STTH1512W

STTH1512 Ultrafast recovery - 1200 V diode Main product characteristics A K IF(AV) VRRM Tj VF (typ) trr (typ) 15 A 1200 V 175° C 1.20 V 53 ns K A K DOP3I STTH1512PI A K DO247 STTH1512W Features and benefits ■ ■ ■ ■ ■ ■ Ultrafast, soft recovery Very low conduction and switching losses High frequency and/or high pulsed current operation High reverse voltage capability High junction temperature Insulated packages: DOP3I Electrical insulation = 2500 VRMS Capacitance = 12 pF K A K TO-220AC STTH1512D A A D2PAK STTH1512G Order codes Description Part Number Marking STTH1512D STTH1512G STTH1512G STTH1512W STTH1512PI The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. STTH1512D STTH1512G STTH1512G-TR STTH1512W STTH1512PI March 2006 Rev 1 www.st.com 1/11 11 Characteristics STTH1512 1 Table 1. Symbol VRRM IF(RMS) IF(AV) IFRM IFSM Tstg Tj Characteristics Absolute ratings (limiting values at 25° C, unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward current Average forward current, δ = 0.5 Repetitive peak forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature TO-220AC / DO247 / DOP3I / D PAK TO-220AC / DOP3I tp = 5 µs, F = 5 kHz square tp = 10 ms Sinusoidal D2 PAK / DO247 Tc = 130° C Tc = 105° C 200 150 -65 to + 175 175 A A °C °C 2 Value 1200 50 15 Unit V A A Table 2. Symbol Rth(j-c) Thermal parameters Parameter TO-220AC / D2PAK / DO247 Junction to case DOP3I 2 °C/W Value 1.3 Unit °C/W Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM Min. Typ Max. 15 µA 10 100 2.10 IF = 15 A 1.25 1.20 1.90 1.80 V Unit VF(2) Forward voltage drop Tj = 125° C Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 1.4 x IF(AV) + 0.027 IF2(RMS) 2/11 STTH1512 Table 4. Symbol Characteristics Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C 53 20 1.5 600 5.5 ns V Min. Typ Max. 105 ns 75 28 A Unit trr Reverse recovery time IRM S tfr VFP Reverse recovery current Softness factor Forward recovery time Forward recovery voltage IF = 15 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C IF = 15 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125° C dIF/dt = 50 A/µs IF = 15 A VFR = 1.5 x VFmax, Tj = 25° C IF = 15 A, dIF/dt = 50 A/µs, Tj = 25° C Figure 1. P(W) 35 30 25 20 15 10 5 Conduction losses versus average current δ = 0.1 δ = 0.05 δ=1 δ = 0.2 δ = 0.5 Figure 2. IFM(A) 150 140 130 120 110 100 90 80 70 60 50 40 30 20 Forward voltage drop versus forward current Tj=150°C (typical values) Tj=150°C (maximum values) Tj=25°C (maximum values) T IF(AV)(A) 0 0 2 4 6 8 10 12 δ=tp/T 14 16 tp 18 10 0 0.0 0.5 1.0 1.5 2.0 VFM(V) 2.5 3.0 3.5 4.0 3/11 Characteristics STTH1512 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus dIF/dt (typical values) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Single pulse IRM(A) 50 45 40 35 30 25 20 15 10 IF=0.5 x IF(AV) IF=IF(AV) IF=2 x IF(AV) VR=600V Tj=125°C tp(s) 5 0 0 50 100 150 dIF/dt(A/µs) 200 250 300 350 400 450 500 Figure 5. trr(ns) 600 550 500 450 400 350 300 250 200 150 100 0 50 Reverse recovery time versus dIF/dt (typical values) VR=600V Tj=125°C Figure 6. Qrr(µC) 5.5 5.0 4.5 VR=600V Tj=125°C Reverse recovery charges versus dIF/dt (typical values) IF=2 x IF(AV) IF=2 x IF(AV) 4.0 3.5 IF=0.5 x IF(AV) IF=IF(AV) 3.0 2.5 2.0 1.5 1.0 0.5 IF=IF(AV) IF=0.5 x IF(AV) dIF/dt(A/µs) 100 150 200 250 300 350 400 450 500 dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 0.0 Figure 7. Softness factor versus dIF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature IF=IF(AV) VR=600V Reference: Tj=125°C S factor S factor 3.0 IF ≤ 2xIF(AV) VR=600V Tj=125°C 2.25 2.00 1.75 1.50 2.5 2.0 1.25 1.00 1.5 trr 0.75 0.50 IRM 1.0 0.25 QRR 0.5 0 50 100 150 dIF/dt(A/µs) 200 250 300 350 400 450 500 Tj(°C) 0.00 25 50 75 100 125 4/11 STTH1512 Characteristics Figure 9. VFP(V) 40 35 30 25 20 15 10 5 IF=IF(AV) Tj=125°C Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) tfr(ns) 800 700 600 500 400 300 200 100 IF=IF(AV) VFR=1.5 x VF max. Tj=125°C dIF/dt(A/µs) 0 0 100 200 300 400 500 0 0 100 dIF/dt(A/µs) 200 300 400 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, ecu = 35 µm) Rth(j-a)(°C/W) 80 70 60 50 100 40 30 20 10 VR(V) 10 1 10 100 1000 SCU(cm²) 0 0 5 10 15 20 25 30 35 40 5/11 Package information STTH1512 2 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Recommended torque value: 0.80 Nm (DOP3I) Maximum torque value: 0.7 Nm (TO-220AC) Maximum torque value: 1.0 Nm (DOP3I) Table 5. T0-220AC dimensions DIMENSIONS REF. Millimeters Min. H2 ØI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 A C D E F F1 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 F1 L9 L4 F D G H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/11 STTH1512 Table 6. DO-247 dimensions Package information DIMENSIONS REF. Millimeters Min. A D V Inches Min. 0.191 0.086 0.015 0.039 0.078 Max. 0.203 0.102 0.031 0.055 Max 5.15 2.60 0.80 1.40 2.00 4.85 2.20 0.40 1.00 E Dia V F F2 H A F3 G 2.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5° 60° 3.55 2.40 0.078 0.429 0.094 L5 L L2 L4 F2 L3 F3 V2 F G M E L1 D H L L1 L2 L3 L4 L5 M V V2 Dia. 15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5° 60° 3.65 0.139 0.620 0.793 0.169 0.582 0.118 0.143 7/11 Package information Table 7. D2PAK dimensions DIMENSIONS REF. Millimeters Min. A A1 A E L2 STTH1512 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A2 C2 B D B2 C L L3 A1 B2 B G A2 R C2 C D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 8/11 STTH1512 Table 8. DOP3I dimensions Package information DIMENSIONS REF. E R E1 ØP c A Millimeters Min. Max. 4.60 1.40 1.55 0.70 13.10 15.50 7.75 11.30 21.10 15.60 4.17 2.90 Inches Min. 0.173 0.047 0.057 0.020 0.474 0.594 0.297 0.425 0.815 0.565 0.161 0.106 Max. 0.181 0.055 0.061 0.028 0.516 0.610 0.305 0.445 0.831 0.614 0.164 0.114 A b c 4.40 1.20 1.45 0.50 12.15 15.10 7.55 10.80 20.4 14.35 4.08 2.70 G D Y c1 D E E1 L e G b Q e c1 L P Q R Y 4.60 typ. 15.80 16.50 0.181 typ. 0.622 0.650 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information STTH1512 3 Ordering information Part Number STTH1512D STTH1512PI STTH1512W STTH1512G STTH1512G-TR Marking STTH1512D STTH1512PI STTH1512W STTH1512G STTH1512G Package TO-220AC DOP3I DO-247 D2 2 Weight 1.86g 4.46 g 4.4 g 1.48 g 1.48 g Base qty 50 30 30 50 1000 Delivery mode Tube Tube Tube Tube Tape and reel PAK D PAK 4 Revision history Date 02-Mar-2006 Revision 1 First issue. Description of Changes 10/11 STTH1512 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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