STPS630CSFY

STPS630CSFY Datasheet Automotive 30 V, dual 3 A power Schottky rectifier Features • • • • AEC-Q101 qualified PPAP capable 150 °C maximum operation junction temperature VRRM guaranteed from -40 °C to 150 °C • • High surge current capability ECOPACK2 compliant component Application • • • Reverse polarity protection in E.C.U DC/DC converters Freewheeling diodes Description The STPS630CSFY has been developed for applications requiring an optimized VF and leakage current characteristics. These characteristics make it ideal for use in secondary rectification functions, such as DC/DC converters or freewheeling functions. Product status link STPS630CSFY Product summary Symbol Value IF(AV) 2X3A VRRM 30 V Tj (max.) 150 °C VF (typ.) 0.32 V DS13539 - Rev 1 - October 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPS630CSFY Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values per diode at 25 °C, unless otherwise specified) Symbol Parameter Value Unit 30 V VRRM Repetitive peak reverse voltage (Tj = -40 °C to +150 °C) IF(AV) Average forward current, δ = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 120 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 60 W Storage temperature range -65 to +175 °C Operating junction temperature range(1) -40 to +150 °C Tstg Tj Per diode Tc = 140 °C 3 Per device Tc = 140 °C 6 A 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case total Typ. Unit 1.50 °C/W For more information, please refer to the following application note: • AN5088: Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics (per diode) Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 3 A IF = 4 A IF = 6 A Min. Typ. - Max. Unit 95 µA mA - 20 35 - 0.41 0.45 - 0.32 0.37 - 0.43 0.47 - 0.35 0.40 - 0.47 0.52 - 0.41 0.47 V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.23 x IF(AV) + 0.047 x IF2(RMS) For more information, please refer to the following application notes related to the power losses: • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses in a power diode DS13539 - Rev 1 page 2/9 STPS630CSFY Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward current versus case temperature (δ = 0.5, per diode) Figure 2. Relative variation of thermal impedance junction to case versus pulse duration IF(AV)(A) Zth(j-c) /Rth(j-c) 1.0 20 0.9 0.8 15 0.7 0.6 0.5 10 0.4 0.3 T 5 0.2 δ=tp/T Single pulse 0.1 T c(°C) tp t P(s) 0.0 0 0 25 50 75 100 125 150 Figure 3. Reverse leakage current versus reverse voltage applied (typical values, per diode) 1.E-04 1.E-01 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 125 °C 1.E+01 1.E+00 C(pF) 1000 Tj = 150 °C 1.E-02 Figure 4. Junction capacitance versus reverse voltage applied (typical values, per diode) IR(mA) 1.E+02 1.E-03 Tj = 100 °C 1.E+00 Tj = 75 °C 100 Tj = 50 °C 1.E-01 Tj = 25 °C 1.E-02 VR(V) 1.E-03 0 5 10 15 20 25 30 Figure 5. Forward voltage drop versus forward current (typical values, per diode) 10.0 VR(V) 10 1 10 100 Figure 6. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) IF(A) 1 Tj = 25 °C Tj = 75 °C Tj = 125 °C 0.1 Tj = 150 °C 1.0 0.01 Tj = -40 °C VF(V) 0.1 0.0 DS13539 - Rev 1 0.1 0.2 0.3 0.4 0.5 0.6 0.001 t p(µs) 1 10 100 1000 page 3/9 STPS630CSFY Characteristics (curves) Figure 7. Thermal resistance junction to ambient versus copper surface under tab (typical values, epoxy printed board FR4, eCu = 70 µm) (PSMC (TO-277A)) Rth(j-a)(°C/W) 120 Epoxy printed circuit board, copper thickness = 70 µm PSMC (TO-277A) 100 80 60 40 20 SCU(cm²) 0 0 DS13539 - Rev 1 1 2 3 4 5 6 7 8 9 10 page 4/9 STPS630CSFY Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 PSMC (TO-277A) package information • • Epoxy meets UL94,V0 Cooling method : by conduction (C) Figure 8. PSMC (TO-277A) package outline DS13539 - Rev 1 page 5/9 STPS630CSFY PSMC (TO-277A) package information Table 4. PSMC (TO-277A) package mechanical data Dimensions Millimeters Ref. Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 1.00 1.10 1.20 0.039 0.043 0.047 b 1.05 1.20 1.35 0.041 0.047 0.053 b2 1.90 2.05 2.20 0.075 0.081 0.087 b4 0.75 0.029 C 0.15 0.23 0.40 0.006 0.009 0.016 D 4.45 4.60 4.75 0.175 0.181 0.187 D1 4.25 4.40 4.45 0.167 0.173 0.175 D2 3.40 3.60 3.70 0.134 0.142 0.146 E 6.35 6.50 6.65 0.250 0.256 0.262 E1 6.05 6.10 6.15 0.238 0.240 0.242 E2 4.50 4.60 4.70 0.177 0.181 0.185 E3 3.94 1.55 e 2.13 0.084 e1 3.33 0.131 G 1.20 0.047 G1 0.70 0.027 L 0.90 1.05 1.24 0.035 L4 0.02 0.0008 L5 0.02 0.0008 0.041 0.049 Figure 9. PSMC (TO-277A) package footprint in mm (in inches) Note: DS13539 - Rev 1 For package and tape orientation, reel and inner box dimensions and tape outline please check TN1173 page 6/9 STPS630CSFY Ordering information 3 Ordering information Table 5. Ordering information DS13539 - Rev 1 Order code Marking Package Weight Base qty. Delivery mode STPS630CSFY PS630CY PSMC (TO-277A) 90 mg 6000 Tape and Reel page 7/9 STPS630CSFY Revision history Table 6. Document revision history DS13539 - Rev 1 Date Version 26-Oct-2020 1 Changes Initial release. page 8/9 STPS630CSFY IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS13539 - Rev 1 page 9/9