STPS5L60UFN

STPS5L60 Power Schottky rectifier Features ● Negligible switching losses ● Low forward voltage drop for higher efficiency ● Low thermal resistance ● Avalanche capability specified A A K K Description Power Schottky rectifier suited for switch mode power supplies and high frequency inverters. This device is intended for use in low voltage output for small battery chargers and consumer SMPS such as DVD and set-top-box. May 2008 SMC STPS5L60S Table 1. Rev 3 DO-201AD STPS5L60 Device summary IF(AV) 5A VRRM 60 V Tj (max) 150 °C VF (max) 0.53 V 1/8 www.st.com 8 Characteristics STPS5L60 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) RMS forward current 15 A 5 A Tl = 100 °C δ = 0.5 SMC Tl = 100 °C δ = 0.5 Average forward current IFSM Surge non repetitive forward current Half wave, single phase tp = 10 ms 150 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 4000 W -65 to + 175 °C 150 °C 10000 V/µs Tstg Storage temperature range Maximum operating junction Tj dPtot --------------dTj temperature(1) Critical rate of rise of reverse voltage (rated VR, Tj = 25 °C) dV/dt 1. DO-201AD IF(AV) 1 - condition to avoid thermal runaway for a diode on its own heatsink < ------------------------Rth ( j – a ) Table 3. Thermal parameters Symbol Parameter Rth (j-a) Junction to ambient Rth (j-l) Junction to leads Rth (j-l) Junction to leads Table 4. Symbol Value 75 DO-201AD Lead length = 10mm VF (1) SMC 15 Static electrical characteristics Parameter Tests conditions Min. Typ. Reverse leakage current Forward voltage drop Max. 10 25 Tj = 125 °C 40 100 Tj = 25 °C 0.47 0.52 0.43 0.49 0.42 0.48 Tj = 100 °C Tj = 100 °C Unit 0.22 VR = VRRM IF = 5 A Tj = 125 °C 1. Pulse test : tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.39 x IF(AV) + 0.028x IF2(RMS) 2/8 °C/W 15 Tj = 25 °C IR (1) Unit mA V STPS5L60 Characteristics Figure 1. Conduction losses versus average Figure 2. current PF(av)(W) 3.5 δ = 0.05 δ = 0.1 δ = 0.2 6 δ = 0.5 Average forward current versus ambient temperature (δ = 0.5) IF(av)(A) Rth(j-a)=Rth(j-l) 3.0 5 δ=1 2.5 4 2.0 3 1.5 DO-201AD Rth(j-a)=75°C/W 2 1.0 T T SMC Rth(j-a)=90°C/W 1 0.5 IF(av)(A) δ=tp/T 0.0 0.0 0.5 1.0 1.5 Figure 3. 2.0 2.5 3.0 3.5 4.0 4.5 5.0 δ=tp/T tp 5.5 tp Tamb(°C) 0 0 6.0 Normalized avalanche power derating versus pulse duration 25 Figure 4. 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM (t j ) PARM (25°C) PARM(tp) PARM(1µs) 1 1 0.1 0.01 0.01 0.1 Figure 5. 16 Tj (°C) tp(µs) 0.001 1 0 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values) DO-201AD 25 50 Figure 6. IM(A) 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) SMC IM(A) DO-201AD 14 14 SMC 12 12 10 Ta=25 °C 10 Ta=25 °C 8 8 Ta=75 °C 6 Ta=75 °C 6 4 4 Ta=125 °C IM 2 t(s) 1.E-02 IM t δ =0.5 t δ =0.5 0 1.E-03 Ta=125 °C 2 1.E-01 1.E+00 0 1.E-03 t(s) 1.E-02 1.E-01 1.E+00 3/8 Characteristics Figure 7. STPS5L60 Relative variation of thermal impedance junction to ambient versus pulse duration, DO-201AD Figure 8. Zth(j-a)/Rth(j-a) Zth(j-a)/Rth(j-a) 1.0 1.0 0.9 0.9 0.8 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 SMC 0.8 DO-201AD 0.7 0.1 tp(s) tp(s) 0.0 0.0 1.E-01 1.E+00 Figure 9. 1.E+03 Relative variation of thermal impedance junction to ambient versus pulse duration, SMC 1.E+01 1.E+02 1.E+03 Reverse leakage current versus reverse voltage applied (typical values) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 10. Junction capacitance versus reverse voltage applied (typical values) IR(mA) 1000 C(pF) F=1MHz Vosc=30mV Tj=25°C Tj=150°C 1.E+02 Tj=125°C 1.E+01 Tj=100°C Tj=75°C 1.E+00 Tj=50°C 1.E-01 Tj=25°C 1.E-02 VR(V) VR(V) 100 1.E-03 0 4/8 5 10 15 20 25 30 35 40 45 50 55 60 1 10 100 STPS5L60 Characteristics Figure 11. Forward voltage drop versus forward current (low level) 5.0 Figure 12. Forward voltage drop versus forward current (high level) IFM(A) IFM(A) 50 Tj=125°C (Maximum values) 45 4.5 Tj=125°C (Maximum values) 4.0 40 35 3.5 Tj=125°C (Typical values) 30 Tj=125°C (Typical values) 3.0 2.5 25 2.0 20 Tj=25°C (Maximum values) 1.5 Tj=25°C (Maximum values) 15 1.0 10 0.5 5 VFM(V) 0.0 VFM(V) 0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, Cu = 35 µm), DO-201AD Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, Cu = 35 µm) SMC Rth(j-a)(°C/W) 80 100 Rth(j-a)(°C/W) DO-201AD SMC 90 0.2 70 80 60 70 50 60 (j ) 50 40 40 30 30 20 20 10 10 SCU(cm²) 0.0 0.5 1.0 1.5 2.0 S(cm²) 0 0 2.5 3.0 3.5 4.0 4.5 0 5.0 1 2 3 4 5 6 7 8 9 10 Figure 15. Thermal resistances versus leads length DO-201AD Rth(°C/W) 80 70 Rth(j-a): Epoxy printed circuit board FR4 (Cu=35µm) 60 50 40 30 Rth(j-l) 20 10 Lleads(cm) 0 5 10 15 20 25 5/8 Package information 2 STPS5L60 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 5. SMC dimensions Dimensions Ref. E1 D A1 A2 C E2 L b Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b(1) 2.90 3.20 0.114 0.126 (1) 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.059 1. Dimensions b and c apply to plated leads Figure 16. Footprint, dimensions in mm (inches) 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.322) 6/8 Inches Min. c E Millimeters STPS5L60 Ordering information Figure 17. Package mechanical data DO-201AD plastic Dimensions REF. Millimeters Min. B B A E Note 1 E Note 1 A B ØD Note 2 Max. Inches Min. 9.50 25.40 Max. 0.374 1.000 ∅C 5.30 0.209 ∅D 1.30 0.051 E 1.25 0.049 ØC Notes 1-The lead diameter ∅D is not controlled over zone E 2 - The minimum axial length within which the device may be placed with its leads bent at right angles is 0.59" (15 mm) 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS5L60 STPS5L60 D0-201AD 1.12 g 600 Ammopack STPS5L60RL STPS5L60 D0-201AD 1.12 g 1900 Tape and reel STPS5L60S S56 SMC 0.245 g 2500 Tape and reel Revision history Table 7. Document revision history Date Revision Description of changes July-2003 2 Previous issue. 16-May-2008 3 Added ECOPACK statement. Added SMC package. Updated characteristic curves. 7/8 STPS5L60 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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