STSPIN250

STSPIN250 Low voltage brush DC motor driver Datasheet - production data Description The STSPIN250 is a single brush DC motor driver integrating a low Rds(ON) power stage in a small VFQFPN 3 x 3 mm package. The full-bridge implements a PWM current controller with fixed OFF time. The device is designed to operate in batterypowered scenarios and can be forced in a zeroconsumption state allowing a significant increase in battery life. Features  Operating voltage from 1.8 to 10 V  Maximum output current 2.6 Arms with OUTAx paralled to OUTBx The device offers a complete set of protection features including overcurrent, overtemperature and short-circuit protection.  RDS(ON) HS + LS = 0.2 Ω typ.  Current control with programmable off-time  Full protection set – Non-dissipative overcurrent protection – Short-circuit protection – Thermal shutdown  Energy saving and long battery life with standby consumption less than 80 nA Applications Battery-powered DC motor applications such as:  Toys  Portable printers  Robotics  Point of sales (POS) devices  Portable medical equipment  Healthcare and wellness devices (shavers and toothbrushes) November 2016 This is information on a product in full production. DocID029872 Rev 2 1/26 www.st.com Contents STSPIN250 Contents 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 ESD protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.1 Standby and power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.2 Motor driving . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.3 PWM current control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 TOFF adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6.4 Overcurrent and short-circuit protections . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.5 Thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 8.1 VFQFPN 3 x 3 x 1.0- 16L package information . . . . . . . . . . . . . . . . . . . . 23 9 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2/26 DocID029872 Rev 2 STSPIN250 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ESD protection ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical application values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 ON and slow decay states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Recommended RRCOFF and CRCOFF values according to ROFF . . . . . . . . . . . . . . . . . . . . 17 VFQFPN 3 x 3 x 1.0 - 16L package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 DocID029872 Rev 2 3/26 26 List of figures STSPIN250 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. 4/26 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 PWM current control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 OFF time regulation circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 OFF time vs ROFF value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Overcurrent and short-circuit protections management . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disable time versus REN and CEN values (VDD = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disable time versus REN and CEN values (VDD = 1.8 V) . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Thermal shutdown management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Power stage resistance versus supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Power stage resistance versus temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Overcurrent threshold versus supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 VFQFPN 3 x 3 x 1.0 - 16L package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 VFQFPN 3 x 3 x 1.0 - 16L recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 DocID029872 Rev 2 STSPIN250 1 Block diagram Block diagram Figure 1. Block diagram              %(&  %"&      $#'%$"
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 DocID029872 Rev 2 5/26 26 Electrical data STSPIN250 2 Electrical data 2.1 Absolute maximum ratings Table 1. Absolute maximum ratings Symbol Parameter Test condition Value Unit VS Supply voltage - -0.3 to 11 V VIN Logic input voltage - -0.3 to 5.5 V VOUT - VSENSE Output to sense voltage drop - up to 12 V VS - VOUT Supply to output voltage drop - up to 12 V VSENSE Sense pins voltage - -1 to 1 V VREF Reference voltage input - -0.3 to 1 V IOUT,RMS Continuous power stage output current (OUTAx // OUTBx) - 2.6 Arms Tj,OP Operative junction temperature - -40 to 150 °C Tj,STG Storage junction temperature - -55 to 150 °C 2.2 Recommended operating conditions Table 2. Recommended operating conditions 6/26 Symbol Parameter Test condition Min. Typ. Max. Unit VS Supply voltage - 1.8 - 10 V VIN Logic input voltage - 0 - 5 V VREF Reference voltage input - 0.1 - 0.5 V tINw Logic input positive/negative pulse width - 300 - - ns DocID029872 Rev 2 STSPIN250 2.3 Electrical data Thermal data Table 3. Thermal data Symbol RthJA Parameter Conditions Value Unit Junction to ambient thermal resistance Natural convection, according to JESD51-2A (1) 57.1 °C/W RthJCtop Junction to case thermal resistance (top side) Simulation with cold plate on package top 67.3 °C/W RthJCbot Junction to case thermal resistance (bottom side) Simulation with cold plate on exposed pad 9.1 °C/W RthJB Junction to board thermal resistance According to JESD51-8(1) 23.3 °C/W 3.3 °C/W 22.6 °C/W Class Value Unit Conforming to ANSI/ESDA/JEDEC JS-001-2014 H2 2 kV Charge device model Conforming to ANSI/ESDA/JEDEC JS-001-2014 C2a 500 V ψJT ψJB Junction to top characterization Junction to board characterization According to JESD51-2A According to (1) JESD51-2A(1) 1. Simulated on a 21.2 x 21.2 mm board, 2s2p 1 Oz copper and four 300 m via below exposed pad. 2.4 ESD protections Table 4. ESD protection ratings Symbol Parameter HBM Human body model CDM Test condition DocID029872 Rev 2 7/26 26 Electrical characteristics 3 STSPIN250 Electrical characteristics Testing conditions: VS = 5 V, Tj = 25 °C, unless otherwise specified. Table 5. Electrical characteristics Symbol Parameter Test condition Min. Typ. Max. Unit Supply VSth(ON) VS turn-on voltage VS rising from 0 V 1.45 1.65 1.79 V VSth(OFF) VS turn-off voltage VS falling from 5 V 1.3 1.45 1.65 V VSth(HYS) VS hysteresis voltage - - 180 - 960 1300 A No commutations EN = 1 ROFF = 160 k - 1500 1950 A STBY = 0 V - 10 80 nA - - 0.9 V 1.48 - - V VS = 10 V IOUT = 1.3 A - 0.2 0.33 VS = 10 V IOUT = 1.3 A Tj = 125 °C(2) - 0.27 0.44 VS = 3 V, IOUT = 0.4 A - 0.27 0.4 OUTx = VS - - 1 -1 - - mV No commutations EN = 0 IS ROFF = 160 k VS supply current IS,STBY VS standby current VSTBYL Standby low logic level input voltage - VSTBYH Standby logic level input voltage - Power stage RDS(ON)HS+LS Total on resistance HS + LS(1) (OUTAx // OUTBx)  IDSS Leakage current VDF Freewheeling diode forward voltage ID = 1.3 A - 0.9 - V trise Rise time VS = 10 V; unloaded outputs - 10 - ns tfall Fall time VS = 10 V; unloaded outputs - 10 - ns tDT Dead time - - 50 - ns -15 - +15 mV ROFF = 10 k - 9 - µs ROFF = 160 k - 125 - µs OUTx = GND µA PWM current controller VSNS,OFFSET Sensing offset tOFF 8/26 Total OFF time VREF = 0.5 V Internal reference 20% VREF DocID029872 Rev 2 STSPIN250 Electrical characteristics Table 5. Electrical characteristics (continued) Symbol fOSC Parameter Test condition Min. Typ. Max. Unit -20% - +20% - - - 2% - Oscillator precision fOSC/fOSC,ID Total OFF time jittering ROFF = 10 k VIH High logic level input voltage - 1.6 - - V VIL Low logic level input voltage - - - 0.6 V FAULT open drain release voltage - - - 0.4 V Low logic level output voltage IOL = 4 mA - - 0.4 V RSTBY STBY pull-down resistance - - 36 - k IPDEN EN pull-down current - - 10.5 - µA EN input propagation delay From EN falling edge to OUT high impedance - 55 - ns tPWM,d(ON) PWM turn-on propagation delay See Figure 4 on page 14 - 125 - ns tPWM,d(OFF) PWM turn-off propagation delay See Figure 4 - 140 - ns PH propagation delay See Figure 4 - 125 - ns TjSD Thermal shutdown threshold - - 160 - °C TjSD,Hyst Thermal shutdown hysteresis - - 40 - °C Single OUT - 2 - OUTAx // OUTBx - 4 - tOFF,jitter Logic IOs VRELEASE VOL tENd tPH,d Protections IOC Overcurrent threshold A 1. Production test made on single outputs. 2. Based on characterization data on a limited number of samples, not tested during production. DocID029872 Rev 2 9/26 26 Pin description 4 STSPIN250 Pin description Figure 2. Pin connection (top view)  
                     
          
  Note: The exposed pad, TEST0 and TEST1 pins must be connected to ground. OUTA1 and OUTB1 must be connected together. OUTA2 and OUTB2 must be connected together. SENSEA and SENSEB must be connected together. Table 6. Pin description 10/26 No. Name Type Function 1 PH Logic input Phase input 2 PWM Logic input PWM input 3 OUTA1 Power output 4 SENSEA 5 OUTA2 Power output 6 VS Supply Device supply voltage. 7, EPAD GND Ground Device ground. 8 OUTB2 Power output 9 SENSEB Power bridge output side A1, must be connected to OUTB1. Power output Sense output A, must be connected to SENSEB. Power bridge output side A2, must be connected to OUTB2. Power bridge output side B2, must be connected to OUTA2. Power output Sense output B, must be connected to SENSEA. DocID029872 Rev 2 STSPIN250 Pin description Table 6. Pin description (continued) No. Name Type Function 10 OUTB1 Power output 11 REF Analog input Reference voltage for the current limiter circuitry. 12 TOFF Analog input Internal oscillator frequency adjustment. Power bridge output side B1, must be connected to OUTA1. Logic input 5 V compliant whit and open drain output. This is the power stage enable (when low the power stage is turned off) and it is forced low through the integrated open-drain MOSFET when a failure occurs. Logic input 5 V compliant. When forced low the device is forced into the low consumption mode. 13 EN\FAULT Logic input\ open drain output 14 STBY\RESET Logic input 15 TEST0 - Reserved pin. This pin must be connected to ground. 16 TEST1 - Reserved pin. This pin must be connected to ground. DocID029872 Rev 2 11/26 26 Typical applications 5 STSPIN250 Typical applications Table 7. Typical application values Name Value CS 2.2 µF / 16 V CSPOL 22 µF / 16 V RSNS 330 m / 1 W CEN 10 nF / 6.3 V REN 18 k CSTBY 1 nF / 6.3 V RSTBY 18 k CRCOFF 22 nF RRCOFF 1 k ROFF 47 k (tOFF 37 µs) Figure 3. Typical application schematic               ! 
                                12/26 DocID029872 Rev 2 STSPIN250 6 Device description Device description The STSPIN250 is a single brush DC motor driver integrating a PWM current controller and a power stage composed by a fully-protected full-bridge. 6.1 Standby and power-up The device provides a low settable consumption mode forcing the STBY\RESET input below the VSTBYL threshold. When the device is in the standby status, the power stage is disabled (outputs are in high impedance) and the supply to the integrated control circuitry is cut-off. 6.2 Motor driving The outputs of the full-bridge are controlled by the PWM and PH inputs as listed in Table 8. Table 8. Truth table EN\FAULT PH PWM OUTx1 OUTx2 0 X X HiZ HiZ 1 0 0 GND GND 1 0 1 GND VS 1 1 0 GND GND Both LS on 1 1 1 VS GND HSx1 and LSx2 on (current X1  X2) DocID029872 Rev 2 Full-bridge condition Disabled Both LS on HSx2 and LSx1 on (current X1  X2) 13/26 26 Device description STSPIN250 Figure 4. Timing diagram          
 

    
 14/26 DocID029872 Rev 2 STSPIN250 6.3 Device description PWM current control The device implements a current controller. The voltage on the sense pins (VSENSE) is compared to the reference voltage applied on the REF pin (VREF). When VSENSE > VREF, the current limiter is triggered, the OFF time counter is started, and the decay sequence is performed. The decay sequence starts turning on all the low sides of the full-bridge. After the programmed OFF time the system returns to the ON state. Table 9. ON and slow decay states PH 0 0 1 1 PWM ON Decay 0 HSx1 = OFF LSx1 = ON HSx2 = OFF LSx2 = ON N.A.(1) 1 HSx1 = OFF LSx1 = ON HSx2 = ON LSx2 = OFF HSx1 = OFF LSx1 = ON HSx2 = OFF LSx2 = ON 0 HSx1 = OFF LSx1 = ON HSx2 = OFF LSx2 = ON N.A.(1) 1 HSx1 = ON LSx1 = OFF HSx2 = OFF LSx2 = ON HSx1 = OFF LSx1 = ON HSx2 = OFF LSx2 = ON 1. During decays the input values are ignored until the system returns to ON condition (decay time expired). The reference voltage value, VREF, has to be selected according to the load current target value (peak value) and sense resistors value. Equation 1 VREF = RSNSx  ILOAD,peak In choosing the sense resistors value, two main issues must be taken into account:  The sensing resistor dissipates energy and provides dangerous negative voltages on the SENSE pins during the current recirculation. For this reason the resistance of this component should be kept low (using multiple resistors in parallel will help obtaining the required power rating with standard resistors).  The lower is the RSNSx value, the higher is the peak current error due to noise on the VREF pin and to the input offset of the current sense comparator: too low values of RSNSx must be avoided. DocID029872 Rev 2 15/26 26 Device description STSPIN250 Figure 5. PWM current control                                    
 16/26 DocID029872 Rev 2 STSPIN250 Device description TOFF adjustment The decay time is adjusted through an external resistor connected between the TOFF pin and ground as shown in Figure 6. A small RC series must be inserted in parallel with the regulator resistor in order to increase the stability of the regulation circuit according indications listed in Table 10. Figure 6. OFF time regulation circuit         
 The relation between the OFF time and the external resistor value is shown in the graph of Figure 7. The value typically ranges from 10 µs to 150 µs. Table 10. Recommended RRCOFF and CRCOFF values according to ROFF ROFF RRCOFF CRCOFF 10 k  ROFF < 82 k 1 k 22 nF 82 k  ROFF  160 k 2.2 k 22 nF Figure 7. OFF time vs ROFF value             2))UHVLVWRU >N $0 DocID029872 Rev 2 17/26 26 Device description 6.4 STSPIN250 Overcurrent and short-circuit protections The device embeds circuitry protecting each power output against the overload and shortcircuit conditions (short-circuit to ground, short-circuit to VS and short-circuit between outputs). When the overcurrent or the short-circuit protection is triggered, the power stage is disabled and the EN\FAULT input is forced low through the integrated open-drain MOSFET discharging the external CEN capacitor. The power stage is kept disabled and the open-drain MOSFET is kept ON until the EN\FAULT input falls below the VRELEASE threshold, then the CEN capacitor is charged through the REN resistor. Figure 8. Overcurrent and short-circuit protections management                   &"%""$ !" $$       '" #$   $#"  $" $   $
  The total disable time after an overcurrent event can be set by properly sizing the external network connected to the EN\FAULT pin (refer to Figure 9 and Figure 10): Equation 2 tDIS = tdischarge + tcharge But tcharge is normally very higher than tdischarge we can consider only the second one contribution: Where VDD is the pull-up voltage of the REN resistor. 18/26 DocID029872 Rev 2 STSPIN250 Device description Figure 9. Disable time versus REN and CEN values (VDD = 3.3 V)  5(1 N: 5(1 N: 5(1 N: 'LVDEOH WLPH >—V@ 5(1 N: 5(1 N: 5(1 N:              &(1 >Q)@ $0 Figure 10. Disable time versus REN and CEN values (VDD = 1.8 V)  5 (1  N: 5 (1 N: 5 (1 N: 5 (1 N: 5 (1 N: 'LVDEOH WLPH >—V@ 5 (1 N:              &(1 >Q)@ $0 DocID029872 Rev 2 19/26 26 Device description 6.5 STSPIN250 Thermal shutdown The device embeds circuitry protecting it from the overtemperature condition. When the thermal shutdown temperature is reached the power stage is disabled and the EN\FAULT input is forced low through the integrated open-drain MOSFET. The protection and the EN\FAULT output are released when the IC temperature returns below a safe operating value (TjSD - TjSD,Hyst). Figure 11. Thermal shutdown management                          $! %'&#("   
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                22/26 DocID029872 Rev 2 STSPIN250 8 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 8.1 VFQFPN 3 x 3 x 1.0- 16L package information Figure 15. VFQFPN 3 x 3 x 1.0 - 16L package outline DocID029872 Rev 2 23/26 26 Package information STSPIN250 Table 11. VFQFPN 3 x 3 x 1.0 - 16L package mechanical data(1) Dimensions (mm) Symbol Min. Typ. Max. A 0.80 0.90 1.00 A1 - 0.02 - A3 - 0.20 - b 0.18 0.25 0.30 D 2.85 3.00 3.15 D2 1.70 1.80 1.90 E 2.85 3.00 3.15 E2 1.70 1.80 1.90 e - 0.50 - L 0.45 0.50 0.55 1. VFQFPN stands for “Thermally Enhanced Very thin Fine pitch Quad Packages No lead”. Very thin: 0.80 < A  1.00 mm / fine pitch: e < 1.00 mm. The pin #1 identifier must exist on the top surface of the package by using indentation mark or other feature of the package body. Figure 16. VFQFPN 3 x 3 x 1.0 - 16L recommended footprint 24/26 DocID029872 Rev 2 STSPIN250 9 Ordering information Ordering information Table 12. Device summary 10 Order code Package Packaging STSPIN250 VFQFPN 3 x 3 x1.0 - 16L Tape and reel Revision history Table 13. Document revision history Date Revision 17-Oct-2016 1 Initial release. 2 Updated document status to: Datasheet - production data on page 1. Updated Figure 1 on page 5 and Figure 12 on page 21 (replaced by new figures). Updated Table 2 on page 6 (added new parameter tINw). Minor modifications throughout document. 04-Nov-2016 Changes DocID029872 Rev 2 25/26 26 STSPIN250 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 26/26 DocID029872 Rev 2