STTH112

STTH112 High voltage ultrafast rectifier Features ■ Low forwarded voltage drop ■ High reliability ■ High surge current capability ■ Soft switching for reduced EMI disturbances ■ Planar technology DO-41 STTH112 Description The STTH112, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications SMA STTH112A Table 1. October 2009 Doc ID 9343 Rev 5 SMB STTH112U Device summary Symbol Value IF(AV) 1A VRRM 1200 V Tj (max) 175 °C VF (max) 1.65 V 1/8 www.st.com 8 Electrical characteristics 1 STTH112 Electrical characteristics Absolute ratings (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 1200 V V(RMS) Voltage rms 850 V 1 A Tl = 85°C IF(AV) Average forward current δ =0.5 DO-41 Tl = 115°C δ =0.5 SMA Tl = 125°C δ =0.5 SMB DO-41 IFSM Forward surge current t = 8.3 ms 20 SMA A 18 SMB Tstg Tj Table 2. Storage temperature range Table 3. Symbol IR VF Table 4. Symbol 2/8 °C Value Unit Parameter Junction to lead DO-41 45 SMA 30 SMB 25 DO-41 110 °C/W Junction to ambient L = 10 mm Static electrical characteristics Parameter Reverse leakage current Forward voltage drop Tests conditions VR = 1200 V IF = 1 A Min. Typ. Max. Tj = 25 °C 5 Tj = 125 °C 50 Tj = 25 °C 1.9 Unit µA Tj = 125 °C 1.17 1.65 V Tj = 150 °C 1.10 1.55 Typ. Max. Unit 75 ns 500 ns 30 V Dynamic electrical characteristics Parameter trr Reverse recovery time tfr Forward recovery time VFP + 175 Thermal parameters L = 10 mm Rth (j-a) °C Maximum operating junction temperature Symbol Rth (j-l) - 50 + 175 Forward recovery voltage Tests conditions IF = 0.5 A Irr = 0.25 A IR = 1A Tj = 25 °C IF = 1 A dIF/dt = 50 A/µs VFR = 1.1 x VFmax Tj = 25 °C Doc ID 9343 Rev 5 Min. STTH112 Figure 1. Electrical characteristics Conduction losses versus average Figure 2. current Forward voltage drop versus forward current IFM(A) P(W) 2.2 2.0 δ = 0.05 δ = 0.1 100.0 δ = 0.2 δ = 0.5 Tj=125°C (maximum values) 1.8 1.6 δ=1 1.4 Tj=125°C (typical values) 10.0 1.2 Tj=25°C (maximum values) 1.0 0.8 1.0 0.6 T 0.4 IF(AV)(A) 0.2 δ=tp/T 0.0 0.0 0.1 Figure 3. 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 VFM(V) tp 0.1 1.0 1.1 1.2 0.0 0.5 Relative variation of thermal Figure 4. impedance junction ambient versus pulse duration (DO-41) Zth(j-c)/Rth(j-c) 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) (SMA) Zth(j-c)/Rth(j-c) 1.0 1.0 epoxy FR4, Lleads = 10mm 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 δ = 0.5 0.5 0.5 0.4 0.4 0.3 0.2 0.1 0.3 δ = 0.2 T Single pulse tp(s) 0.0 Figure 5. 1.E+00 1.E+01 tp tp(s) Single pulse δ=tp/T 0.0 1.E+02 1.E+03 1.E-01 1.E+00 Relative variation of thermal Figure 6. impedance junction ambient versus pulse duration (epoxy FR4)(SMB) 1.E+01 tp 1.E+02 1.E+03 Thermal resistance junction to ambient versus copper surface under each lead (DO-41, SMB) Rth(j-a)(°C/W) Zth(j-c)/Rth(j-c) 1.0 110 0.9 100 epoxy printed circuit board FR4, copper thickness: 35µm 90 0.8 DO-41 Lleads=10mm 80 0.7 0.6 δ = 0.1 0.1 δ=tp/T T δ = 0.2 0.2 δ = 0.1 1.E-01 δ = 0.5 70 δ = 0.5 SMB 60 0.5 50 0.4 40 0.3 δ = 0.2 30 T 0.2 20 δ = 0.1 0.1 tp(s) Single pulse 0.0 1.E-01 1.E+00 1.E+01 δ=tp/T 1.E+02 tp 10 S(cm²) 0 1.E+03 0 Doc ID 9343 Rev 5 1 2 3 4 5 6 7 8 9 10 3/8 Electrical characteristics Figure 7. STTH112 Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35µm) (SMA) Rth(j-a)(°C/W) 140 130 120 110 100 90 80 SMA 70 60 50 40 30 20 S(cm²) 10 0 0.0 4/8 0.5 1.0 1.5 2.0 2.5 3.0 Doc ID 9343 Rev 5 3.5 4.0 4.5 5.0 STTH112 2 Package information Package information ● Epoxy meets UL 94, V0 ● Band indicates cathode ● Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMA dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L Figure 8. Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 b Footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43 Doc ID 9343 Rev 5 5/8 Package information Table 6. STTH112 SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L Figure 9. b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 Footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Table 7. DO-41 (plastic) dimensions Dimensions Ref. 6/8 A C Doc ID 9343 Rev 5 Inches Min. Max. Min. Max. A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107 C 25.4 D 0.71 ØD ØB C Millimeters 1 0.86 0.028 0.034 STTH112 3 Ordering information Ordering information Table 8. 4 Ordering information Order code Marking Package Weight Base qty Delivery Mode STTH112 STTH112 DO-41 0.34 g 2000 Ammopack STTH112A H12 SMA 0.068 g 5000 Tape and reel STTH112U U12 SMB 0.11 g 2500 Tape and reel STTH112RL STTH112 DO-41 0.34 g 5000 Tape and reel Revision history Table 9. Document revision history Date Revision Changes Jan-2003 2 Initial release. 22-Jun-2005 3 New value of Tj = 150 °C added to table 2. Dimensions A1 E and D updated in Table 4. Data sheet reformatted. No other technical changes. 20-Mar-2007 4 Reformatted to current standards. Updated dimensions and footprints for SMA and SMB packages. 30-Sep-2009 5 Updated table 7 package dimensions. Doc ID 9343 Rev 5 7/8 STTH112 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Doc ID 9343 Rev 5