STTH108_09

STTH108 High voltage ultrafast rectifier Features ■ ■ ■ ■ ■ Low forward voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology K SMA (JEDEC DO-214AC) STTH108A A A K DO-41 STTH108 Description The STTH108, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. Table 1. Device summary Symbol IF(AV) VRRM Tj (max) VF(max) Value 1A 800 V 175 °C 1.25 V October 2009 Doc ID 9342 Rev 3 1/6 www.st.com 6 Characteristics STTH108 1 Characteristics Table 2. Symbol VRRM V(RMS) IF(AV) Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage Voltage rms SMA Average forward current DO-41 Forward Surge current Storage temperature range Maximum operating junction temperature t = 8.3 ms DO-41 25 -50 to + 175 175 °C °C TL = 110 °C δ = 0.5 TL = 130 °C δ = 0.5 SMA Value 800 560 1 20 A Unit V V A IFSM Tstg Tj Table 3. Symbol Rth(j-l) Rth(j-a) Thermal resistance Parameter SMA Junction to lead Lead length = 10 mm Junction to ambient Lead length = 10 mm DO-41 DO-41 45 110 °C/W Value 30 Unit Table 4. Symbol IR Static electrical characteristics Parameter Reverse leakage current Forward voltage drop Tests conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = 800 V Min. Typ. Max. 5 µA 1 50 1.65 IF = 1 A V 0.89 1.25 Unit VF To evaluate the conduction losses use the following equation: P = 1.05 x IF(AV) + 0.20 IF2(RMS) Table 5. Symbol trr Dynamic electrical characteristics Parameter Reverse recovery time Forward recovery time Tests conditions Tj = 25 °C IF = 0.5 A, Irr = 0.25 A IR = 1 A IF = 1 A, dIF/dt = 50 A/ms VFR = 1.1 x VFmax IF = 1 A, dIF/dt = 50 A/ms Min. Typ. Max. 75 Unit ns tfr Tj = 25 °C 200 ns VFP Forward T = 25 °C recovery voltage j 12 V 2/6 Doc ID 9342 Rev 3 STTH108 Characteristics Figure 1. P(W) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.1 0.2 Conduction losses versus average Figure 2. current IFM(A) δ = 0.05 δ = 0.1 δ = 0.2 100.0 Forward voltage drop versus forward current δ = 0.5 Tj=150°C (maximum values) δ=1 10.0 Tj=150°C (typical values) Tj=25°C (maximum values) 1.0 T IF(AV)(A) 0.3 0.4 0.5 0.6 0.7 0.8 0.9 δ=tp/T 1.0 1.1 tp 0.1 1.2 0.0 0.5 1.0 1.5 VFM(V) 2.0 2.5 3.0 3.5 4.0 4.5 Figure 3. Relative variation of thermal Figure 4. impedance junction ambient versus pulse duration (DO-41) 1.0 0.9 0.8 0.7 Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) (SMA) Zth(j-c)/Rth(j-c) 1.0 epoxy FR4, leads = 10 mm 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01 1.E+00 1.E+01 δ = 0.2 δ = 0.1 Single pulse δ = 0.5 Zth(j-c)/Rth(j-c) 0.6 0.5 0.4 0.3 δ = 0.5 δ = 0.2 δ = 0.1 T 0.2 0.1 T tp(s) δ=tp/T 1.E+02 tp 0.0 1.E+03 Single pulse tp(s) 1.E+00 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 1.E-01 Figure 5. Thermal resistance junction to ambient versus copper surface under each lead (DO-41) epoxy printed circuit board FR4, copper thickness: 35 µm Figure 6. Thermal resistance junction to ambient versus copper surface under each lead (SMA) epoxy printed circuit board FR4, copper thickness: 35 µm Rth(j-a)(°C/W) 120 110 100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 9 10 140 130 120 110 100 90 80 70 60 50 40 30 20 Rth(j-a)(°C/W) S(cm²) 10 0 0.0 0.5 1.0 1.5 2.0 S(cm²) 2.5 3.0 3.5 4.0 4.5 5.0 Doc ID 9342 Rev 3 3/6 Package information STTH108 2 Package information ● ● ● Epoxy meets UL 94, V0 Band indicates cathode Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. SMA dimensions Dimensions E1 Ref. Millimeters Min. Max. 2.45 0.20 1.65 0.40 2.90 5.35 4.60 1.50 Inches Min. 0.075 0.002 0.049 0.006 0.089 0.189 0.156 0.030 Max. 0.094 0.008 0.065 0.016 0.114 0.211 0.181 0.059 D A1 A2 b 1.90 0.05 1.25 0.15 2.25 4.80 3.95 0.75 E c A1 D E E1 L C L A2 b Figure 7. Footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43 Table 7. DO-41 (plastic) package dimensions Dimensions Ref. ØD ØB Millimeters Min. Max. 5.20 2.71 Inches Min. 0.160 0.080 1 Max. 0.205 0.107 A B C A C 4.07 2.04 25.4 0.71 C D 0.86 0.028 0.034 4/6 Doc ID 9342 Rev 3 STTH108 Ordering information 3 Ordering information Table 8. Ordering information Marking STTH108 H08 STTH108 Package DO-41 SMA DO-41 Weight 0.34 g 0.068 g 0.34 g Base qty 2000 5000 5000 Delivery mode Ammopack Tape and reel Tape and reel Order code STTH108 STTH108A STTH108RL 4 Revision history Table 9. Date Jan-2003 30-Sep-2009 Document revision history Revision 2 3 Last update. Updated table 7 package dimensions. Changes Doc ID 9342 Rev 3 5/6 STTH108 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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