STPS8170DEE-TR

STPS8170DEE Datasheet 170 V, 8 A power Schottky rectifier Features • • • • • • • Very low conduction losses Negligible switching losses Extremely fast switching Low thermal resistance Avalanche capacity specified High junction temperature capability ECOPACK2 compliant Application Product status link STPS8170DEE Product summary Symbol Value IF(AV) 8A VRRM 170 V Tj (max.) 175 °C VF (typ.) 0.66 V • • • • • • • Cordless appliance SSD Battery charger Telecom power DC / DC converter Polarity protection Freewheeling Description This Schottky rectifier is designed for switch mode power supply and high frequency DC to DC converters. Packaged in PowerFLAT, this device is intended for use in low voltage, high frequency, inverters, free-wheeling, by-pass diode and polarity protection applications.Its low profile was especially designed to be used in applications with space-saving constraints. DS9072 - Rev 2 - May 2022 For further information contact your local STMicroelectronics sales office. www.st.com STPS8170DEE Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 170 V IF(RMS) Forward rms current 15 A 8 A IF(AV) Average forward current, δ = 0.5 square wave Tc = 145 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 100 A PARM Repetitive peak avalanche power Tc = 125 °C 400 W -65 to +175 °C +175 °C Tstg Tj tp = 10 µs Storage temperature range Maximum operating junction temperature Table 2. Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case Max. value Unit 4 °C/W Max. Unit 15 µA 15 mA For more information, please refer to the following application note: • AN5088: Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter IR1 Reverse leakage current VF2 Forward voltage drop Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 8 A Min. Typ. - 1.5 - 0.90 0.66 0.72 V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.62 x IF(AV) + 0.0125 x IF2(RMS) For more information, please refer to the following application notes related to the power losses: • • DS9072 - Rev 2 AN604: Calculation of conduction losses in a power rectifier AN4021: Calculation of reverse losses in a power diode page 2/9 STPS8170DEE Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature(δ = 0.5) Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Relative variation of thermal impedance junction to case versus pulse duration 1 PARM (t p ) PARM (10 µs) 0.1 0.01 t p(µs) 0.001 1 10 100 1000 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) DS9072 - Rev 2 Figure 6. Junction capacitance versus reverse voltage applied (typical values) page 3/9 STPS8170DEE Characteristics (curves) Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus copper surface under tab Rth(j-a) (°C/W) 250 PowerFLAT (3.3x3.3) epoxy printed board FR4, copper thickness=35µm 200 150 100 50 SCu (cm²) 0 0 DS9072 - Rev 2 1 2 3 4 5 6 7 8 9 10 page 4/9 STPS8170DEE Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 PowerFLAT 3.3x3.3 mm package information Figure 9. PowerFLAT 3.3x3.3 mm package outline Table 4. PowerFLAT 3.3x3.3 mm mechanical data Dimensions Millimeters Ref. Min. A 0.90 A3 DS9072 - Rev 2 Typ. Max. 1.10 0.20 b 0.29 0.44 D 3.20 3.40 D2 1.61 1.82 E 3.20 3.40 E2 2.19 2.39 E3 1.54 1.74 e 0.55 0.75 L 0.30 0.50 L1 0.50 0.70 page 5/9 STPS8170DEE PowerFLAT 3.3x3.3 mm package information Figure 10. Recommended footprint (dimensions are in mm) DS9072 - Rev 2 page 6/9 STPS8170DEE Ordering information 3 Ordering information Table 5. Ordering information DS9072 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode STPS8170DEE-TR PS8170 PowerFLAT 3.3 x 3.3 34 mg 3000 Tape and 13" reel page 7/9 STPS8170DEE Revision history Table 6. Document revision history DS9072 - Rev 2 Date Revision Changes 09-Sep-2012 1 First issue. 18-May-2022 2 Updated package outline PowerFLAT 3.3 x 3.3. page 8/9 STPS8170DEE IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS9072 - Rev 2 page 9/9