STPS5L60U

STPS5L60 Datasheet 5 A - 60 V power Schottky rectifier Features • • • • • Negligible switching losses Low forward voltage drop Low thermal resistance Avalanche rated ECOPACK2 component Applications • • • • • • Lighting Battery charger Set-top box DC / DC converter Notebook adapter Switching diode Description Axial and surface mount power Schottky rectifier suited for switch mode power supplies and high frequency dc to dc converters. Packaged in DO-201AD, SMB, SMC and SMB Flat Notch, this device is intended for use in low voltage, high frequency inverters and small battery chargers and for applications where there are space constraints, for example telecom battery charger. Product status STPS5L60 Product summary Symbol Value IF(AV) 5A VRRM 60 V T j(max.) 150 °C VF(typ.) 0.42 V DS2741 - Rev 5 - January 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPS5L60 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 15 A 5 A IF(AV) Average forward current, δ = 0.5, square wave IFSM Surge non repetitive forward current PARM Repetitive peak avalanche power Tstg Tj SMB TL = 80 °C SMC, DO-201AD, SMB Flat Notch TL = 100 °C SMC, DO-201AD, SMB SMB Flat Notch 100 tp = 10 ms sinusoidal tp = 10 µs, Tj = 125 °C Storage temperature range Maximum operating junction temperature(1) A 205 144 W -65 to +150 °C +150 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Rth(j-a) Parameter Junction to lead Junction to ambient Max. value DO-201AD lead length = 10 mm 15 SMB 20 SMC, SMB Flat Notch 15 DO-201AD 75 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Tj = 25 °C IR(1) VF(1) Reverse leakage current Forward voltage drop Tj = 100 °C Min. Typ. - Max. 0.22 - 10 25 - 25 55 Tj = 125 °C - 40 100 Tj = 25 °C - 0.47 0.52 - 0.43 0.49 - 0.42 0.48 Tj = 110 °C Tj = 100 °C Tj = 125 °C VR = VRRM IF = 5 A Unit mA V 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.39 x IF(AV) + 0.028 x IF2(RMS) DS2741 - Rev 5 page 2/16 STPS5L60 Characteristics For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS2741 - Rev 5 page 3/16 STPS5L60 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 3.5 PF(AV) (W) δ = 0.1 δ = 0.05 3.0 δ = 0.2 PF(AV) (W) 12 δ=1 δ = 0.5 Figure 2. Average forward current versus ambient temperature (δ = 0.5) Rth(j-a) = Rth(j-l) DO-201AD / SMC 10 2.5 8 SMB 2.0 6 1.5 4 T 1.0 T 2 0.5 δ= tp/T 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 tp 4.0 4.5 IF(AV) (A) 5.0 5.5 δ= tp/T 0 6.0 Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) 1 0 T tp 25 50 (°C) amb 75 100 125 150 Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration (SMB) 1.0 0.9 Zth(j-l)/Rth(j-l) SMB 0.8 0.7 0.1 0.6 0.5 Single pulse 0.4 0.3 0.01 0.2 0.1 0.001 1 10 tP(s) 0.0 t p(µs) 1.E-03 100 1.E-02 1.E-01 1.E+00 1.E+01 1000 Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-201AD) to ambient versus pulse duration (SMC) 1.0 0.9 Zth(j-a)/Rth(j-a) 1.0 0.9 DO-201AD 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 Single pulse 0.1 0.0 1.E-01 DS2741 - Rev 5 SMC Single pulse 0.2 0.1 tP(s) 1.E+00 Zth(j-a)/Rth(j-a) 1.E+01 1.E+02 1.E+03 0.0 1.E-01 tP(s) 1.E+00 1.E+01 1.E+02 1.E+03 page 4/16 STPS5L60 Characteristics (curves) Figure 7. Reverse leakage current versus reverse voltage applied (typical values) 1.E+03 Figure 8. Junction capacitance versus reverse voltage applied (typical values) IR(mA) C(pF) 1000 Tj = 150 °C F = 1 MHz VOSC = 30 mVRMS 1.E+02 Tj = 125 °C 1.E+01 T = 25 °C j Tj = 100 °C Tj = 75 °C 1.E+00 100 Tj = 50 °C 1.E-01 Tj = 25 °C 1.E-02 1.E-03 VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 Figure 9. Forward voltage drop versus forward current (low level) IF(A) 5.0 1 100 IF(A) Tj = 125 °C (maximum values) 45 Tj = 125 °C (maximum values) 4.0 10 Figure 10. Forward voltage drop versus forward current (high level) 50 4.5 V (V) R 10 60 40 3.5 35 Tj = 125 °C (typical values) 3.0 30 2.5 25 2.0 Tj = 125 °C (typical values) 20 Tj = 25 °C (maximum values) 1.5 Tj = 25 °C (maximum values) 15 1.0 10 0.5 5 V (V) F 0 0.0 0.0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMB) 200 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMB flat Notch) Rth(j-a) (°C/W) 200 V (V) F 0.2 Rth(j-a)(°C/W) Epoxy printed board FR4, copper thickness: 35 μm SMB SMB Flat Notch 150 150 100 100 50 50 S(Cu)(cm²) SCu (cm²) 0 0 0.0 0.5 DS2741 - Rev 5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 5/16 STPS5L60 Characteristics (curves) Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMC) Figure 14. Thermal resistance versus lead length Rth (°C/W) Rth(j-a) (°C/W) 160 90 DO-201AD Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm 140 R 80 SMC th(j - a) 70 120 60 100 50 80 40 60 Rth(j-l) 30 40 20 20 10 L leads (mm) SCu (cm²) 0 0.0 0.5 DS2741 - Rev 5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 5 10 15 20 25 page 6/16 STPS5L60 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB Flat Notch package information • • Epoxy meets UL94, V0 Lead-free package Figure 15. SMB Flat Notch package outline A DS2741 - Rev 5 V c L3 L2 G1 b D V1 G E E1 L1 L A1 page 7/16 STPS5L60 SMB Flat Notch package information Table 4. SMB Flat Notch mechanical data Dimensions Ref. Millimeters Min. A Typ. 0.90 A1 Inches Max. Min. 1.10 0.035 0.05 Typ. Max. 0.043 0.002 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.20 5.60 0.205 0.220 E1 4.05 4.60 0.159 0.181 G 2.00 0.079 G1 1.20 0.047 L 0.75 1.20 0.030 0.047 L1 0.30 0.012 L2 0.60 0.024 L3 0.02 0.001 V 8° 8° V1 8° 8° Figure 16. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS2741 - Rev 5 page 8/16 STPS5L60 SMB package information 2.2 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 17. SMB package outline E1 D E A1 C A2 L b Table 5. SMB package mechanical data Dimensions Millimeters Ref. DS2741 - Rev 5 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 page 9/16 STPS5L60 SMB package information Figure 18. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS2741 - Rev 5 page 10/16 STPS5L60 SMC package information 2.3 SMC package information • Epoxy meets UL94, V0 Figure 19. SMC package outline E1 D E A1 A2 b C L E2 Table 6. SMC package mechanical data Dimensions Ref. DS2741 - Rev 5 Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 2.90 3.20 0.1142 0.1260 c 0.15 0.40 0.0059 0.0157 D 5.55 6.25 0.2185 0.2461 E 7.75 8.15 0.3051 0.3209 E1 6.60 7.15 0.2598 0.2815 E2 4.40 4.70 0.1732 0.1850 L 0.75 1.50 0.0295 0.0591 page 11/16 STPS5L60 SMC package information Figure 20. SMC recommended footprint 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.323) millimeters (inches) DS2741 - Rev 5 page 12/16 STPS5L60 DO-201AD package information 2.4 DO-201AD package information • Epoxy meets UL 94, V0 Figure 21. DO-201AD package outline B A E Note 1 B E Note 1 ØD Note 2 ØC Table 7. DO-201AD package mechanical data Dimensions Millimeters Ref. Min. A B 25.40 Inches (for reference only) Typ. Max. - 9.50 - Min. 1.000 Typ. Max. - 0.374 - C - 5.30 - 0.209 D(1) - 1.30 - 0.051 E - 1.25 Note 2(2) 15.00 0.049 0.590 1. The lead diameter D is not controlled over zone E 2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”) DS2741 - Rev 5 page 13/16 STPS5L60 Ordering Information 3 Ordering information Table 8. Ordering information DS2741 - Rev 5 Order code Marking Package Weight Base qty. Delivery mode STPS5L60UFN B56 SMB Flat Notch 0.056 g 5000 Tape and reel STPS5L60U G56 SMB 0.107 g 2500 Tape and reel STPS5L60RL STPS5L60 Tape and reel STPS5L60 1.12 g 1900 STPS5L60L DO-201AD 600 Ammopack STPS5L60S S56 SMC 0.245 g 2500 Tape and reel page 14/16 STPS5L60 Revision history Table 9. Document revision history DS2741 - Rev 5 Date Version Changes July-2003 2 Previous issue. 16-May-2008 3 Added ECOPACK statement. Added SMC package. Updated characteristic curves. 17-Jul-2015 4 Added SMB package information and reformatted to current standard. 31-Jan-2020 5 Added Section 2.1 SMB Flat Notch package information. page 15/16 STPS5L60 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS2741 - Rev 5 page 16/16