STPS5L60S

STPS5L60 Power Schottky rectifier Datasheet - production data Description Power Schottky rectifier suited for switch mode power supplies and high frequency inverters. $ This device is intended for use in low voltage output for small battery chargers and consumer SMPS such as DVD and set-top box. $ . . 60% Table 1. Device summary 60& $ . '2$' Symbol Value IF(AV) 5A VRRM 60 V Tj (max.) 150 °C Vf (max.) 0.48 V Features • Negligible switching losses • Low forward voltage drop for higher efficiency • Low thermal resistance • Avalanche capability specified July 2015 This is information on a product in full production. Doc ID8727 Rev 4 1/12 www.st.com Characteristics 1 STPS5L60 Characteristics Table 2. Absolute Ratings (limiting values, at 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward RMS current 15 A 5 A IF(AV) TL = 100°C, δ = 0.5 SMC TL = 100°C, δ = 0.5 SMB TL = 80°C, δ = 0.5 IFSM Surge non repetitive forward current, half sine wave, tp = 10 ms PARM Repetitive peak avalanche power Tstg Tj 1. Average forward current DO-201AD DO-201AD, SMC 150 SMB 90 tp = 10 µs Tj = 125 °C Storage temperature range Maximum operating junction temperature A 280 W -65 to +175 °C 150 °C (1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-a) Parameter Junction to ambient DO-201AD DO-201AD Rth(j-l) Junction to lead Value Unit 75 Lead length = 10 mm 15 SMC 15 SMB 20 °C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Tj = 25 °C IR(1) VF(1) Reverse leakage current Forward voltage drop Tj = 100 °C Typ. - Max. 10 25 - 25 55 Tj = 125 °C - 40 100 Tj = 25 °C - 0.47 0.52 - 0.43 0.49 - 0.42 0.48 Tj = 110 °C Tj = 100 °C IF = 5A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.39 x IF(AV) + 0.028 IF2(RMS) Doc ID8727 Rev 4 Unit 0.22 - VR = VRRM Tj = 125 °C 2/12 Min. mA V STPS5L60 Characteristics Figure 1. Average forward power dissipation versus average current  3)$9 : į  į  į  3)$9 :  į  į  Figure 2. Average forward current versus ambient temperature (δ = 0.5) 5WKMD 5WKMO  '2$'60&    60%     7  7   į WS7          WS   į WS7 ,) $ $9    Figure 3. Normalized avalanche power derating versus pulse duration  7DPEƒ& WS  3$50WS3$50—V        Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration, SMB   =WKMO5WKMO 60%        6LQJOHSXOVH 7     WS—V      ( Doc ID8727 Rev 4 į WS7 ( ( WS ( W3V ( 3/12 12 Characteristics STPS5L60 Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration, DO-201AD  =WKMD5WKMD  Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration, SMC  '2$'         60&    6LQJOHSXOVH   ( 6LQJOHSXOVH 7  7   į WS7 ( (  W3V WS ( ( Figure 7. Reverse leakage current versus reverse voltage applied (typical values) ( =WKMD5WKMD  ,5P$ į WS7  ( ( WS ( W3V ( ( Figure 8. Junction capacitance versus reverse voltage applied (typical values) &S)  ) 0+] 926& P9506 ( 7  ƒ& M 7  ƒ& M 7  ƒ& M ( 7  ƒ& M (  7  ƒ& M ( 7  ƒ& M ( 7  ƒ& M 9 9 5 (              9 9 5     Figure 9. Forward voltage drop versus forward Figure 10. Forward voltage drop versus forward current (low level) current (High level)    ,)$    7M ƒ& W\SLFDOYDOXHV      7M ƒ& PD[LPXPYDOXHV   9 9 )               4/12 7M ƒ& W\SLFDOYDOXHV  7M ƒ& PD[LPXPYDOXHV   7M ƒ& PD[LPXPYDOXHV  7M ƒ& PD[LPXPYDOXHV   ,)$    Doc ID8727 Rev 4 9 9 )         STPS5L60 Characteristics Figure 11. Thermal resistance junction to Figure 12. Thermal resistance junction to ambient versus copper surface under each lead ambient versus copper surface under each lead SMB (typical values) DO-201AD (typical values)  5WKMDƒ&:   (SR[\SULQWHGERDUG)5H &X 60%  —P    (SR[\SULQWHGERDUG)5H  &X '2$'  —P              6 &X    FPð           5WKMDƒ&:    &X FPð  (SR[\SULQWHGERDUG)5H &X 60&  —P          6 &X                  5WKMDHSR[\SULQWHGERDUG)5H&8 —P  5 WKMO  FPð   5WKƒ&:     Figure 14. Thermal resistances versus leads length DO-201AD    6  Figure 13. Thermal resistance junction to ambient versus copper surface under each lead SMC (typical values)  5WKMDƒ&: /   Doc ID8727 Rev 4    OHDG  FP  5/12 12 Package information 2 STPS5L60 Package information • Epoxy meets UL94,V0 • Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SMB package information Figure 15. SMB package outline ( ' ( $ $ F E / Table 5. SMB package mechanical data Dimensions Ref. 6/12 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 Doc ID8727 Rev 4 STPS5L60 Package information Figure 16. SMB footprint, dimensions in mm (inches)         Doc ID8727 Rev 4   7/12 12 Package information 2.2 STPS5L60 D0-201AD package information Figure 17. D0-201AD package outline B B A E Note 1 E Note 1 ØD Note 2 ØC 1. Note1: The lead diameter ØD is not controlled over zone E. 2. Note2: The minimum axial lenght within which the device may be placed with its leads bent at right angles is 0.59” (15mm). Table 6. D0-201AD package mechanical data Dimensions Ref. Millimeters Min. A B 8/12 Inches Max. Min. 9.50 25.40 Max. 0.374 1000 ØC 5.30 0.209 ØD 1.30 0.051 E 1.25 0.049 Doc ID8727 Rev 4 STPS5L60 2.3 Package information SMC package information Figure 18. SMC package outline E1 D E A1 A2 C E2 L b Table 7. SMC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b(1) 2.90 3.20 0.114 0.126 c(1) 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.059 1. Dimensions b and c apply to plated leads Doc ID8727 Rev 4 9/12 12 Package information STPS5L60 Figure 19. SMC footprint, dimensions in mm (inches) 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.322) 10/12 Doc ID8727 Rev 4 STPS5L60 3 Ordering information Ordering information Table 8. Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode STPS5L60S S56 SMC 0.245 g 2500 Tape and reel STPS5L60RL STPS5L60 D0-201AD 1.12 g 1900 Tape and reel STPS5L60L STPS5L60 D0-201AD 1.12 g 600 Ammopack STPS5L60U G56 SMB 0.107 g 2500 Tape and reel Revision history Table 9. Document revision history Date Revision Changes July-2003 2 Previous issue. 16-May-2008 3 Added ECOPACK statement. Added SMC package. Updated characteristic curves. 17-Jul-2015 4 Added SMB package information and reformatted to current standard. Doc ID8727 Rev 4 11/12 12 STPS5L60 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 12/12 Doc ID8727 Rev 4