STPSC606

STPSC606 600 V power Schottky silicon carbide diode Features ■ ■ ■ No or negligible reverse recovery Switching behavior independent of temperature Dedicated to PFC boost diode K A K Description The SiC diode is an ultrahigh performance power Schottky diode. It is manufactured using a silicon carbide substrate. The wide bandgap material allows the design of a Schottky diode structure with a 600 V rating. Due to the Schottky construction no recovery is shown at turn-off and ringing patterns are negligible. The minimal capacitive turn-off behavior is independent of temperature. ST SiC diodes will boost the performance of PFC operations in hard switching conditions. TO-220AC STPSC606D K A NC D2PAK STPSC606G Table 1. Device summary IF(AV) VRRM Tj (max) QC (typ) 6A 600 V 175 °C 6 nC September 2009 Doc ID 16284 Rev 1 1/8 www.st.com 8 Characteristics STPSC606 1 Characteristics Table 2. Symbol VRRM IF(AV) IFSM IFRM Tstg Tj Absolute ratings (limiting values at 25 °C unless otherwise specified) Parameter Repetitive peak reverse voltage Average forward current Surge non repetitive forward current Repetitive peak forward current Storage temperature range Operating junction temperature range Tc = 125 °C, δ = 0.5 tp = 10 ms sinusoidal, Tc = 25 °C tp = 10 ms sinusoidal, Tc = 125 °C tp = 10 µs square, Tc = 25 °C δ = 0.1, Tc = 110 °C, Tj = 150 °C Value 600 18 6 27 22 110 27 -55 to +175 -40 to +175 Unit V A A IF(RMS) Forward rms current A A °C °C Table 3. Symbol Rth(j-c) Thermal resistance Parameter Junction to case Value 2.8 Unit °C/W Table 4. Symbol IR (1) VF (2) Static electrical characteristics (per diode) Parameter Reverse leakage current Forward voltage drop Tests conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM Min. IF = 6 A Typ. 15 100 1.4 1.6 Max. 75 µA 750 1.7 V 2.1 Unit 1. tp = 10 ms, δ < 2% 2. tp = 500 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.20x IF(AV) + 0.15 x IF2(RMS) Table 5. Symbol Qc C Other parameters Parameter Total capacitive charge Test conditions Vr = 400 V, IF = 6 A dIF/dt = -200 A/µs Tj = 150 °C Vr = 0 V, Tc = 25 °C, F = 1 Mhz Vr = 400 V, Tc = 25 °C, F = 1 Mhz Typ. 6 375 pF 30 Unit nC Total capacitance 2/8 Doc ID 16284 Rev 1 STPSC606 Characteristics Figure 1. Forward voltage drop versus forward current (typical values) Figure 2. Reverse leakage current versus reverse voltage applied (maximum values) 12 IFM(A) 1.E+04 IR(µA) Tj=175 °C 10 1.E+03 Tj=25 °C 8 Tj=150 °C Tj=150 °C 1.E+02 6 Tj=175 °C 1.E+01 4 2 1.E+00 Tj=25 °C VFM(V) 1.E-01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VR(V) 0 0 50 100 150 200 250 300 350 400 450 500 550 600 Figure 3. Peak forward current versus case temperature Figure 4. Junction capacitance versus reverse voltage applied (typical values) 70 60 50 IM(A) T δ=0.1 C(pF) 300 F=1 MHz VOSC=30 mVRMS Tj=25 °C δ=tp/T tp 250 200 40 δ=0.3 150 30 20 10 0 0 δ=0.5 100 50 δ=1 d=1 δ=0.7 d=0.7 VR(V) TC(°C) 50 75 100 125 150 175 0 1 10 100 1000 25 Doc ID 16284 Rev 1 3/8 Characteristics STPSC606 Figure 5. Relative variation of thermal impedance junction to case versus pulse duration Figure 6. Non-repetitive peak surge forward current versus pulse duration (sinusoidal waveform) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Single pulse 1.E+03 IFSM(A) 1.E+02 T =25 °C c Tc=125 °C 1.E+01 tp(s) tp(s) 1.E+00 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 7. Total capacitive charges versus dIF/dt (typical values) 12 10 8 6 4 2 0 0 50 100 150 200 250 300 350 400 450 500 QC(nC) IF=6 A VR=400 V Tj=150 °C dIF/dt(A/µs) 4/8 Doc ID 16284 Rev 1 STPSC606 Package information 2 Package information ● ● ● Epoxy meets UL94, V0 Cooling method: convection (C) Recommended torque: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. TO-220AC dimensions Dimensions Ref. Millimeters Min. A H2 ØI L5 L7 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F L6 L2 F1 G F1 L9 L4 F D H2 L2 L4 L5 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 Doc ID 16284 Rev 1 5/8 Package information Table 7. D2PAK dimensions Dimensions Ref. Millimeters Min. A A E L2 STPSC606 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 C2 A2 B D L L3 A1 B2 B G A2 R B2 C C2 C D E G L M * V2 L2 L3 * FLAT ZONE NO LESS THAN 2mm M R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 8. Footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 6/8 Doc ID 16284 Rev 1 STPSC606 Ordering information 3 Ordering information Table 8. Ordering information Marking STPSC606D STPSC606G Package TO-220AC D PAK 2 Order code STPSC606D STPSC606G-TR Weight 1.86 g 1.48 g Base qty 50 1000 Delivery mode Tube Tape and reel 4 Revision history Table 9. Date 24-Sep-2009 Document revision history Revision 1 First issue. Changes Doc ID 16284 Rev 1 7/8 STPSC606 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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