STTH1003SG-TR

STTH1003S High efficiency rectifier Datasheet - production data Description $ The STTH1003S is an ultrafast recovery power rectifier dedicated to energy recovery in PDP applications. . $ . . $ $ $ It is especially designed for clamping function in energy recovery block. The compromise between forward voltage drop and recovery time offers optimized performances. '3$. $ Table 1. Device summary Symbol Value IF(AV) 10 A Features VRRM 300 V  Ultrafast recovery trr(typ) 13 ns  Low power losses Tj (max) 175 °C  High surge capability VF(typ) 0.9 V  Low leakage current  High junction temperature  ECOPACK®2 compliant component for DPAK on demand November 2016 This is information on a product in full production. DocID11604 Rev 6 1/9 www.st.com Characteristics 1 STTH1003S Characteristics Table 2. Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 300 V IF(RMS) Forward rms current 20 A IF(AV) Average forward current  = 0.5, square wave Tc = 150 °C 10 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 100 A IRSM Non repetitive peak reverse current tp = 20 µs square 4 A Tstg Storage temperature range -65 to +175 °C 175 °C Tj Maximum operating junction temperature Table 3. Thermal resistance Symbol Rth(j-c) Parameter Junction to case Package Max. value Unit 4 °C/W DPAK Table 4. Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 10 A 1. Pulse test: tp = 5 ms,  < 2% 2. Pulse test: tp = 380 µs,  < 2% To evaluate the conduction losses, use the following equation: P = 0.86 x IF(AV) + 0.024 x IF2(RMS)) 2/9 DocID11604 Rev 6 Min. Typ. Max. - - 10 - 10 100 - - 1.30 - 0.90 1.10 Unit µA V STTH1003S Characteristics Table 5. Dynamic electrical characteristics Symbol trr Test conditions Parameter Reverse recovery time Tj = 25 °C Min. Typ. Max. Unit IF = 0.5 A Irr = 0.25 A IR = 1 A - IF = 1 A VR = 30 V dIF/dt = -50 A/µs - 28 35 13 17 ns tfr Forward recovery time IF = 10 A VFR = 1.1 x VFmax dIF/dt = 100 A/µs - - 200 ns VFP Peak forward voltage IF = 10 A dIF/dt = 100 A/µs - 2.5 3.5 V IRM Reverse recovery current - 5.7 7.5 A - 0.3 - - Sfactor Softness factor IF = 10 A Tj = 125 °C VR = 200 V dIF/dt = 200 A/µs DocID11604 Rev 6 3/9 9 Characteristics STTH1003S Figure 1. Forward voltage drop versus forward Figure 2. Peak reverse recovery current versus current (maximum values) dIF/dt (typical values) ,)$  IRM(A) 16 7M ƒ& VR=200V Tj=125°C 14 IF = 2xIF(AV) 7M ƒ& 12  IF = IF(AV) 7M ƒ& 10 IF = 0.5xIF(AV) 8 6  4 2 9)9        dIF/dt(A/µs) 0 0   50 100 150 200 250 300 350 400 450 500  Figure 3. Reverse recovery time versus dIF/dt (typical values) Figure 4. Softness factor versus dIF/dt (typical values) 6IDFWRU trr(ns)  100 VR=200V Tj=125°C 90 95 9 7M ƒ&  80 70  IF = 2xIF(AV) 60 IF = IF(AV)  50 40  30 IF = 0.5xIF(AV) 20  10 G, )GW$—V dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 Figure 5. Relative variations of dynamic parameters versus junction temperature (reference: Tj = 125 °C)             Figure 6. Transient peak forward voltage versus dIF/dt (typical values)  VFP(V)  8  6IDFWRU IF=IF(AV) Tj=125°C 7   6   5  4   3 ,50  2  1  0  4/9 dIF/dt(A/µs) 7Mƒ&      0 50 DocID11604 Rev 6 100 150 200 250 300 350 400 450 500 STTH1003S Characteristics Figure 7. Forward recovery time versus dIF/dt (typical values) tfr(ns) 300 IF=IF(AV) VFR=1.1 x VF max. Tj=125°C 250 200 150 100 50 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 DocID11604 Rev 6 350 400 450 500 5/9 9 Package Information 2 STTH1003S Package Information  Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DPAK package information Figure 8. DPAK package outline ( $ E F 7KHUPDOSDG ( / ' ' 5 + / $ E H H 5 F $ / /  Note: 6/9 9 *DXJH SODQH This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID11604 Rev 6 STTH1003S Package Information Table 6. DPAK package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.214 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.264 E1 4.32 5.50 0.170 0.216 e 2.28 0.090 e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.00 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° 8° Figure 9. DPAK footprint dimensions (in mm)      % 7KHGHYLFHPXVWEHSRVLWLRQHGZLWKLQ DocID11604 Rev 6 $   $ % 7/9 9 Ordering Information 3 STTH1003S Ordering Information Table 7. Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode STTH1003SB-TR STTH1 003S DPAK 0.32 g 2500 Tape and reel Revision history Table 8. Document revision history 8/9 Date Revision Description of changes 24-Aug-2005 1 First issue. 18-May-2009 2 Reformatted to current standards. Modified configuration diagram on front page. 01-Apr-2014 3 Updated dimensions F1 and F2 in TO-220FPAB package dimensions. 01-Aug-2014 4 Updated DPAK package information and removed D²PAK and TO-220FPAB package and characteristics. 17-Sep-2014 5 Updated Figure 8 and Figure 9. 14-Nov-2016 6 Updated DPAK package information and reformatted to current standard. DocID11604 Rev 6 STTH1003S IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID11604 Rev 6 9/9 9