STPSC4H065DI

STPSC4H065 Datasheet 650 V, 4 A high surge silicon carbide power Schottky diode Features • • • • TO-220AC TO-220AC ins. DPAK No reverse recovery charge in application current range Switching behavior independent of temperature High forward surge capability Insulated package TO-220AC Ins: – Insulated voltage: 2500 VRMS • – Typical package capacitance: 7 pF Power efficient product • ECOPACK®2 compliant component Applications • • • • • Switch mode power supply PFC DCDC converters LLC topologies Boost diode Description This 4 A, 650 V SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide band gap material allows the design of a Schottky diode structure with a 650 V rating. Due to the Schottky construction, no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. Product status STPSC4H065 Product summary Symbol Value IF(AV) 4A VRRM 650 V Tj(max.) 175 °C This STPSC4H065 is especially suited for use in PFC applications. This ST SiC diode will boost the performance in hard switching conditions. Its high forward surge capability ensures a good robustness during transient phases. Product label DS9222 - Rev 6 - January 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPSC4H065 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 650 V IF(RMS) Forward rms current 22 A 4 A IF(AV) IFSM TO-220AC, DPAK, Tc = 145 °C(1), DC Average forward current TO-220AC Ins,Tc = 125 °C(1), DC Surge non repetitive forward current IFRM Repetitive peak forward current Tstg Storage temperature range Tj Operating junction temperature tp = 10 ms sinusoidal, Tc = 25 °C 38 tp = 10 ms sinusoidal, Tc = 125 °C 35 tp = 10 µs square, Tc = 25 °C 200 TO-220AC, DPAK, Tc = 145 °C (1), Tj = 175 °C, δ = 0.1 17 A -55 to +175 °C -40 to +175 °C TO-220AC Ins,Tc = 125 °C (1), Tj = 175 °C, δ = 0.1 range(2) A 1. Value based on Rth(j-c) max. 2. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case TO-220AC, DPAK, Typ. value Max. value 1.8 2.7 3 4.5 D2PAK TO-220AC Ins Unit °C/W Table 3. Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 4 A Min. Typ. Max. - 3 40 - 35 170 - 1.56 1.75 - 1.98 2.50 Unit µA V 1. tp = 10 ms, δ < 2% 2. tp = 500 μs, δ < 2% To evaluate the conduction losses, use the following equation: P = 1.35 x IF(AV) + 0.288 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS9222 - Rev 6 page 2/14 STPSC4H065 Characteristics Table 4. Dynamic electrical characteristics Symbol Qcj(1) Cj 1. DS9222 - Rev 6 Parameter Total capacitive charge Total capacitance Test conditions Typ. Unit VR = 400 V 12.5 nC VR = 0 V, Tc = 25 °C, F = 1 MHz 200 VR = 400 V, Tc = 25 °C, F = 1 MHz 21 pF VR Most accurate value for the capacitive charge: Qcj VR =   ∫ C j V dV 0 page 3/14 STPSC4H065 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Forward voltage drop versus forward current (typical values, low level) 8 IF (A) Figure 2. Forward voltage drop versus forward current (typical values, high level) 40 Pulse test : tp=500µs Pulse test : tp=500µs 36 7 32 Ta=25 °C 6 IF (A) 28 5 Ta=150 °C 24 Ta=100 °C 4 Ta=25 °C 20 Ta=175 °C Ta=100 °C 16 3 12 2 Ta=150 °C 8 1 VF (V) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 IR(µA) Ta=175 °C VF (V) 0 0 3.5 Figure 3. Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 4 1 2 3 4 5 6 I M (A) = 0.1 Tj=175 °C T IM 40 Tj=150 °C 8 Figure 4. Peak forward current versus case temperature (TO-220AC, DPAK) 50 1.E+01 7 =tp/T tp 30 = 0.3 1.E+00 = 0.5 20 1.E-01 10 Tj=25 °C =1 = 0.7 VR(V) 1.E-02 0 DS9222 - Rev 6 50 100 150 200 250 300 350 400 450 500 550 600 650 TC(°C) 0 0 25 50 75 100 125 150 175 page 4/14 STPSC4H065 Characteristics (curves) Figure 5. Peak forward current versus case temperature (TO-220AC Ins.) 40 Figure 6. Junction capacitance versus reverse voltage applied (typical values) I M (A) Cj (pF) 250 = 0.1 T IM 32 200 tp =tp/T F=1 MHz VOSC=30 mVRMS Tj=25 °C 24 150 = 0.3 16 100 = 0.5 50 8 =1 VR(V) = 0.7 TC(°C) 0 0 0 25 50 75 100 125 150 0.1 175 1.0 10.0 100.0 1000.0 Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC and DPAK) to case versus pulse duration (TO-220AC Ins.) 1.0 Zth(j-c) /Rth(j-c) 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 Single pulse 1.E-04 1.E-03 1.E-02 1.E-0 1.E+00 Figure 9. Non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) 1.E+03 Single pulse 0.1 t p (s) 0.0 1.E-05 Zth(j-c)/Rth(j-c) IFSM (A) t p (s) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 10. Total capacitive charges versus reverse voltage applied (typical values) 14 Qcj (nC) 12 10 Ta=25 °C 8 1.E+02 Ta=125 °C 6 4 2 t p (s) 1.E+01 1.E-05 DS9222 - Rev 6 VR (V) 0 1.E-04 1.E-03 1.E-02 0 50 100 150 200 250 300 350 400 page 5/14 STPSC4H065 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 TO-220AC package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 11. TO-220AC package outline A H2 0.10 ØI C Gate note (1)(2) L5 L7 L6 L2 F1 D L9 Gate note (1)(2) L4 F M G E (1) :Max resin gate protusion 0.5 mm (2) :Resin gate position is accepted in each of the two positions shown on the drawings or their symmetrical DS9222 - Rev 6 page 6/14 STPSC4H065 TO-220AC package information Table 5. TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam DS9222 - Rev 6 Inches (for reference only) 2.60 typ. 3.75 0.102 typ. 3.85 0.147 0.151 page 7/14 STPSC4H065 TO-220AC Ins. package information 2.2 TO-220AC ins. package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 12. TO-220AC Ins. package outline C B ØI b2 L F A I4 c2 a1 l2 a2 M b1 c1 e DS9222 - Rev 6 page 8/14 STPSC4H065 TO-220AC Ins. package information Table 6. TO-220AC Ins. package mechanical data Dimensions Ref. Millimeters Min. A 15.20 a1 Max. Min. 15.90 0.598 3.75 Typ. Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 F 6.20 6.60 0.244 0.259 L 2.65 2.95 0.104 0.116 I2 1.14 1.70 0.044 0.066 I4 15.80 16.80 0.622 M ØI DS9222 - Rev 6 Typ. Inches (for reference only) 16.40 2.60 3.75 0.645 0.661 0.102 3.85 0.147 0.151 page 9/14 STPSC4H065 DPAK package information 2.3 DPAK package information • Epoxy meets UL94, V0 Figure 13. DPAK package outline A E c2 b4 E1 L2 D1 H D L4 A1 b (2x) e R e1 c Seating plane A2 (L1) L V2 0.25 DS9222 - Rev 6 Gauge plane page 10/14 STPSC4H065 DPAK package information Table 7. DPAK mechanical data Dimensions Dim. Inches(1) Millimeters Min. Typ. Max. Min. Typ. Max. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 5.20 5.40 0.205 0.213 c 0.45 0.60 0.018 0.024 c2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 D1 4.95 5.25 0.195 E 6.40 6.60 0.252 E1 4.60 4.70 4.80 0.181 0.185 0.189 e 2.159 2.286 2.413 0.085 0.090 0.095 e1 4.445 4.572 4.699 0.175 0.180 0.185 H 9.35 10.10 0.368 0.398 L 1.00 1.50 0.039 0.059 (L1) 2.60 2.80 3.00 0.102 0.110 0.118 L2 0.65 0.80 0.95 0.026 0.031 0.037 L4 0.60 1.00 0.024 R V2 5.10 0.201 0.207 0.260 0.039 0.20 0.008 0° 8° 0° 8° 1. Inches dimensions given for reference only Figure 14. DPAK recommended footprint (dimensions are in mm) 6.3 6.1 10.7 2.8 1.8 min. B 1.5 4.572 A The device must be positioned within DS9222 - Rev 6 page 11/14 STPSC4H065 Ordering Information 3 Ordering information Table 8. Ordering information DS9222 - Rev 6 Order code Marking Package Weight Base qty. Delivery mode STPSC4H065D STPSC4H065D TO-220AC 1.86 g 50 Tube STPSC4H065DI STPSC 4H065DI TO-220AC Ins. 2.12 g 50 Tube STPSC4H065B-TR STPSC 4H065 DPAK 0.32 g 2500 Tape and reel page 12/14 STPSC4H065 Revision history Table 9. Document revision history DS9222 - Rev 6 Date Version Changes 31-Aug-2012 1 First issue. 10-Oct-2012 2 Added Max. value to Table 3. 07-Nov-2013 3 Updated Figure 1, Figure 2, Figure 13, Figure 14, and Table 8. 07-Jan-2014 4 Added TO-220AC Ins. package. 15-Jul-2015 5 Updated Table 9. 09-Jan-2020 6 Updated Features. page 13/14 STPSC4H065 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS9222 - Rev 6 page 14/14