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STPSC20H065CT

STPSC20H065CT

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO-220-3

  • 描述:

    TRANS NPN 800V 20A TO-264

  • 数据手册
  • 价格&库存
STPSC20H065CT 数据手册
STPSC20H065C 650 V power Schottky silicon carbide diode Datasheet - production data Description A1 (1) K (2) A2 (3) A2 A1 K TO-220AB STPSC20H065CT The SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide band gap material allows the design of a Schottky diode structure with a 650 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. Especially suited for use in PFC applications, this ST SiC diode will boost the performance in hard switching conditions. Its high forward surge capability ensures a good robustness during transient phases. A2 K Table 1. Device summary A1 TO-247 STPSC20H065CW Features Symbol Value IF(AV) 2 x 10 A VRRM 650 V Tj (max) 175 °C  No or negligible reverse recovery  Switching behavior independent of temperature  Dedicated to PFC applications  High forward surge capability November 2013 This is information on a product in full production. DocID023605 Rev 3 1/9 www.st.com Characteristics 1 STPSC20H065C Characteristics Table 2. Absolute ratings (limiting values per diode at 25 °C unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current Value Unit 650 V 22 A (1) Tc = 135 °C , DC, per diode 10 Tc = 125 °C(2), per device 20 IF(AV) Average forward current IFSM Surge non repetitive forward current tp = 10 ms sinusoidal, Tc = 25 °C tp = 10 ms sinusoidal, Tc = 125 °C tp = 10 µs square, Tc = 25 °C 90 80 470 A IFRM Repetitive peak forward current Tc = 135 °C(1), Tj = 175 °C,  = 0.1 36 A Tstg Storage temperature range -55 to +175 °C -40 to +175 °C Operating junction Tj temperature(3) A 1. Value based on Rth(j-c) max (per diode) 2. Value based on Rth(j-c) max (per device) 3. dPtot --------------dTj 1 - condition to avoid thermal runaway for a diode on its own heatsink  ------------------------Rth  j – a  Table 3. Thermal resistance Value Symbol Parameter Unit TO-247 Per diode Rth(j-c) TO-220AB Junction to case per diode TO-247 Total Rth(c) TO-220AB Typ. Max. 1.25 1.5 0.83 0.95 Coupling °C/W 0.4 When the two diodes 1 and 2 are used simultaneously: Tj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 4. Static electrical characteristics per diode Symbol Parameter Tests conditions IR (1) Reverse leakage current VF (2) Forward voltage drop Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C Min. Typ. Max. - 9 100 - 85 425 - 1.56 1.75 - 1.98 2.5 VR = VRRM IF = 10 A 1. tp = 10 ms,  < 2% 2. tp = 500 µs,  < 2% To evaluate the conduction losses use the following equation: P = 1.35 x IF(AV) + 0.115 x IF2(RMS) 2/9 DocID023605 Rev 3 Unit µA V STPSC20H065C Characteristics Table 5. Dynamic electrical characteristics per diode Symbol Parameter Qcj(1) Test conditions Total capacitive charge Cj Total capacitance Typ. Unit VR = 400 V 28.5 nC VR = 0 V, Tc = 25 °C, F = 1 MHz 480 VR = 400 V, Tc = 25 °C, F = 1 MHz 48 1. Most accurate value for the capacitive charge: pF VOUT Qcj = ∫0 cj(vR).dvR Figure 1. Forward voltage drop versus forward Figure 2. Forward voltage drop versus forward current (typical values per diode, low level) current (typical values per diode, high level) 20 IFM(A) 18 IFM(A) 100 Pulse test : tp=500µs 16 80 Ta=25 °C 14 12 Pulse test : tp=500µs 90 70 Ta=150 °C Ta=100 °C 10 60 8 40 6 30 4 20 2 Ta=25 °C 50 Ta=175 °C Ta=100 °C Ta=150 °C 10 VFM(V) 0 Ta=175 °C VFM(V) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Figure 3. Reverse leakage current versus reverse voltage applied (typical values per diode) 1.E+03 IR(µA) 0 1 2 3 4 5 6 I M (A) T δ = 0.1 70 Tj=175 °C δ=tp/T 60 tp 50 Tj=150 °C 1.E+01 8 Figure 4. Peak forward current versus case temperature, per diode 80 1.E+02 7 δ = 0.3 40 1.E+00 δ = 0.5 30 20 1.E-01 Tj=25 °C δ=1 VR(V) 1.E-02 δ = 0.7 10 TC(°C) 0 0 50 100 150 200 250 300 350 400 450 500 550 600 650 0 DocID023605 Rev 3 25 50 75 100 125 150 175 3/9 9 Characteristics STPSC20H065C Figure 5. Junction capacitance versus reverse voltage applied (typical values, per diode) 500 Cj (pF) Figure 6. Relative variation of thermal impedance junction to case versus pulse duration per diode Zth(j-c)/Rth(j-c) 1.0 F=1 MHz VOSC=30 mVRMS Tj=25 °C 450 400 0.9 0.8 350 0.7 300 0.6 250 0.5 200 0.4 150 0.3 100 0.2 50 0.1 10.0 0.0 1.E-05 0 0.1 1.0 100.0 1000.0 Figure 7. Non-repetitive peak surge forward current versus pulse duration per diode (sinusoidal waveform) 1.E+03 Single pulse VR(V) IFSM (A) tp(s) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 8. Total capacitive charges versus reverse voltage applied (typical values per diode) 32 Qcj (nC) 28 Ta=25 °C 24 20 Ta=125 °C 16 1.E+02 12 8 4 VR (V) tp(s) 1.E+01 1.E-05 4/9 0 1.E-04 1.E-03 1.E-02 0 DocID023605 Rev 3 50 100 150 200 250 300 350 400 STPSC20H065C 2 Package information Package information  Epoxy meets UL94, V0  Cooling method: conduction (C)  Recommended torque value: – TO-220AB 0.4 to 0.6 N·m, – TO-247 0.55 N·m (1.0 N·m maximum) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. TO-220AB dimension definitions A H2 Dia C L5 L7 L6 L2 F2 F1 D L9 L4 F M G1 E G DocID023605 Rev 3 5/9 9 Package information STPSC20H065C Table 6. TO-220AB dimension values Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 L2 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. 6/9 Inches 2.6 typ. 3.75 0.102 typ. 3.85 DocID023605 Rev 3 0.147 0.151 STPSC20H065C Package information Figure 10. TO-247 dimension definitions Heat-sink plane A E ∅P S ∅R D L2 L1 b1 L b2 1 2 3 b c 3 2 1 BACK VIEW A1 e Table 7. TO-247 dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ Max. A 4.85 5.15 0.191 0.203 A1 2.20 2.60 0.086 0.102 b 1.00 1.40 0.039 0.055 b1 2.00 2.40 0.078 0.094 b2 3.00 3.40 0.118 0.133 c 0.40 0.80 0.015 0.031 D(1) 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 0.620 e 5.30 5.60 0.209 L 14.20 14.80 0.559 0.582 L1 3.70 4.30 0.145 0.169 L2 P (2) 5.45 18.50 typ. 0.215 0.220 0.728 typ. 3.55 3.65 0.139 0.143 R 4.50 5.50 0.177 0.217 S 5.30 5.70 0.209 5.50 0.216 0.224 1. Dimension D plus gate protrusion does not exceed 20.5 mm 2. Resin thickness around the mounting hole is not less than 0.9 mm DocID023605 Rev 3 7/9 9 Ordering information 3 STPSC20H065C Ordering information Table 8. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STPSC20H065CT STPSC20H065C TO-220AB 1.86 g 50 Tube STPSC20H065CW STPSC20H065CW TO-247 4.43 g 30 Tube Revision history Table 9. Document revision history 8/9 Date Revision Changes 31-Aug-2012 1 First issue. 10-Oct-2012 2 Added Max. values to Table 3. 07-Nov-2013 3 Updated Figure 1 and Figure 2. DocID023605 Rev 3 STPSC20H065C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com DocID023605 Rev 3 9/9 9
STPSC20H065CT 价格&库存

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