STPS745FP

STPS745 Power Schottky rectifier Datasheet - production data Features K A TO-220AC K     K K A A NC A NC D2PAK   Very small conduction losses Negligible switching losses Extremely fast switching Insulated package: TO-220FPAC  Insulating voltage = 2000 VRMS sine Avalanche capability specified ECOPACK®2 compliant component for D²PAK on demand Description Single Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. A TO-220FPAC K Packaged either in TO-220AC, TO-220FPAC or D2PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Table 1: Device summary May 2015 DocID3516 Rev 8 This is information on a product in full production. Symbol Value IF(AV) 7.5 A VRRM 45 V Tj (max) 175 °C VF (typ) 0.5 V 1/14 www.st.com Characteristics 1 STPS745 Characteristics Table 2: Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 20 A 7.5 A TO-220AC / D2PAK TC = 160 °C TO-220FPAC TC = 145 °C IF(AV) Average forward current δ = 0.5, square wave IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 150 A PARM Repetitive peak avalanche power tp = 10 µs, Tj= 125 °C 190 W -65 to + 175 °C + 175 °C Tstg Storage temperature range Maximum operating junction temperature Tj (1) Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameter Symbol Parameter TO-220AC / Rth(j-c) Junction to case Value D2PAK Unit 3.0 °C/W TO-220FPAC 5.5 Table 4: Static electrical characteristics Symbol IR(1) VF (1) Parameter Test conditions Reverse leakage current Forward voltage drop Tj = 25 °C Tj = 125 °C VR = VRRM 2/14 µA mA 0.5 0.57 IF = 15 A - Tj = 125 °C IF = 15 A - DocID3516 Rev 8 100 15 Tj = 25 °C P = 0.42 x IF(AV) + 0.020 IF2(RMS) Unit 5 - To evaluate the conduction losses use the following equation: Max. - IF = 7.5 A test: tp = 380 µs, δ < 2% Typ. - Tj = 125 °C Notes: (1)Pulse Min. 0.84 0.65 0.72 V STPS745 Characteristics 1.1 Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current Figure 2: Average forward current versus ambient temperature (δ= 0.5) IF(AV) (A) PF(AV) (W) 9 6 δ = 0.1 δ = 0.2 δ = 0.5 8 δ = 0.05 5 R th(j-a )=R th(j-c) TO-220 AC 7 TO-220F PAC δ= 1 4 6 R th(j-a) =15°C/W 5 3 R th(j-a) =40°C/W 4 2 3 T T 2 1 δ=tp/T IF(AV) (A) 1 tp δ=tp/T 0 0 0 1 2 3 4 5 6 7 8 9 Figure 3: Normalized avalanche power derating versus pulse duration (Tj= 125 °C) 1 0 10 Tamb (°C) tp 25 50 75 100 125 150 175 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC and D²PAK) PARM(t p ) PARM(10 µs) Zth(j-c ) /Rth(j-c) 1.0 0.8 0.1 0.6 δ = 0.5 0.4 0.01 δ = 0.2 T δ = 0.1 0.2 t p(s) t p (µs) 0.001 1 10 100 1000 Figure 5: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC) Single pulse 0.0 1E-4 1E-3 δ=tp/T 1E-2 tp 1E-1 1E+0 Figure 6: Reverse leakage current versus reverse voltage applied (typical values) IR(µA) Z th(j-c ) /Rth(j-c) 5E+4 1.0 T j=150°C 1E+4 T j=125°C 0.8 0.6 1E+3 δ = 0.5 T j=100°C T j=75°C 1E+2 T j=50°C 0.4 1E+1 δ = 0.2 0.2 T j=25°C T δ = 0.1 1E+0 t p(s) Single pulse 0.0 1E-3 1E-2 1E-1 δ=tp/T 1E+0 VR(V) tp 1E-1 1E+1 DocID3516 Rev 8 0 5 10 15 20 25 30 35 40 3/14 45 Characteristics STPS745 Figure 7: Junction capacitance versus reverse voltage applied (typical values) Figure 8: Forward voltage drop versus forward current (maximum values) C(pF) 1000 F=1MHz V OS C =30mV RMS T j=25°C 500 200 VR (V) 100 1 2 5 10 20 50 Figure 9: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, eCu: 35 µm) 80 D²PAK 70 Rth(j-a)(°C/W) 60 50 40 30 20 10 0 0 5 10 15 20 SCu(cm²) 4/14 DocID3516 Rev 8 25 30 35 40 STPS745 2 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 Nm (for TO-220AC and TO-220FPAC) Maximum torque value: 0.70 Nm (for TO-220AC and TO-220FPAC) DocID3516 Rev 8 5/14 Package information 2.1 STPS745 D²PAK package information Figure 10: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 6/14 DocID3516 Rev 8 STPS745 Package information Table 5: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 0.4 typ. 0° 0.015 8° DocID3516 Rev 8 0° 8° 7/14 Package information STPS745 Figure 11: D²PAK recommended footprint (dimensions in mm) 8/14 DocID3516 Rev 8 STPS745 2.2 Package information TO-220AC package information Figure 12: TO-220AC package outline DocID3516 Rev 8 9/14 Package information STPS745 Table 6: TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.107 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 L7 6.20 L9 3.50 M Diam 10/14 Inches 6.60 0.244 3.93 0.137 2.6 typ. 3.75 0.620 0.259 0.154 0.102 typ. 3.85 DocID3516 Rev 8 0.147 0.151 STPS745 2.3 Package information TO-220FPAC package information Figure 13: TO-220FPAC package outline A B H Dia L6 L2 L7 L3 L5 F1 D L4 F E G1 G DocID3516 Rev 8 11/14 Package information STPS745 Table 7: TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 12/14 Inches 16 typ. 0.108 0.63 typ. L3 28.6 30.6 0.126 L4 9.8 10.6 0.386 1.205 0.417 0.142 L5 2.9 3.6 0.114 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 DocID3516 Rev 8 STPS745 3 Ordering information Ordering information Table 8: Ordering information Order code 4 Marking Package Weight Base qty. Delivery mode STPS745D STPS745D TO-220AC 1.86g 50 Tube STPS745G-TR STPS745G D2PAK 1.38g 1000 Tape and reel STPS745FP STPS745FP TO-220FPAC 1.9g 50 Tube Revision history Table 9: Document revision history Date Revision Jul-2003 6 Last release 22-Mar-2007 7 Removed ISOWATT package. 8 Updated features, packages silhouette and Table 1: "Device summary" in cover page. Updated Table 2: "Absolute ratings (limiting values, at 25 °C, unless otherwise specified)" and Section 1.1: "Characteristics (curves)". Minor text changes. 29-May-2015 Changes DocID3516 Rev 8 13/14 STPS745 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 14/14 DocID3516 Rev 8