STTH10LCD06CFP

STTH10LCD06C Turbo 2 ultrafast - high voltage rectifier for SMPS Features A1 ■ Ultrafast switching A2 ■ Low reverse current ■ Low thermal resistance ■ Reduces conduction and switching losses K Description A1 The STTH10LCD06C uses ST Turbo2 technology. This device is specially suited for switching power supplies working with interleaved PFCs. K A2 K A1 A2 TO-220AB STTH10LCD06CT TO-220FPAB STTH10LCD06CFP K A2 A1 D2PAK STTH10LCD06CG-TR Table 1. April 2011 Doc ID 15897 Rev 3 Device summary IF(AV) 2 x 5A VRRM 600 V Tj 175 °C VF (typ) 1.25 V trr (max) 25 ns 1/10 www.st.com 10 Characteristics 1 STTH10LCD06C Characteristics Table 2. Absolute ratings(1) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward current rms 20 A Per diode 5 A Per device 10 A Per diode 5 A Per device 10 A 60 A -65 to + 175 °C 175 °C Value Unit IF(AV) Tc = 130 °C TO-220AB, D2PAK Tc = 100 °C TO-220FPAB Average forward current, δ = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal Tstg Storage temperature range Tj Maximum operating junction temperature(2) 1. Limiting values per diode at 25 °C, unless otherwise specified 2. 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Symbol IR(1) Parameter 4.5 TO-220FPAB 7.5 °C/W Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C VF(2) TO-220AB, D2PAK Junction to case(per diode) Forward voltage drop Tj = 150 °C Tj = 25 °C Tj = 150 °C Min. Max. Unit 1 VR = VRRM µA 5 50 2 IF = 5 A 1.25 1.6 V 2.35 IF = 10 A 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 1.2 x IF(AV) + 0.08 x IF2(RMS) 2/10 Typ. Doc ID 15897 Rev 3 1.55 2 STTH10LCD06C Table 5. Characteristics Dynamic electrical characteristics Symbol trr Test conditions Parameter tfr VFP Max. Unit 25 ns IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C 35 50 Reverse recovery current IF = 5 A, dIF/dt = -50 A/µs, VR = 400 V, Tj = 125 °C 1.8 2.5 A Forward recovery time IF = 5 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax, Tj = 25 °C 100 ns Forward recovery voltage IF = 5 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax, Tj = 25 °C Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) PF(AV)(W) 12 Typ. IF = 0.5 A, Irr = 0.25 A, IR = 1 A, Tj = 25 °C Reverse recovery time IRM Min. 50 δ = 0.05 10 δ = 0.1 δ = 0.2 δ = 0.5 δ=1 5 V Forward voltage drop versus forward current (per diode) IFM(A) Tj = 150 °C (Maximum values) 40 8 30 Tj = 150 °C (Typical values) 6 20 4 Tj = 25 °C (Maximum values) T 10 2 0 1 Figure 3. 1.0 0.9 δ = tp / T IF(AV)(A) 0 2 3 4 5 tp 6 7 0.5 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, D2PAK) Zth(j-c)/Rth(j-c) 1.0 TO-220AB D2PAK 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.2 VFM(V) 0 0.0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) TO-220FPAB 0.3 Single pulse 0.2 Single pulse 0.1 0.0 1.E-04 tp(s) 1.E-03 1.E-02 1.E-01 1.E+00 0.1 0.0 1.E-03 Doc ID 15897 Rev 3 tp(s) 1.E-02 1.E-01 1.E+00 1.E+01 3/10 Characteristics Figure 5. STTH10LCD06C Figure 6. Peak reverse recovery current versus dIF/dt (typical values, per diode) IRM(A) 10 t (ns) 200 RR IF = IF(AV) VR = 400 V Tj = 125 °C 9 8 Reverse recovery time versus dIF/dt (typical values, per diode) IF = IF(AV) VR = 400 V Tj = 125 °C 180 160 7 140 6 120 5 100 4 80 3 60 2 40 20 1 dIF/dt (A/µs) 0 0 50 Figure 7. 350 100 150 200 250 300 350 400 450 500 Reverse recovery charges versus dIF/dt (typical values, per diode) QRR (nC) 0 50 Figure 8. 100 150 200 250 300 350 450 500 Reverse recovery softness factor versus dIF/dt (typical values, per diode) IF = IF(AV) VR = 400 V Tj = 125 °C 4.5 4.0 250 400 SFACTOR 5.0 IF = IF(AV) VR = 400 V Tj = 125 °C 300 dIF/dt (A/µs) 0 3.5 3.0 200 2.5 150 2.0 100 1.5 1.0 50 dIF/dt (A/µs) 0 0 50 Figure 9. 100 150 200 250 300 350 400 450 Relative variations of dynamic parameters versus junction temperature 18 IF = IF(AV) VR = 400 V Refernce Tj = 125 °C 100 150 200 250 300 350 400 450 500 IF = IF(AV) Tj = 125 °C 14 12 IRM 10 8 SFACTOR 6 4 0.2 QRR 4/10 50 VFP(V) 16 0.4 0.0 25 0 Figure 10. Transient peak forward voltage versus dIF/dt (typical values, per diode) 0.8 0.6 dIF/dt (A/µs) 0.0 500 1.2 1.0 0.5 Tj (°C) 50 75 100 125 2 dIF/dt (A/µs) 0 0 50 Doc ID 15897 Rev 3 100 150 200 250 300 350 400 450 500 STTH10LCD06C Characteristics Figure 11. Forward recovery time versus dIF/dt Figure 12. Junction capacitance versus (typical values, per diode) reverse voltage applied (typical values, per diode) t (ns) 160 FR 100 C (pF) F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C IF = IF(AV) VR = 1.1 x VFmax. Tj = 125 °C 140 120 100 10 80 60 40 20 dIF/dt (A/µs) 0 0 50 100 150 200 250 300 350 400 450 VR (V) 1 1 500 10 100 1000 Figure 13. Thermal resistance junction to ambient versus copper surface under tab 80 Rth(j-a)(°C/W) Epoxy printed board Fr4, copper thickness: 35 µm D2PAK 70 60 50 40 30 20 10 Scu(cm²) 0 0 5 10 15 20 25 Doc ID 15897 Rev 3 30 35 40 5/10 Package information 2 STTH10LCD06C Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. TO-220AB dimensions Dimensions Ref. Dia Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 C L5 L7 L6 L2 F2 D L9 L4 L2 F M G1 Inches A H2 F1 Millimeters 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 E G M Diam. 6/10 Doc ID 15897 Rev 3 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 STTH10LCD06C Table 7. Package information TO-220FPAB dimensions Dimensions Ref. A B H Dia L6 L2 L7 L3 L5 F1 L4 D F2 F Millimeters Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 E G1 G Doc ID 15897 Rev 3 Inches 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 7/10 Package information Table 8. STTH10LCD06C D2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 8/10 Doc ID 15897 Rev 3 0.40 typ. 0° 0.016 typ. 8° 0° 8° STTH10LCD06C 3 Ordering information Ordering information Table 9. 4 Ordering information Order code Marking Package Weight STTH10LCD06CT STTH10LCD06CT TO-220AB 2.23 g 50 Tube 2 Base qty. Delivery mode STTH10LCD06CG-TR STTH10LCD06CG D PAK 1.48 g 1000 Tape and reel STTH10LCD06CFP STTH10LCD06C TO-220FPAB 2.04 g 50 Tube Revision history Table 10. Document revision history Date Revision Changes 15-Jul-2009 1 First issue. 17-Jan-2011 2 Updated dimensions and graphic in Table 7. 07-Apr-2011 3 Added (per diode) in Table 3. Doc ID 15897 Rev 3 9/10 STTH10LCD06C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 Doc ID 15897 Rev 3