STPS6M100SF

STPS6M100SF Datasheet 100 V power Schottky rectifier Features • • • • Low profile design – package height of 1.1 mm typ. Wettable flanks for automatic visual inspection Low forward voltage drop Avalanche capability • ECOPACK®2 compliant Applications • • • • Switching diode Notebook adapter LED lighting DC/DC converter Description This high voltage Schottky barrier rectifier has been optimized for use in high frequency miniature DC/DC converters, reverse battery protection, battery chargers and adaptors. Packaged in PSMC (TO-277A), the STPS6M100SF provides a high level of performance in a compact and flat package which can withstand very high operating junction temperature. Product status link STPS6M100SF Product summary Symbol Value IF(AV) 6A VRRM 100 V Tj (max.) 175 °C VF (typ.) 0.57 V DS12699 - Rev 1 - July 2018 For further information contact your local STMicroelectronics sales office. www.st.com STPS6M100SF Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified, anode terminals shortcircuited) Symbol Parameter Value Unit 100 V 6 A VRRM Repetitive peak reverse voltage IF(AV) Average forward current, δ = 0.5 square wave Tc = 155 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 200 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 480 W -65 to +175 °C +175 °C Tstg Storage temperature range Tj Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case Typ. value Unit 2.1 °C/W For more information, please refer to the following application note: • AN5088: Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics (anode terminals short-circuited) Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 3 A IF = 6 A Min. Typ. - 5 - Unit 35 µA 15 mA 0.66 0.50 - Max. 0.57 0.80 0.57 V 0.65 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.49 x IF(AV) + 0.0267 x IF2(RMS) For more information, please refer to the following application notes related to the power losses: • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses in a power diode DS12699 - Rev 1 page 2/9 STPS6M100SF Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Relative variation of thermal impedance junction to case versus pulse duration Figure 1. Average forward current versus case temperature (δ = 0.5) IF(AV)(A) Zth(j-c) /Rth(j-c) 1.0 35 0.9 30 0.8 25 0.7 0.6 20 0.5 15 0.4 10 0.3 T Single pulse 0.2 5 δ=tp/T T c(°C) 0 0 25 t P(s) 0.1 tp 50 75 100 125 150 175 Figure 3. Reverse leakage current versus reverse voltage applied (typical values) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 4. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1000 1.E+05 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C 1.E+04 Tj=150°C Tj=125°C 1.E+03 Tj=100°C 1.E+02 100 Tj=75°C Tj=50°C 1.E+01 Tj=25°C 1.E+00 VR(V) VR(V) 1.E-01 0 DS12699 - Rev 1 10 20 30 40 50 60 70 80 90 10 100 1 10 100 page 3/9 STPS6M100SF Characteristics (curves) Figure 5. Forward voltage drop versus forward current (typical values) Figure 6. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) IF(A) 100.0 1 PARM (t p ) PARM (10 µs) 10.0 0.1 Tj=25°C 1.0 0.01 Tj=75°C Tj=125°C Tj=150°C VF(V) 0.1 0.001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t p(µs) 1 10 100 1000 Figure 7. Thermal resistance junction to ambient versus copper surface under tab (typical values, epoxy printed board FR4, eCu = 35 µm) (PSMC (TO-277A)) 120 Rth(j-a) (°C/W) PSMC (TO-277A) 100 80 60 40 20 SCu (cm²) 0 0 DS12699 - Rev 1 1 2 3 4 5 6 7 8 9 10 page 4/9 STPS6M100SF Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 PSMC (TO-277A) package information • • Epoxy meets UL94,V0 Cooling method : by conduction (C) Figure 8. PSMC (TO-277A) package outline Table 4. PSMC (TO-277A) package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 1.00 1.10 1.20 0.039 0.043 0.047 b 1.05 1.20 1.35 0.041 0.047 0.053 b2 1.90 2.05 2.20 0.075 0.081 0.087 b4 0.75 0.029 C 0.15 0.23 0.40 0.006 0.009 0.016 D 4.45 4.60 4.75 0.175 0.181 0.187 D1 4.25 4.40 4.45 0.167 0.173 0.175 D2 3.40 3.60 3.70 0.134 0.142 0.146 DS12699 - Rev 1 page 5/9 STPS6M100SF PSMC (TO-277A) package information Dimensions Ref. Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. E 6.35 6.50 6.65 0.250 0.256 0.262 E1 6.05 6.10 6.15 0.238 0.240 0.242 E2 4.50 4.60 4.70 0.177 0.181 0.185 E3 3.94 1.55 e 2.13 0.084 e1 3.33 0.131 G 1.20 0.047 G1 0.70 0.027 L 0.90 1.05 1.24 0.035 L4 0.02 0.0008 L5 0.02 0.0008 0.041 0.049 Figure 9. PSMC (TO-277A) package footprint in mm (in inches) DS12699 - Rev 1 page 6/9 STPS6M100SF Ordering information 3 Ordering information Table 5. Ordering information DS12699 - Rev 1 Order code Marking Package Weight Base qty. Delivery mode STPS6M100SF PS6M100 PSMC (TO-277A) 90 mg 6000 Tape and Reel page 7/9 STPS6M100SF Revision history Table 6. Document revision history DS12699 - Rev 1 Date Version 30-Jul-2018 1 Changes Initial release. page 8/9 STPS6M100SF IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS12699 - Rev 1 page 9/9