15 20 25 30 35 40 45 50 55 60 100 1 10 VR(V) 100 4/8 STPS5L60 Characteristics Figure 11. Forward voltage drop versus forward current (low level) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 Tj=25°C (Maximum values) Tj=125°C (Typical values) Tj=125°C (Maximum values) Figure 12. Forward voltage drop versus forward current (high level) 50 45 40 35 30 25 20 15 10 Tj=25°C (Maximum values) Tj=125°C (Typical values) IFM(A) IFM(A) Tj=125°C (Maximum values) VFM(V) 5 0 0.0 0.2 0.4 0.6 0.8 VFM(V) 1.0 1.2 1.4 1.6 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, Cu = 35 µm) SMC Rth(j-a)(°C/W) 100 90 80 70 60 SMC Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, Cu = 35 µm), DO-201AD 80 70 60 50 (j ) Rth(j-a)(°C/W) DO-201AD 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 40 30 20 10 SCU(cm²) S(cm²) 0 1 2 3 4 5 6 7 8 9 10 0 Figure 15. Thermal resistances versus leads length DO-201AD Rth(°C/W) 80 70 60 50 40 30 20 10 0 5 10 15 20 25 Rth(j-l) Rth(j-a): Epoxy printed circuit board FR4 (Cu=35µm) Lleads(cm) 5/8 Package information STPS5L60 2 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 5. SMC dimensions Dimensions Ref. E1 Millimeters Min. Max. 2.45 0.20 3.20 0.40 6.25 8.15 7.15 4.70 1.50 Inches Min. 0.075 0.002 0.114 0.006 0.218 0.305 0.260 0.173 0.030 Max. 0.096 0.008 0.126 0.016 0.246 0.321 0.281 0.185 0.059 A1 D 1.90 0.05 2.90 0.15 5.55 7.75 6.60 4.40 0.75 A2 b(1) E c (1) D A1 C E2 L A2 b E E1 E2 L 1. Dimensions b and c apply to plated leads Figure 16. Footprint, dimensions in mm (inches) 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.322) 6/8 STPS5L60 Figure 17. Package mechanical data DO-201AD plastic Ordering information Dimensions REF. Millimeters Min. B Note 1 Inches Min. Max. 0.374 1.000 Max. 9.50 A E E Note 1 B A B ∅C 25.40 ØD Note 2 5.30 1.30 1.25 0.209 0.051 0.049 ∅D E ØC Notes 1-The lead diameter ∅D is not controlled over zone E 2 - The minimum axial length within which the device may be placed with its leads bent at right angles is 0.59" (15 mm) 3 Ordering information Table 6. Ordering information Marking STPS5L60 STPS5L60 S56 Package D0-201AD D0-201AD SMC Weight 1.12 g 1.12 g 0.245 g Base qty 600 1900 2500 Delivery mode Ammopack Tape and reel Tape and reel Order code STPS5L60 STPS5L60RL STPS5L60S 4 Revision history Table 7. Date July-2003 16-May-2008 Document revision history Revision 2 3 Previous issue. Added ECOPACK statement. Added SMC package. Updated characteristic curves. Description of changes 7/8 STPS5L60 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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