STTH102RL

STTH102 Datasheet 200 V - 1 A high efficiency ultrafast diode A K A A K K DO-41 SMA Features • • • • Very low conduction losses Negligible switching losses Low forward voltage drop High junction temperature • ECOPACK®2 compliant Applications • • • • Switching diode LED Lighting Auxiliary power supply Flyback diode Description The STTH102 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. Packaged in SMA and DO-41, the STTH102 is ideal for use as a free wheeling diode in power supplies and other power switching applications. Product status STTH102 Product summary Symbol Value IF(AV) 1A VRRM 200 V T j(max.) 175 °C VF(typ.) 0.68 V trr(typ.) 12 ns DS2448 - Rev 6 - December 2018 For further information contact your local STMicroelectronics sales office. www.st.com STTH102 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current δ = 0.5, square wave IFSM Surge non repetitive forward current Tstg Storage temperature range Tj SMA TL = 145 °C DO-41 TL = 130 °C SMA DO-41 Value Unit 200 V 1 A 40 tp = 10 ms sinusoidal 50 A -65 to +175 °C +175 °C Operating junction temperature Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Max. value Junction to lead Junction to lead Lead length = 10 mm SMA 30 DO-41 50 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 1 A Typ. - 1 1 - Max. 25 0.97 0.68 0.78 Unit µA V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.65 x IF(AV) + 0.130 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS2448 - Rev 6 page 2/12 STTH102 Characteristics Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise stated) Symbol Test conditions Min. Typ. Max. Unit 20 ns trr Reverse recovery time IF = 0.5 A, Irr = 0.25 A, IR = 1 A - 12 tfr Forward recovery time IF = 1 A, dIF/dt = 50 A/ms, VFR = 1.1 VF(max.) - 50 ns Forward recovery voltage IF = 1 A, dIF/dt = 50 A/µs - 1.8 V VFP DS2448 - Rev 6 Parameters page 3/12 STTH102 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (SMA) PF(AV) (W) Figure 2. Average forward power dissipation versus average forward current (DO-41) 1.0 1.0 δ = 0.05 0.9 δ = 0.1 δ = 0.2 δ = 0.5 PF(AV) (W) δ = 0.05 0.9 δ = 0.1 δ = 0.2 δ = 0.5 0.8 0.8 δ=1 0.7 δ=1 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 T 0.2 0.1 IF(AV)(A) δ =tp/T 0.0 0.0 0.2 0.4 0.6 0.8 1.0 T 0.2 0.1 tp IF(AV)(A) δ =tp/T 0.0 1.2 Figure 3. Average forward current versus ambient temperature (δ = 0.5) (SMA) 0.00 0.25 0.50 0.75 1.00 tp 1.25 Figure 4. (DO-41)Average forward current versus ambient temperature (δ = 0.5) (DO-41) IF(AV)(A) IF(AV)(A) 1.2 1.2 Rth(j-a) =Rt h(j-I) Rth(j-a) =Rt h(j-I) 1.0 1.0 0.8 0.8 Rth(j-a) =120°C/W 0.6 0.6 Rth(j-a) =110°C/W 0.4 0.4 T T 0.2 d=tp/T 0.0 0 25 0.2 Tamb (°C) tp 50 75 100 125 150 175 d=tp/T 0.0 0 DS2448 - Rev 6 25 Tamb (°C) tp 50 75 100 125 150 175 page 4/12 STTH102 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit to ambient versus pulse duration (DO-41) board, e(Cu) = 35 μm,recommended pad layout) (SMA) 1.0 Zth (j-c)/Rt h(j-c) Zth(j-a)/ Rth(j-a) 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0.1 0.0 1.E-01 t p (s) Single pulse 1.E+00 1.E+01 1.E+02 t p( s ) Single pulse 0.0 1.E+03 Figure 7. Forward voltage drop versus forward current 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 8. Junction capacitance versus reverse voltage applied (typical values) IF (A) C (pF) 100.0 100 F=1MHz VOSC=30mV RMS Tj =25°C Tj =125°C (maximum values) 10.0 Tj =125°C (typical values) Tj =25°C (maximum values) 10 1.0 VF ( V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 VR (V) 1.4 1.6 1.8 2.0 2.2 2.4 Figure 9. Relative variations of dynamic parameters versus junction temperature 3.5 IR M; t rr ; Qrr [Tj ] / IR M; t rr ; Qrr [Tj =25°C ] 1 1 10 100 1000 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 Rth(j-a)(°C/W) SMA IF=I F(AV) dIF/dt=200A/µs VR=100V 150 3.0 QRR 2.5 100 2.0 Epoxy printed board FR4, eCu = 35 µm trr 1.5 50 IRM SCu (cm²) Tj (°C) 1.0 25 DS2448 - Rev 6 50 75 100 0 125 150 175 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 5/12 STTH102 Characteristics (curves) Figure 11. Thermal resistance versus lead length (DO-41) Rth(°C/W) 120 Rth(j-a) 100 80 60 Rth(j-I) 40 20 Lleads(mm) 0 5 DS2448 - Rev 6 10 15 20 25 page 6/12 STTH102 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 DO-41 package information • Epoxy meets UL 94, V0 Figure 12. DO-41 package outline C C A ØD ØB Table 5. DO-41 package mechanical data Dimensions Ref. DS2448 - Rev 6 Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 4.07 - 5.20 0.160 - 0.205 B 2.04 - 2.71 0.080 - 0.107 C 25.40 - 1.000 - D 0.71 - 0.028 - 0.86 0.0034 page 7/12 STTH102 SMA package information 2.2 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 13. SMA package outline E1 D E A1 C A2 L b Table 6. SMA package mechanical data Dimensions Millimeters Ref. DS2448 - Rev 6 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 8/12 STTH102 SMA package information Figure 14. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS2448 - Rev 6 page 9/12 STTH102 Ordering information 3 Ordering information Table 7. Ordering information DS2448 - Rev 6 Order code Marking Package Weight Base qty. Delivery mode STTH102A U12 SMA 0.068 g 5000 Tape and reel STTH102 STTH102 DO-41 0.34 g 2000 Ammopack STTH102RL STTH102 DO-41 0.34 g 5000 Tape and reel page 10/12 STTH102 Revision history Table 8. Document revision history Date DS2448 - Rev 6 Revision Changes Jul-2003 2A Last update. Aug-2004 3 SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm (0.080). SMA and DO-41 datasheets merged. 27-Jun-2005 4 Corrected error in title. 21-Nov-2006 5 Reformatted to current standards. Added Table 4. Dynamic electrical characteristics. Updated dimensions table for DO-41 plastic package. Added cathode bands to package illustrations. 05-Dec-2018 6 Add electrical schematics of single diode and ECOPACK®2 compliant. page 11/12 STTH102 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS2448 - Rev 6 page 12/12