STPSC10H12B-TR1

STPSC10H12 Datasheet 1200 V power Schottky silicon carbide diode A Features K K K K A A DPAK HV 2L K TO-220AC K K A NC DO-247 LL K D²PAK A • • • • • No or negligible reverse recovery Switching behavior independent of temperature Robust high voltage periphery Operating from -40 °C to 175 °C Low VF • ECOPACK®2 compliant Description The SiC diode, available in TO-220AC, DPAK HV, D²PAK and DO-247 LL, is an ultrahigh performance power Schottky rectifier. It is manufactured using a silicon carbide substrate. The wide band-gap material allows the design of a low VF Schottky diode structure with a 1200 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. Especially suited for use in PFC and secondary side applications, this ST SiC diode will boost the performance in hard switching conditions. This rectifier will enhance the performance of the targeted application. Its high forward surge capability ensures a good robustness during transient phases. Product status STPSC10H12 Table 1. Device summary Symbol Value IF(AV) 10 A VRRM 1200 V Tj (max) 175 °C VF (typ) 1.35 V DS11566 - Rev 5 - April 2018 For further information contact your local STMicroelectronics sales office. www.st.com STPSC10H12 Characteristics 1 Characteristics Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage (Tj = -40 °C to +175 °C) IF(RMS) Forward rms current IF(AV) Average forward current IFRM Repetitive peak forward current IFSM Surge non repetitive forward current Tj Unit 1200 V 25 A 10 A TO-220AC, DPAK HV 2L, D²PAK, TC = 155 °C(1), DC current DO-247 LL, TC = 150 °C(1), DC current TO-220AC, DPAK HV 2L, D²PAK, TC = 155 °C, Tj = 175 °C, δ = 0.1 38 DO-247 LL, TC = 150 °C, Tj = 175 °C, δ = 0.1 42 tp = 10 ms sinusoidal tp = 10 µs square Tstg Value TC = 25 °C 71 TC = 150 °C 60 TC = 25 °C 420 A A Storage temperature range -65 to + 175 °C Operating junction temperature range -40 to + 175 °C 1. Value based on Rth(j-c) max. Table 3. Thermal parameters Symbol Rth(j-c) Parameter Junction to case Typ. Max. TO-220AC, DPAK HV 2L, D²PAK 0.65 0.9 DO-247 LL 0.70 0.95 Unit °C/W Table 4. Static electrical characteristics Symbol Parameter IR (1) Reverse leakage current VF (2) Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 10 A Min. Typ. Max. - 5 60 - 30 400 - 1.35 1.50 - 1.75 2.25 Unit µA V 1. Pulse test: tp = 10 ms, δ < 2% 2. Pulse test: tp = 500 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.03 x IF(AV) + 0.122 IF 2 (RMS) DS11566 - Rev 5 page 2/18 STPSC10H12 Characteristics Table 5. Dynamic electrical characteristics Symbol QCj (1) Cj Parameter Total capacitive charge Total capacitance Test conditions Min. Typ. Max. Unit VR = 800 V - 57 - nC VR = 0 V, Tc = 25 °C, F = 1 MHz - 725 - VR = 800 V, Tc = 25 °C, F = 1 MHz - 47 - pF 1. Most accurate value for the capacitive charge: VR Qcj VR =   ∫ C j V dV 0 DS11566 - Rev 5 page 3/18 STPSC10H12 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Forward voltage drop versus forward current (typical values) 20 Figure 2. Reverse leakage current versus reverse voltage applied (typical values) IF(A) IR(µA) 1.E+02 Pulse test : tp = 500 µs 15 1.E+01 Ta = 25 °C Tj = 150 °C 1.E+00 10 Tj = 25 °C 1.E-01 5 Ta = 150 °C 1.E-02 VF(V) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Figure 3. Peak forward current versus case temperature (TO-220AC, DPAK HV 2L, D²PAK) 100 IM(A) 1.E-03 0 VR(V) 100 200 300 400 500 600 700 800 900 1000 1100 1200 Figure 4. Peak forward current versus case temperature (DO-247 LL) 100 IM (A) T T δ = 0.1 80 δ = tp/T δ = 0.1 80 tp δ =tp/T tp 60 60 δ = 0.3 δ = 0.3 40 40 δ = 0.5 20 δ = 0.5 20 δ=1 δ = 0.7 δ= 1 δ = 0.7 TC(°C) TC(°C) 0 0 0 DS11566 - Rev 5 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175 page 4/18 STPSC10H12 Characteristics (curves) Figure 5. Junction capacitance versus reverse voltage applied (typical values) Figure 6. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK HV 2L, D²PAK) Cj(pF) Zth(j-c) / Rth(j-c) 700 600 F = 1 MHz 1.0 Vosc= 30 mVRMS 0.9 T = 25 °C j 0.8 500 0.7 400 0.6 0.5 300 0.4 200 0.3 100 0.2 0 0.1 0.0 VR(V) 0.1 1.0 10.0 100.0 1000.0 10000.0 Figure 7. Relative variation of thermal impedance junction to case versus pulse duration (DO-247LL) Single pulse tp(s) 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 8. Non- repetitive peak surge forward current versus pulse duration (sinusoidal waveform) IFSM(A) 1.0 Zth(j-c) /Rth(j-c) 1.E+03 0.9 Ta = 25 °C 0.8 Ta = 150 °C 0.7 0.6 0.5 1.E+02 0.4 0.3 0.2 0.1 Single pulse 0.0 1.E-05 DS11566 - Rev 5 t p (s) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 tp(s) 1.E+01 1.E-05 1.E-04 1.E-03 1.E-02 page 5/18 STPSC10H12 Characteristics (curves) Figure 9. Total capacitive charges versus reverse voltage applied (typical values) QCj(nC) Figure 10. Thermal resistance junction to ambient versus copper surface under tab on epoxy printed board FR4, eCu = 35 μm (typical values) 60 Rth(j-a)(°C/W) 100 50 DPAK HV 2L 90 80 40 70 30 60 50 20 40 30 10 20 VR(V) 0 0 100 200 300 400 500 600 700 SCu (cm²) 10 800 0 0 5 10 15 20 25 30 35 40 Figure 11. Thermal resistance junction to ambient versus copper surface under tab for D²PAK package (typical values) 80 Rth(j-a) (°C/W) D²PAK 70 Epoxy printed board FR4, copper thickness = 35 µm 60 50 40 30 20 10 SCu (cm²) 0 0 DS11566 - Rev 5 5 10 15 20 25 30 35 40 page 6/18 STPSC10H12 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DS11566 - Rev 5 page 7/18 STPSC10H12 TO-220AC package information 2.1 TO-220AC package information • • • • Cooling method: by conduction (C) Epoxy meets UL94,V0 Recommended torque value: 0.55 N·m Maximum torque value: 0.7 N·m Figure 12. TO-220AC package outline A H2 ØI C L5 L7 L6 L2 F1 D L9 L4 F M E G DS11566 - Rev 5 page 8/18 STPSC10H12 TO-220AC package information Table 6. TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam DS11566 - Rev 5 Inches 2.6 typ. 3.75 0.102 typ. 3.85 0.147 0.151 page 9/18 STPSC10H12 DO-247 LL package information 2.2 DO-247 LL package information • • • • Cooling method: by conduction (C) Epoxy meets UL94,V0 Recommended torque value: 0.8 N·m Maximum torque value: 1.0 N·m Figure 13. DO-247 LL package outline DS11566 - Rev 5 page 10/18 STPSC10H12 DO-247 LL package information Table 7. DO-247 LL package mechanical data Dimensions Millimeters Ref. Inches(1) Min. Max. Min. Max. A 4.70 5.31 0.185 0.209 A1 2.21 2.59 0.087 0.102 A2 1.50 2.49 0.059 0.098 b 0.99 1.40 0.039 0.055 b2 1.65 2.39 0.065 0.094 c 0.38 0.89 0.015 0.035 D 20.80 21.46 0.819 0.845 D1 13.08 E 15.49 e 0.515 16.26 0.610 5.44 typ. 0.640 0.214 E1 13.46 0.530 E2 3.43 3.99 0.135 0.157 L 19.81 20.32 0.780 0.800 L1 4.50 0.177 P 3.56 3.66 0.140 0.144 P1 7.06 7.39 0.278 0.291 Q 5.38 6.20 0.219 0.244 S 6.17 typ. W 0.243 0.15 0.006 1. Inches dimensions given for reference only DS11566 - Rev 5 page 11/18 STPSC10H12 D²PAK package information 2.3 D²PAK package information • • Cooling method: by conduction (C) Epoxy meets UL 94,V0 Figure 14. D²PAK package outline DS11566 - Rev 5 page 12/18 STPSC10H12 D²PAK package information Table 8. D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R 0.4 typ. V2 0° 0.015 8° 0° 8° Figure 15. D²PAK Recommended footprint 16.90 12.20 5.08 2.54 1.60 9.75 DS11566 - Rev 5 3.50 page 13/18 STPSC10H12 DPAK HV 2L package information 2.4 DPAK HV 2L package information • • Cooling method: by conduction (C) Epoxy meets UL 94,V0 Figure 16. DPAK HV 2L package outline DS11566 - Rev 5 page 14/18 STPSC10H12 DPAK HV 2L package information Table 9. DPAK HV 2L package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 2.16 2.29 2.40 0.085 0.090 0.094 A1 0.06 0.08 0.13 0.002 0.003 0.005 b 0.71 0.76 1.07 0.028 0.029 0.030 b3 5.004 5.10 5.21 0.197 0.201 0.205 c 0.46 0.51 0.56 0.018 0.020 0.025 c2 0.76 0.81 0.86 0.029 0.032 0.034 D 5.97 6.10 6.22 0.235 0.240 0.245 D1 5.84 REF E 6.48 6.60 E1 4.95 5.08 e 0.230 REF 6.73 5.21 0.255 0.260 0.265 0.195 0.200 0.205 2.29 REF 0.90 REF H 9.70 9.83 10.08 0.382 0.387 0.397 L 1.02 1.14 1.40 0.040 0.045 0.055 L3 L4(1) 1.14 0.000 M 0.045 0.15 0.000 0.006 7° 7° P 5° 5° 1. Maximum plastic protrusion Figure 17. Footprint (dimensions in mm) 1.80 6.10 2.80 1.50 4.572 6.30 10.70 DS11566 - Rev 5 page 15/18 STPSC10H12 Ordering information 3 Ordering information Table 10. Ordering information DS11566 - Rev 5 Order code Marking Package Weight Base qty. Delivery mode STPSC10H12D STPSC10H12D TO-220AC 1.86 g 50 Tube STPSC10H12WL STPSC10H12WL DO-247 LL 5.9 g 30 Tube STPSC10H12B-TR1 STPSC 10H12 DPAK HV 2L 0.368 g 2500 Tape and reel STPSC10H12G-TR STPSC10H12G D²PAK 1.48 g 1000 Tape and reel page 16/18 STPSC10H12 Revision history Table 11. Document revision history Date Revision Changes 03-May-2016 1 First issue 06-Feb-2016 2 Added DPAK HV 2L package. Updated Table 5: "Dynamic electrical characteristics". 10-Apr-2017 3 10-Sep-2017 4 Added D²PAK package. Added DO-247 LL package. Updated Section 1: "Characteristics" and Table 10: "Ordering information". 23-Apr-2018 DS11566 - Rev 5 5 Updated Figure 13. DO-247 LL package outline. page 17/18 STPSC10H12 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS11566 - Rev 5 page 18/18