STPSC10H065DI

STPSC10H065 Datasheet 650 V, 10 A high surge silicon carbide power Schottky diode A Features K K A K TO-220AC A K TO-220AC insulated K K A No reverse recovery charge in application current range Switching behavior independent of temperature High forward surge capability Insulated package TO-220AC Ins: – Insulated voltage: 2500 VRMS • – Typical package capacitance: 7 pF Power efficient product • ECOPACK®2 compliant component A NC NC D²PAK • • • • DPAK Applications • • • • • Switch mode power supply PFC DCDC converters LLC topologies Boost diode Description This 10 A, 650 V SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide band gap material allows the design of a Schottky diode structure with a 650 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. Product status STPSC10H065 Product summary Symbol Value IF(AV) 10 A VRRM 650 V Tj(max.) 175 °C This STPSC10H065 is especially suited for use in PFC applications. This ST SiC diode will boost the performance in hard switching conditions. Its high forward surge capability ensures a good robustness during transient phases. Product label DS9226 - Rev 8 - January 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPSC10H065 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 650 V IF(RMS) Forward rms current 22 A 10 A 41 A IF(AV) Average forward current IFRM Repetitive peak forward current IFSM Tstg Tj TO-220AC, DPAK, D²PAK, TC = 135 °C, DC (1) TO-220AC Ins, TC = 85 °C, DC(1) TO-220AC, DPAK, D²PAK, Tc = 135 °C, Tj = 175 °C, δ = 0.1(1) TO-220AC Ins, Tc = 85 °C, Tj = 175 °C, δ = 0.1(1) Surge non repetitive forward current tp = 10 ms sinusoidal, Tc = 25 °C 90 tp = 10 ms sinusoidal, Tc = 125 °C 80 tp = 10 µs square, Tc = 25 °C 470 Storage temperature range Operating junction temperature range(2) A -55 to +175 °C -40 to +175 °C 1. Value based on Rth(j-c) max. 2. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case Typ. value Max. value TO-220AC, DPAK, D²PAK 1.25 1.5 TO-220AC Ins. 2.1 3.5 Unit °C/W Table 3. Static electrical characteristics Symbol Parameter IR (1) Reverse leakage current VF (2) Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 10 A Min. Typ. Max. - 9 100 - 85 425 - 1.56 1.75 - 1.98 2.5 Unit µA V 1. Pulse test: tp = 10 ms, δ < 2% 2. Pulse test: tp = 500 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 1.35 x IF(AV) + 0.115 x IF 2 (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS9226 - Rev 8 page 2/17 STPSC10H065 Characteristics Table 4. Dynamic electrical characteristics Symbol QCj (1) Cj Parameter Total capacitive charge Total capacitance Test conditions Typ. Unit VR = 400 V 28.5 nC VR = 0 V, Tc = 25 °C, F = 1 MHz 480 VR = 400 V, Tc = 25 °C, F = 1 MHz 48 pF 1. Most accurate value for the capacitive charge: V Qcj =  ∫0 OUT C J VR • dVR DS9226 - Rev 8 (1) page 3/17 STPSC10H065 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Forward voltage drop versus forward current (typical values, low level) 20 IF(A) 18 Figure 2. Forward voltage drop versus forward current (typical values, high level) 100 Pulse test : tp=500µs Pulse test : tp=500µs 90 16 80 Ta=25 °C 14 12 70 Ta=150 °C Ta=100 °C 10 60 40 6 30 4 20 2 0.5 1.0 1.5 2.0 2.5 3.0 Ta=100 °C Ta=150 °C 10 VF (V) 0 0.0 Ta=25 °C 50 Ta=175 °C 8 Ta=175 °C VF (V) 0 3.5 Figure 3. Reverse leakage current versus reverse voltage applied (typical values) 1.E+03 IF(A) 0 1 2 3 4 5 6 7 8 Figure 4. Peak forward current versus case temperature (TO-220AC, DPAK, D²PAK) IR(µA) Tj=175 °C 1.E+02 Tj=150 °C 1.E+01 1.E+00 1.E-01 Tj=25 °C VR(V) 1.E-02 0 DS9226 - Rev 8 50 100 150 200 250 300 350 400 450 500 550 600 650 page 4/17 STPSC10H065 Characteristics (curves) Figure 5. Peak forward current versus case temperature (TO-220AC Ins) Figure 6. Junction capacitance versus reverse voltage applied (typical values) 500 Cj(pF) F=1 MHz VOSC=30 mVRMS Tj=25 °C 450 400 350 300 250 200 150 100 50 VR(V) 0 0.1 1 .0 10.0 100.0 1000.0 Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK and to case versus pulse duration (TO-220AC Ins) D²PAK) 1.0 1.0 Zth(j-c) /Rth(j-c) 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 Zth(j-c) /Rth(j-c) Single pulse 0.0 1.E-05 DS9226 - Rev 8 1.E-04 1.E-03 1.E-02 1.E-01 Single pulse 0.1 t p (s) 1.E+00 0.0 1.E-04 t p (s) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 page 5/17 STPSC10H065 Characteristics (curves) Figure 10. Total capacitive charges versus reverse voltage applied (typical values) Figure 9. Non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) 1.E+03 IFSM(A) 32 Qcj(nC) 28 Ta=25 °C 24 20 Ta=125 °C 1.E+02 16 12 8 4 VR (V) t p (s) 1.E+01 1.E-05 0 1.E-04 1.E-03 1.E-02 0 50 100 150 200 250 300 350 400 Figure 11. Thermal resistance junction to ambient versus copper surface under tab for D²PAK package (typical values) 80 Rth(j-a) (°C/W) D²PAK 70 Epoxy printed board FR4, copper thickness = 35 µm 60 50 40 30 20 10 SCu (cm²) 0 0 DS9226 - Rev 8 5 10 15 20 25 30 35 40 page 6/17 STPSC10H065 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 DPACK package information • Epoxy meets UL94, V0 Figure 12. DPAK package outline A E c2 b4 E1 L2 D1 H D L4 A1 b (2x) e R e1 c Seating plane A2 (L1) L V2 0.25 DS9226 - Rev 8 Gauge plane page 7/17 STPSC10H065 DPAK package information Table 5. DPAK mechanical data Dimensions Dim. Inches(1) Millimeters Min. Typ. Max. Min. Typ. Max. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 5.20 5.40 0.205 0.213 c 0.45 0.60 0.018 0.024 c2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 D1 4.95 5.25 0.195 E 6.40 6.60 0.252 E1 4.60 4.70 4.80 0.181 0.185 0.189 e 2.159 2.286 2.413 0.085 0.090 0.095 e1 4.445 4.572 4.699 0.175 0.180 0.185 H 9.35 10.10 0.368 0.398 L 1.00 1.50 0.039 0.059 (L1) 2.60 2.80 3.00 0.102 0.110 0.118 L2 0.65 0.80 0.95 0.026 0.031 0.037 L4 0.60 1.00 0.024 R V2 5.10 0.201 0.207 0.260 0.039 0.20 0.008 0° 8° 0° 8° 1. Inches dimensions given for reference only Figure 13. DPAK recommended footprint (dimensions are in mm) 6.3 6.1 10.7 2.8 1.8 min. B 1.5 4.572 A The device must be positioned within DS9226 - Rev 8 page 8/17 STPSC10H065 D²PAK package information 2.2 D²PAK package information • • Epoxy meets UL94, V0. Cooling method: by conduction (C) Figure 14. D²PAK package outline Note: DS9226 - Rev 8 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 9/17 STPSC10H065 D²PAK package information Table 6. D²PAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A1 0.03 0.23 0.001 0.009 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.053 D 8.95 9.35 0.352 0.368 D1 7.50 7.75 8.00 0.295 0.305 0.315 D2 1.10 1.30 1.50 0.043 0.051 0.060 E 10.00 10.40 0.394 E1 8.30 8.50 8.70 0.335 0.343 0.346 E2 6.85 7.05 7.25 0.266 0.278 0.282 e 2.54 0.409 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.69 0.097 0.106 L 2.29 2.79 0.090 0.110 L1 1.27 1.40 0.049 0.055 L2 1.30 1.75 0.050 0.069 R V2 0.40 0° 0.015 8° 0° 8° Figure 15. D²PAK recommended footprint (dimensions are in mm) Footprint_26 DS9226 - Rev 8 page 10/17 STPSC10H065 TO-220AC package information 2.3 TO-220AC package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 16. TO-220AC package outline A H2 0.10 ØI C Gate note (1)(2) L5 L7 L6 L2 F1 D L9 Gate note (1)(2) L4 F M G E (1) :Max resin gate protusion 0.5 mm (2) :Resin gate position is accepted in each of the two positions shown on the drawings or their symmetrical DS9226 - Rev 8 page 11/17 STPSC10H065 TO-220AC package information Table 7. TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam DS9226 - Rev 8 Inches (for reference only) 2.60 typ. 3.75 0.102 typ. 3.85 0.147 0.151 page 12/17 STPSC10H065 TO-220AC Ins. package information 2.4 TO-220AC Ins. package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 17. TO-220AC Ins. package outline C B ØI b2 L F A I4 c2 a1 l2 a2 M b1 c1 e DS9226 - Rev 8 page 13/17 STPSC10H065 TO-220AC Ins. package information Table 8. TO-220AC Ins. package mechanical data Dimensions Ref. Millimeters Min. A 15.20 a1 Max. Min. 15.90 0.598 3.75 Typ. Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 F 6.20 6.60 0.244 0.259 L 2.65 2.95 0.104 0.116 I2 1.14 1.70 0.044 0.066 I4 15.80 16.80 0.622 M ØI DS9226 - Rev 8 Typ. Inches (for reference only) 16.40 2.60 3.75 0.645 0.661 0.102 3.85 0.147 0.151 page 14/17 STPSC10H065 Ordering information 3 Ordering information Table 9. Ordering information DS9226 - Rev 8 Order code Marking Package Weight Base qty. Delivery mode STPSC10H065G-TR STPSC10H065G D²PAK 1.48 g 1000 Tape and reel STPSC10H065D STPSC10H065D TO-220AC 1.86 g 50 Tube STPSC10H065DI STPSC 10H065DI TO-220AC Ins. 2.12 g 50 Tube STPSC10H065B-TR PSC10 H065 DPAK 0.32 g 2500 Tape and reel page 15/17 STPSC10H065 Revision history Table 10. Document revision history DS9226 - Rev 8 Date Revision Changes 31-Aug-2012 1 First issue. 10-Oct-2012 2 Added Max. value to Table 3. 07-Nov-2013 3 Updated Figure 1, Figure 2, Figure 13, Figure 14 and Table 8. 07-Jan-2014 4 Added TO-220AC Ins package. 22-Jul-2015 5 Updated Table 10 and reformatted to current standard. 10-Dec-2015 6 Inserted package name on cover page. 26-Jan-2017 7 Updated D²PAK package information. 09-Jan-2020 8 Updated Features. page 16/17 STPSC10H065 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 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