STPS5L60SY

STPS5L60-Y Automotive power Schottky rectifier Datasheet − production data Features ■ Negligible switching losses ■ Low forward voltage drop for higher efficiency ■ Low thermal resistance ■ Avalanche capability specified ■ AEC-Q101 qualified ■ ECOPACK®2 compliant component A K SMC STPS5L60SY Description Power Schottky rectifier suited for switch mode power supplies and high frequency inverters. This device is intended for use in low voltage output for small battery chargers and battery protection in automotive applications. March 2012 This is information on a product in full production. Table 1. Doc ID 022951 Rev 1 Device summary IF(AV) 5A VRRM 60 V Tj (max) 150 °C VF (max) 0.53 V 1/7 www.st.com 7 Characteristics STPS5L60-Y 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 15 A 5 A Average forward current IFSM Surge non repetitive forward current Half wave, single phase tp = 10 ms 150 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 4000 W Storage temperature range -65 to +175 °C Operating junction temperature(1) -40 to +150 °C 10000 V/µs Tstg Tj dV/dt dPtot --------------dTj 1. Tl = 100 °C δ = 0.5 IF(AV) < Critical rate of rise of reverse voltage (rated VR, Tj = 25 °C) 1 -------------------------Rth ( j – a ) Table 3. condition to avoid thermal runaway for a diode on its own heatsink Thermal parameters Symbol Rth (j-l) Table 4. Symbol Parameter Junction to leads Value Unit 15 °C/W Static electrical characteristics Parameter Tests conditions Min. Typ. Tj = 25 °C IR (1) VF (1) Reverse leakage current Forward voltage drop Tj = 100 °C 10 25 Tj = 125 °C 40 100 Tj = 25 °C 0.47 0.52 0.43 0.49 0.42 0.48 Tj = 100 °C Unit 0.22 VR = VRRM IF = 5 A Tj = 125 °C 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.39 x IF(AV) + 0.028x IF2(RMS) 2/7 Max. Doc ID 022951 Rev 1 mA V STPS5L60-Y Figure 1. Characteristics Conduction losses versus average Figure 2. current PF(av)(W) 3.5 δ = 0.05 δ = 0.1 δ = 0.2 6 δ = 0.5 Average forward current versus ambient temperature (δ = 0.5) IF(av)(A) Rth(j-a)=Rth(j-l) 3.0 5 δ=1 2.5 4 2.0 3 SMC Rth(j-a)=90°C/W 1.5 2 1.0 T T 1 0.5 IF(av)(A) δ=tp/T 0.0 0.0 0.5 Figure 3. 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 δ=tp/T tp tp Tamb(°C) 0 5.5 6.0 Normalized avalanche power derating versus pulse duration 25 0 Figure 4. 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM (t j ) PARM (25°C) PARM (t p ) PARM (1µs) 1 1 0.1 0.01 t p (µs) 0.001 0.01 0.1 1 Tj (°C) 10 100 1000 0 25 Figure 5. 14 Non repetitive surge peak forward current versus overload duration (maximum values) 50 Figure 6. IM(A) 75 100 125 150 Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-a)/Rth(j-a) 1.0 SMC 0.9 12 SMC 0.8 10 0.7 Ta=25 °C 8 0.6 0.5 6 Ta=75 °C 0.4 0.3 4 Ta=125 °C 2 IM 0 1.E-03 0.2 0.1 t δ =0.5 tp(s) t(s) 1.E-02 1.E-01 1.E+00 0.0 1.E-01 Doc ID 022951 Rev 1 1.E+00 1.E+01 1.E+02 1.E+03 3/7 Characteristics Figure 7. 1.E+03 STPS5L60-Y Reverse leakage current versus reverse voltage applied (typical values) Figure 8. IR(mA) 1000 Junction capacitance versus reverse voltage applied (typical values) C(pF) F=1MHz Vosc=30mV Tj=25°C Tj=150°C 1.E+02 Tj=125°C 1.E+01 Tj=100°C Tj=75°C 1.E+00 Tj=50°C 1.E-01 Tj=25°C 1.E-02 VR(V) VR(V) 100 1.E-03 0 Figure 9. 5.0 5 10 15 20 25 30 35 40 45 50 55 1 60 Forward voltage drop versus forward current (low level) 50 IFM(A) Tj=125°C (Maximum values) 45 4.5 Tj=125°C (Maximum values) 4.0 40 35 3.5 Tj=125°C (Typical values) 30 Tj=125°C (Typical values) 3.0 100 Figure 10. Forward voltage drop versus forward current (high level) IFM(A) 2.5 25 2.0 20 Tj=25°C (Maximum values) 1.5 Tj=25°C (Maximum values) 15 1.0 10 0.5 5 VFM(V) 0.0 0.00 10 VFM(V) 0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, copper thickness = 35 µm) Rth(j-a)(°C/W) 100 SMC 90 80 70 60 50 40 30 20 10 SCU(cm²) 0 0.0 4/7 0.5 1.0 1.5 2.0 2.5 3.0 Doc ID 022951 Rev 1 3.5 4.0 4.5 5.0 1.6 STPS5L60-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMC dimensions Dimensions Ref. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b(1) 2.90 3.20 0.114 0.126 (1) 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.059 c E A1 C A2 E2 L b Inches Min. E1 D Millimeters 1. Dimensions b and c apply to plated leads Figure 12. Footprint, dimensions in mm (inches) 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.322) Doc ID 022951 Rev 1 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS5L60SY S56Y SMC 0.245 g 2500 Tape and reel Revision history Table 7. 6/7 STPS5L60-Y Document revision history Date Revision 29-Mar-2012 1 Description of Changes Initial issue Doc ID 022951 Rev 1 STPS5L60-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. 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