STPSC10H065
Datasheet
650 V, 10 A high surge silicon carbide power Schottky diode
A
Features
K
K
A
K
TO-220AC
A
K
TO-220AC insulated
K
K
A
No reverse recovery charge in application current range
Switching behavior independent of temperature
High forward surge capability
Insulated package TO-220AC Ins:
–
Insulated voltage: 2500 VRMS
•
–
Typical package capacitance: 7 pF
Power efficient product
•
ECOPACK®2 compliant component
A
NC
NC
D²PAK
•
•
•
•
DPAK
Applications
•
•
•
•
•
Switch mode power supply
PFC
DCDC converters
LLC topologies
Boost diode
Description
This 10 A, 650 V SiC diode is an ultrahigh performance power Schottky diode. It is
manufactured using a silicon carbide substrate. The wide band gap material allows
the design of a Schottky diode structure with a 650 V rating. Due to the Schottky
construction, no recovery is shown at turn-off and ringing patterns are negligible. The
minimal capacitive turn-off behavior is independent of temperature.
Product status
STPSC10H065
Product summary
Symbol
Value
IF(AV)
10 A
VRRM
650 V
Tj(max.)
175 °C
This STPSC10H065 is especially suited for use in PFC applications. This ST SiC
diode will boost the performance in hard switching conditions. Its high forward surge
capability ensures a good robustness during transient phases.
Product label
DS9226 - Rev 8 - January 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
STPSC10H065
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
650
V
IF(RMS)
Forward rms current
22
A
10
A
41
A
IF(AV)
Average forward current
IFRM
Repetitive peak forward
current
IFSM
Tstg
Tj
TO-220AC, DPAK, D²PAK, TC = 135 °C, DC (1)
TO-220AC Ins, TC = 85 °C, DC(1)
TO-220AC, DPAK, D²PAK, Tc = 135 °C, Tj = 175
°C, δ = 0.1(1)
TO-220AC Ins, Tc = 85 °C, Tj = 175 °C, δ = 0.1(1)
Surge non repetitive
forward current
tp = 10 ms sinusoidal, Tc = 25 °C
90
tp = 10 ms sinusoidal, Tc = 125 °C
80
tp = 10 µs square, Tc = 25 °C
470
Storage temperature range
Operating junction temperature
range(2)
A
-55 to +175
°C
-40 to +175
°C
1. Value based on Rth(j-c) max.
2. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameters
Symbol
Rth(j-c)
Parameter
Junction to case
Typ. value
Max. value
TO-220AC, DPAK, D²PAK
1.25
1.5
TO-220AC Ins.
2.1
3.5
Unit
°C/W
Table 3. Static electrical characteristics
Symbol
Parameter
IR (1)
Reverse leakage current
VF (2)
Forward voltage drop
Test conditions
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VR = VRRM
IF = 10 A
Min.
Typ.
Max.
-
9
100
-
85
425
-
1.56
1.75
-
1.98
2.5
Unit
µA
V
1. Pulse test: tp = 10 ms, δ < 2%
2. Pulse test: tp = 500 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 1.35 x IF(AV) + 0.115 x IF 2 (RMS)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
DS9226 - Rev 8
page 2/17
STPSC10H065
Characteristics
Table 4. Dynamic electrical characteristics
Symbol
QCj (1)
Cj
Parameter
Total capacitive charge
Total capacitance
Test conditions
Typ.
Unit
VR = 400 V
28.5
nC
VR = 0 V, Tc = 25 °C, F = 1 MHz
480
VR = 400 V, Tc = 25 °C, F = 1 MHz
48
pF
1. Most accurate value for the capacitive charge:
V
Qcj = ∫0 OUT C J VR • dVR
DS9226 - Rev 8
(1)
page 3/17
STPSC10H065
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Forward voltage drop versus forward current
(typical values, low level)
20
IF(A)
18
Figure 2. Forward voltage drop versus forward current
(typical values, high level)
100
Pulse test : tp=500µs
Pulse test : tp=500µs
90
16
80
Ta=25 °C
14
12
70
Ta=150 °C
Ta=100 °C
10
60
40
6
30
4
20
2
0.5
1.0
1.5
2.0
2.5
3.0
Ta=100 °C
Ta=150 °C
10
VF (V)
0
0.0
Ta=25 °C
50
Ta=175 °C
8
Ta=175 °C
VF (V)
0
3.5
Figure 3. Reverse leakage current versus reverse voltage
applied (typical values)
1.E+03
IF(A)
0
1
2
3
4
5
6
7
8
Figure 4. Peak forward current versus case temperature
(TO-220AC, DPAK, D²PAK)
IR(µA)
Tj=175 °C
1.E+02
Tj=150 °C
1.E+01
1.E+00
1.E-01
Tj=25 °C
VR(V)
1.E-02
0
DS9226 - Rev 8
50
100 150 200 250 300 350 400 450 500 550 600 650
page 4/17
STPSC10H065
Characteristics (curves)
Figure 5. Peak forward current versus case temperature
(TO-220AC Ins)
Figure 6. Junction capacitance versus reverse voltage
applied (typical values)
500
Cj(pF)
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
450
400
350
300
250
200
150
100
50
VR(V)
0
0.1
1 .0
10.0
100.0
1000.0
Figure 7. Relative variation of thermal impedance junction
Figure 8. Relative variation of thermal impedance junction
to case versus pulse duration (TO-220AC, DPAK and
to case versus pulse duration (TO-220AC Ins)
D²PAK)
1.0
1.0
Zth(j-c) /Rth(j-c)
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
Zth(j-c) /Rth(j-c)
Single pulse
0.0
1.E-05
DS9226 - Rev 8
1.E-04
1.E-03
1.E-02
1.E-01
Single pulse
0.1
t p (s)
1.E+00
0.0
1.E-04
t p (s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
page 5/17
STPSC10H065
Characteristics (curves)
Figure 10. Total capacitive charges versus reverse
voltage applied (typical values)
Figure 9. Non-repetitive peak surge forward current
versus pulse duration (sinusoidal waveform)
1.E+03
IFSM(A)
32
Qcj(nC)
28
Ta=25 °C
24
20
Ta=125 °C
1.E+02
16
12
8
4
VR (V)
t p (s)
1.E+01
1.E-05
0
1.E-04
1.E-03
1.E-02
0
50
100
150
200
250
300
350
400
Figure 11. Thermal resistance junction to ambient versus copper surface under tab for D²PAK package
(typical values)
80
Rth(j-a) (°C/W)
D²PAK
70
Epoxy printed board FR4, copper thickness = 35 µm
60
50
40
30
20
10
SCu (cm²)
0
0
DS9226 - Rev 8
5
10
15
20
25
30
35
40
page 6/17
STPSC10H065
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
DPACK package information
•
Epoxy meets UL94, V0
Figure 12. DPAK package outline
A
E
c2
b4
E1
L2
D1
H
D
L4
A1
b (2x)
e
R
e1
c
Seating plane
A2
(L1)
L
V2
0.25
DS9226 - Rev 8
Gauge
plane
page 7/17
STPSC10H065
DPAK package information
Table 5. DPAK mechanical data
Dimensions
Dim.
Inches(1)
Millimeters
Min.
Typ.
Max.
Min.
Typ.
Max.
A
2.20
2.40
0.087
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
b
0.64
0.90
0.025
0.035
b4
5.20
5.40
0.205
0.213
c
0.45
0.60
0.018
0.024
c2
0.48
0.60
0.019
0.024
D
6.00
6.20
0.236
0.244
D1
4.95
5.25
0.195
E
6.40
6.60
0.252
E1
4.60
4.70
4.80
0.181
0.185
0.189
e
2.159
2.286
2.413
0.085
0.090
0.095
e1
4.445
4.572
4.699
0.175
0.180
0.185
H
9.35
10.10
0.368
0.398
L
1.00
1.50
0.039
0.059
(L1)
2.60
2.80
3.00
0.102
0.110
0.118
L2
0.65
0.80
0.95
0.026
0.031
0.037
L4
0.60
1.00
0.024
R
V2
5.10
0.201
0.207
0.260
0.039
0.20
0.008
0°
8°
0°
8°
1. Inches dimensions given for reference only
Figure 13. DPAK recommended footprint (dimensions are in mm)
6.3
6.1
10.7
2.8
1.8 min.
B
1.5
4.572
A
The device must be positioned within
DS9226 - Rev 8
page 8/17
STPSC10H065
D²PAK package information
2.2
D²PAK package information
•
•
Epoxy meets UL94, V0.
Cooling method: by conduction (C)
Figure 14. D²PAK package outline
Note:
DS9226 - Rev 8
This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
page 9/17
STPSC10H065
D²PAK package information
Table 6. D²PAK package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Inches (for reference only)
Max.
Min.
Typ.
Max.
A
4.40
4.60
0.173
0.181
A1
0.03
0.23
0.001
0.009
b
0.70
0.93
0.028
0.037
b2
1.14
1.70
0.045
0.067
c
0.45
0.60
0.018
0.024
c2
1.23
1.36
0.048
0.053
D
8.95
9.35
0.352
0.368
D1
7.50
7.75
8.00
0.295
0.305
0.315
D2
1.10
1.30
1.50
0.043
0.051
0.060
E
10.00
10.40
0.394
E1
8.30
8.50
8.70
0.335
0.343
0.346
E2
6.85
7.05
7.25
0.266
0.278
0.282
e
2.54
0.409
0.100
e1
4.88
5.28
0.190
0.205
H
15.00
15.85
0.591
0.624
J1
2.49
2.69
0.097
0.106
L
2.29
2.79
0.090
0.110
L1
1.27
1.40
0.049
0.055
L2
1.30
1.75
0.050
0.069
R
V2
0.40
0°
0.015
8°
0°
8°
Figure 15. D²PAK recommended footprint (dimensions are in mm)
Footprint_26
DS9226 - Rev 8
page 10/17
STPSC10H065
TO-220AC package information
2.3
TO-220AC package information
•
•
•
•
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.70 N·m
Figure 16. TO-220AC package outline
A
H2
0.10
ØI
C
Gate note (1)(2)
L5
L7
L6
L2
F1
D
L9
Gate note (1)(2)
L4
F
M
G
E
(1) :Max resin gate protusion 0.5 mm
(2) :Resin gate position is accepted in each of the two positions shown on the drawings or their symmetrical
DS9226 - Rev 8
page 11/17
STPSC10H065
TO-220AC package information
Table 7. TO-220AC package mechanical data
Dimensions
Ref.
Millimeters
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
H2
10.00
10.40
0.393
0.409
L2
16.40 typ.
0.645 typ.
L4
13.00
14.00
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
Diam
DS9226 - Rev 8
Inches (for reference only)
2.60 typ.
3.75
0.102 typ.
3.85
0.147
0.151
page 12/17
STPSC10H065
TO-220AC Ins. package information
2.4
TO-220AC Ins. package information
•
•
•
•
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.70 N·m
Figure 17. TO-220AC Ins. package outline
C
B
ØI
b2
L
F
A
I4
c2
a1
l2
a2
M
b1
c1
e
DS9226 - Rev 8
page 13/17
STPSC10H065
TO-220AC Ins. package information
Table 8. TO-220AC Ins. package mechanical data
Dimensions
Ref.
Millimeters
Min.
A
15.20
a1
Max.
Min.
15.90
0.598
3.75
Typ.
Max.
0.625
0.147
a2
13.00
14.00
0.511
0.551
B
10.00
10.40
0.393
0.409
b1
0.61
0.88
0.024
0.034
b2
1.23
1.32
0.048
0.051
C
4.40
4.60
0.173
0.181
c1
0.49
0.70
0.019
0.027
c2
2.40
2.72
0.094
0.107
e
4.80
5.40
0.189
0.212
F
6.20
6.60
0.244
0.259
L
2.65
2.95
0.104
0.116
I2
1.14
1.70
0.044
0.066
I4
15.80
16.80
0.622
M
ØI
DS9226 - Rev 8
Typ.
Inches (for reference only)
16.40
2.60
3.75
0.645
0.661
0.102
3.85
0.147
0.151
page 14/17
STPSC10H065
Ordering information
3
Ordering information
Table 9. Ordering information
DS9226 - Rev 8
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPSC10H065G-TR
STPSC10H065G
D²PAK
1.48 g
1000
Tape and reel
STPSC10H065D
STPSC10H065D
TO-220AC
1.86 g
50
Tube
STPSC10H065DI
STPSC 10H065DI
TO-220AC Ins.
2.12 g
50
Tube
STPSC10H065B-TR
PSC10 H065
DPAK
0.32 g
2500
Tape and reel
page 15/17
STPSC10H065
Revision history
Table 10. Document revision history
DS9226 - Rev 8
Date
Revision
Changes
31-Aug-2012
1
First issue.
10-Oct-2012
2
Added Max. value to Table 3.
07-Nov-2013
3
Updated Figure 1, Figure 2, Figure 13, Figure 14 and Table 8.
07-Jan-2014
4
Added TO-220AC Ins package.
22-Jul-2015
5
Updated Table 10 and reformatted to current standard.
10-Dec-2015
6
Inserted package name on cover page.
26-Jan-2017
7
Updated D²PAK package information.
09-Jan-2020
8
Updated Features.
page 16/17
STPSC10H065
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DS9226 - Rev 8
page 17/17