STSPIN233

STSPIN233 Low voltage three phase and three sense motor driver Datasheet - production data Description The STSPIN233 device integrates a triple halfbridge low RDS(ON) power stage in a small VFQFPN 3 x 3 x 1.0 mm package ideal for small and space constrained applications. The device is designed to operate in batterypowered scenarios and can be forced in a zero consumption state, allowing a significant increase in battery life. VFQFPN 3 x 3 x 1.0 (16-pin) The STSPIN233 is supporting three shunt sensing topology. The device offers a complete set of protection including overcurrent, overtemperature and shortcircuit protection. Features  Operating voltage from 1.8 to 10 V  Maximum output current 1.3 Arms  RDS(ON) HS + LS = 0.4 Ω typ.  Full protection set – Non-dissipative overcurrent protection – Short-circuit protection – Thermal shutdown  Supporting three shunt sensing topology  Direct driving, dedicated input and enable pin for each half-bridge  Energy saving and long battery life with standby consumption less than 80 nA Applications  Battery-powered 3-phase brushless (BLDC) motors in applications such as – Drones and portable gimbals – Portable health care products – Low voltage electronic valves – Portable medical equipment – Toys – Robotics January 2018 This is information on a product in full production. DocID031111 Rev 1 1/22 www.st.com Contents STSPIN233 Contents 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.4 ESD protection ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1 Standby and power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2 Motor driving . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.3 Overcurrent and short-circuit protections . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.4 Thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.1 VFQFPN 3 x 3 x 1.0 16L package information . . . . . . . . . . . . . . . . . . . . . 19 9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2/22 DocID031111 Rev 1 STSPIN233 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 ESD protection ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical application values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 ENx and INx truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 VFQFPN 3 x 3 x 1.0 16L package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 DocID031111 Rev 1 3/22 22 List of figures STSPIN233 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. 4/22 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Overcurrent and short-circuit protections management . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disable time versus REN and CEN values (VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disable time versus REN and CEN values (VDD = 1.8 V) . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Thermal shutdown management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Power stage resistance versus supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Power stage resistance versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Overcurrent threshold versus supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 VFQFPN 3 x 3 x 1.0 16L package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 VFQFPN 3 x 3 x 1.0 16L recommended footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 DocID031111 Rev 1 STSPIN233 1 Block diagram Block diagram Figure 1. Block diagram 7#"5 74 74  45#:  74 &/='"6-5 7SFMFBTF    0656 0$=4$ */6 &/7 */7 $POUSPM
MPHJD 4&/4&6 &/6 0657 0$=4$ 4&/4&7 &/8 */8 0658 0$=4$ 4&/4&8 07 5 (/% ". DocID031111 Rev 1 5/22 22 Electrical data STSPIN233 2 Electrical data 2.1 Absolute maximum ratings Table 1. Absolute maximum ratings Symbol 2.2 Parameter Test condition Value Unit VS Supply voltage - -0.3 to 11 V VIN Logic input voltage - -0.3 to 5.5 V VOUT - VSENSE Output to sense voltage drop - up to 12 V VS - VOUT Supply to output voltage drop - up to 12 V VSENSE Sense pins voltage - -1 to 1 V IOUT,RMS Continuous power stage output current (each bridge) - 1.3 Arms Tj Junction temperature - -40 to 150 °C TSTG Storage temperature - -55 to 150 °C Recommended operating conditions Table 2. Recommended operating conditions Symbol 2.3 Parameter Test condition Min. Typ. Max. Unit VS Supply voltage - 1.8 - 10 V VIN Logic input voltage - 0 - 5 V Value Unit 57.1 °C/W Thermal data Table 3. Thermal data Symbol RthJA Parameter Junction to ambient thermal resistance Conditions Natural convection, according to JESD51-2A(1) RthJCtop Junction to case thermal resistance Simulation with cold plate on (top side) package top 67.3 °C/W RthJCbot Junction to case thermal resistance Simulation with cold plate on (bottom side) exposed pad 9.1 °C/W Junction to board thermal resistance according to JESD51-8(1) 23.3 °C/W Junction to top characterization According to JESD51-2A(1) 3.3 °C/W JESD51-2A(1) 22.6 °C/W RthJB ΨJT ΨJB Junction to board characterization According to 1. Simulated on a 21.2 x 21.2 mm board, 2s2p 1 Oz copper and four 300 µm vias below the exposed pad. 6/22 DocID031111 Rev 1 STSPIN233 2.4 Electrical data ESD protection ratings Table 4. ESD protection ratings Symbol Parameter Conditions Class Value Unit HBM Human body model Conforming to ANSI/ESDA/JEDEC JS-001-2014 2 2 kV CDM Charge device model Conforming to ANSI/ESDA/JEDEC JS-001-2014 C2 750 V DocID031111 Rev 1 7/22 22 Electrical characteristics 3 STSPIN233 Electrical characteristics Testing conditions: VS = 5 V, Tj = 25 °C unless otherwise specified. Table 5. Electrical characteristics Symbol Parameter Test condition Min. Typ. Max. Unit Supply VSth(ON) VS turn-on voltage VS rising from 0 V 1.45 1.65 1.79 V VSth(OFF) VS turn-off voltage VS falling from 5 V 1.3 1.45 1.65 V VSth(HYS) VS hysteresis voltage - - 180 - mV No commutations EN = 0 - 900 1300 A No commutations EN = 1 - 1500 1950 A IS VS supply current IS,STBY VS standby current STBY = 0 V - 10 80 nA VSTBYL Standby low voltage - - - 0.9 V VSTBYH Standby high voltage - 1.48 - - V - 0.4 0.65 - 0.53 0.87 VS = 3 V, IOUT = 0.4 A - 0.53 0.8 OUTx = VS - - 1 -1 - - Power stage VS = 10 V, IOUT = 1.3 A RDS(ON)HS+LS Total on resistance HS + LS VS = 10 V, IOUT = 1.3 A, Tj = 125 °C(1)  A IDSS Leakage current VDF Freewheeling diode forward voltage ID = 1.3 A - 0.9 - V trise Rise time VS = 10 V; unloaded outputs - 10 - ns tfall Fall time VS = 10 V; unloaded outputs - 10 - ns tDT Integrated dead time - 50 - ns OUTx = GND Logic IOs VIH High logic level input voltage - 1.6 - - V VIL Low logic level input voltage - - - 0.6 V FAULT open-drain release voltage - - - 0.4 V EN Low logic level output voltage IEN = 4 mA - - 0.4 V RSTBY STBY pull-down resistance - - 36 - k IPDEN EN pull-down current - - 10.5 - µA tEnd EN input propagation delay From EN falling edge to OUT high impedance - 55 - ns tIN,d(ON) Turn-on propagation delay From INx rising edge to 10% of OUTx - 125 - ns tIN,d(OFF) Turn-off propagation delay From INx falling edge to 90% of OUTx - 140 - ns VRELEASE VOL 8/22 DocID031111 Rev 1 STSPIN233 Electrical characteristics Table 5. Electrical characteristics (continued) Symbol Parameter Test condition Min. Typ. Max. Unit Protections TjSD Thermal shutdown threshold - - 160 - °C TjSD,Hyst Thermal shutdown hysteresis - - 40 - °C Overcurrent threshold See Figure 10 on page 18 - 2 - A IOC 1. Based on characterization data on a limited number of samples, not tested during production. DocID031111 Rev 1 9/22 22 Pin description 4 STSPIN233 Pin description Figure 2. Pin connection (top view) &/7 */7   45#:= 3&4&5  &/=
'"6-5  */6   &/8 &/6   */8 0658 &1"% 0656   4&/4&6       74 (/% 0657 4&/4&7 4&/4&8 ". Note: The exposed pad must be connected to ground. Table 6. Pin description 10/22 No. Name Type Function 1 INU Logic input Output U driving input 2 ENU Logic input Output U enable input 3 OUTU Power output Power bridge output U 4 SENSEU Power output Sense output bridge U 5 VS Supply Device supply voltage 6 EPAD GND Ground Device ground 7 OUTV Power output Power bridge output V 8 SENSEV Power output Sense output bridge V 9 SENSEW Power output Sense output bridge W 10 OUTW Power output Power bridge output W 11 INW Logic input Output W driving input 12 ENW Logic input Output W enable input DocID031111 Rev 1 STSPIN233 Pin description Table 6. Pin description (continued) No. Name Type Function Logic input 5 V compliant whit and open-drain output. Logic input\ This is the enable of the power stage (when low, the open-drain output power stage is turned off) and it is forced low through the integrated open-drain MOSFET when a failure occurs. 13 EN\FAULT 14 STBY\RESET Logic input Logic input 5 V compliant. When forced low, the device is forced in low consumption mode. 15 INV Logic input Output V driving input 16 ENV Logic input Output V enable input DocID031111 Rev 1 11/22 22 Typical applications 5 STSPIN233 Typical applications Table 7. Typical application values Name Value CS 2.2 µF / 16 V CSPOL 22 µF / 16 V RSNSU, RSNSV, RSNSW 330 m / 1 W CEN 10 nF / 6.3 V REN 18 k CSTBY 1 nF / 6.3 V RSTBY 18 k Figure 3. Typical application schematic 74 7%% 74 3 45#: $45#: 3 &/ $4 $410- 45#: 0656 &/='"6-5 $&/ 0657 &/6 */6 4541*/ 0658 &/7 4&/4&6 */7 4&/4&7 &/8 4&/4&8 */8 3 4/46 34/47 34/48 (/% ". 12/22 DocID031111 Rev 1 STSPIN233 6 Description Description The STSPIN233 device is a protected triple half-bridge motor driver. 6.1 Standby and power-up The device provides a low consumption mode which is set forcing the STBY\RESET input below the VSTBYL threshold. When the device is in the standby status the power stage is disabled (outputs are in high impedance) and the supply to the integrated control circuitry is cut off. When the device leaves the standby status, all the control circuitry is reset at power-up condition. 6.2 Motor driving The outputs of the three half-bridges are directly driven through the logic input as listed in Table 8. Table 8. ENx and INx truth table 6.3 EN\FAULT ENx INx OUTx 'x' half-bridge condition 0 X X HiZ Disabled 1 0 X HiZ Disabled 1 1 0 GND Low side MOSFET ON 1 1 1 VS High side MOSFET ON Overcurrent and short-circuit protections The device embeds a circuitry protecting each power output against the overload and shortcircuit conditions (short-circuit to ground, short-circuit to VS and short-circuit between outputs). When the overcurrent or the short-circuit protection is triggered, the power stage is disabled and the EN\FAULT input is forced low through the integrated open-drain MOSFET discharging the external CEN capacitor (refer to Figure 4). The power stage is kept disabled and the open-drain MOSFET is kept ON until the EN\FAULT input falls below the VRELEASE threshold, then the CEN capacitor is charged through the REN resistor. DocID031111 Rev 1 13/22 22 Description STSPIN233 Figure 4. Overcurrent and short-circuit protections management .$6 %&7*$& '" 6-5@ .$6 73&-&"4& &/='"6-5 &/@.$6 3&/ $&/ 3&-&"4& &/ *1%&/ 0$=4$ 5)4% '"6-5 0WFSDVSSFOU
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TUBHF &/"#-&% %*4"#-&% U %*4$)"3(& &/"#-&% U $)"3(& U 0$4% '" 6-5 U %*4 ". The total disable time after an overcurrent event can be set sizing properly the external network connected to the EN\FAULT pin (refer to Figure 4). Equation 1 tDIS = tdischarge + tcharge But tcharge is normally very higher than tdischarge, we can consider only the second one contribution: Equation 2  V DD – R EN  I PD  – V RELEASE t DIS  R EN  C EN  In ------------------------------------------------------------------------------- V DD – R EN  I PD  – V IH Where VDD is the pull-up voltage of the REN resistor. 14/22 DocID031111 Rev 1 STSPIN233 Description Figure 5. Disable time versus REN and CEN values (VDD = 3.3 V)  3&/ 3&/ 3&/ %JTBCMF
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TUBHF '"6-5 &/"#-&% %*4"#-&% %*4"#-&% &/"#-&% U 5)4% ". 16/22 DocID031111 Rev 1 STSPIN233 Graphs Figure 8. Power stage resistance versus supply voltage Figure 9. Power stage resistance versus temperature  3%4 0/
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".7 18/22 DocID031111 Rev 1 STSPIN233 8 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 8.1 VFQFPN 3 x 3 x 1.0 16L package information Figure 11. VFQFPN 3 x 3 x 1.0 16L package outline DocID031111 Rev 1 19/22 22 Package information STSPIN233 Table 9. VFQFPN 3 x 3 x 1.0 16L package mechanical data(1) Dimensions (mm) Symbol A Notes Min. Typ. Max. 0.80 0.90 1.00 (2) A1 0.00 0.02 0.005 A3 - 0.20 REF. - - 0.30 (3) b 0.20 0.25 D 3.00 BSC - D1 1.50 BSC - D2 1.70 1.80 1.90 - e 0.50 BSC - E 3.00 BSC - E1 1.50 BSC - E2 L ddd 1.70 0.30 1.80 0.40 1.90 - 0.50 (3) 0.05 - 1. VFQFPN stands for thermally enhanced “Very thin Fine pitch Quad Packages No lead”. Very thin: 0.80 < A ≤ 1.00 mm / fine pitch: e < 1.00 mm. The topside terminal A1 indicator may be a molded or metalized feature. The optional indicator on the bottom surface may be a molded, marked or metalized feature. 2. A1 is defined as the distance from the seating plane to the lowest point on the package body (standoff). 3. Dimensions “b” and “L” are measured at terminal plating surface. Figure 12. VFQFPN 3 x 3 x 1.0 16L recommended footprint 20/22 DocID031111 Rev 1 STSPIN233 9 Ordering information Ordering information Table 10. Device summary 10 Order code Package Packaging STSPIN233 VFQFPN 3 x 3 x 1.0 16L Tape and reel Revision history Table 11. Document revision history Date Revision 17-Jan-2018 1 Changes Initial release. DocID031111 Rev 1 21/22 22 STSPIN233 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved 22/22 DocID031111 Rev 1