STTH1R02QRL

STTH1R02 Datasheet 200 V - 1.5 A ultrafast recovery diode Features A K A A K SMA K • • • • Very low conduction losses Negligible switching losses Low forward voltage drop High junction temperature • ECOPACK®2 SMB Applications A A K K DO-15 DO-41 • • • • Switching diode LED Lighting Auxiliary power supply Flyback diode Description The STTH1R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. Packaged in SMA, SMB, DO-41 and DO-15, the STTH1R02 is ideal for use low voltage, high frequency inverters, free wheeling and polarity protection Product status STTH1R02 Product summary Symbol Value IF(AV) 1.5 A VRRM 200 V T j(max.) 175 °C VF(typ.) 0.7 V trr(typ.) 15 ns DS4743 - Rev 4 - December 2018 For further information contact your local STMicroelectronics sales office. www.st.com STTH1R02 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current δ = 0.5, square wave IFSM Surge non repetitive forward current Tstg Storage temperature range Tj SMA, SMB TL = 150 °C DO-41, DO-15 TL = 135 °C Value Unit 200 V 1.5 A 60 A -65 to +175 °C +175 °C tp = 10 ms sinusoidal Operating junction temperature Table 2. Thermal resistance parameter Symbol Parameter Rth(j-l) Junction to lead Rth(j-l) Junction to lead Max. value Lead length = 10 mm on infinite heatsink SMA, SMB 30 DO-15, DO-41 45 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Min. VR = VRRM Tj = 25 °C VF(2) Forward voltage drop Tj = 100 °C Tj = 150 °C IF = 1.5 A Typ. - Max. 3 - 2 20 - 0.89 1.00 - 0.76 0.85 - 0.70 0.80 Unit µA V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.68 x IF(AV) + 0.08 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS4743 - Rev 4 page 2/15 STTH1R02 Characteristics Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise stated) Symbol trr IRM tfr VFP DS4743 - Rev 4 Parameters Min. Typ. Max. IF = 1 A, dIF/dt = -50 A/μs,VR = 30 V - 23 30 IF = 1 A, dIF/dt = -100 A/μs, VR = 30 V - 15 20 Reverse recovery current IF = 1.5 A, dIF/dt = -200 A/μs, VR = 160 V, Tj = 125 °C - 3 4 Forward recovery time IF =1.5 A, dIF/dt = 100 A/μs, VFR = 1.1 VF(max.) - 50 ns Forward recovery voltage IF =1.5 A, dIF/dt = 100 A/μs - 2.1 V Reverse recovery time Test conditions Unit ns A page 3/15 STTH1R02 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Forward voltage drop versus forward current (typical values) Figure 1. Peak current versus duty cycle IM(A) 50 T 45 40 tp δd=tp/T 40 35 30 30 P = 5W 25 20 20 P = 2W 15 Tj=150°C P = 1W 10 VF (V) δ 0.0 0.1 0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 3. Forward voltage drop versus forward current (maximum values) 50 Tj=25°C 10 5 0 IF (A) 50 IM 0.0 0.5 1.5 2.0 2.5 Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration (SMA) IFM(A) 1.0 Zth(j-a) /Rth(j-a) SMA Scu=1cm² 0.9 40 1.0 0.8 0.7 30 0.6 0.5 20 0.4 Tj=150°C 0.3 Tj=25°C 0.2 10 Single pulse 0.1 VFM(V) t P(s) 0.0 0 0.0 DS4743 - Rev 4 0.5 1.0 1.5 2.0 2.5 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 page 4/15 STTH1R02 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to lead versus pulse duration (SMB) to lead versus pulse duration (DO-41) 1.0 Zth(j-a) /Rth(j-a) Zth(j-a) /Rth(j-a) 1.0 SM B Scu=1cm² 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 0.1 0.1 t P(s) 0.0 t P(s) Single pulse 0.0 1.E -02 1.E -01 1.E +00 1.E +01 1.E +02 1.E +03 Figure 7. Relative variation of thermal impedance junction to lead versus pulse duration (DO-15) 1. 0 DO-41 Lleads=10mm 0.9 1.E-03 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 8. Junction capacitance versus reverse voltage applied (typical values) Zth(j-a) /Rth(j-a) C(pF) 100 DO-15 Leads =10mm 0. 9 1.E-02 F=1MHz Vosc=30mVRMS Tj=25°C 0. 8 0. 7 0. 6 10 0. 5 0. 4 0. 3 0. 2 0. 1 Single pulse 0. 0 1. E- 03 1. E- 02 VR(V) t P(s) 1. E- 01 1. E+ 00 1. E+ 01 1 1. E+ 02 Figure 9. Reverse recovery charges versus dIF/dt (typical values) 80 1 1. E+ 03 10 100 1000 Figure 10. Reverse recovery time versus dIF/dt (typical values) t RR(ns) QRR(nC) 80 IF=1.5A VR=160V 70 IF=1.5A VR=160V 70 60 60 50 50 40 Tj=125°C 40 Tj=125°C 30 30 20 20 Tj=25°C 10 dIF/dt(A/µs) 0 Tj=25°C 10 dIF/dt(A/µs) 0 10 DS4743 - Rev 4 100 1000 10 100 1000 page 5/15 STTH1R02 Characteristics (curves) Figure 11. Peak reverse recovery current versus dIF/dt (typical values) QRR; IRM [T j ] / Q RR; IRM [T j =125°C] IRM(A) 1.4 8 IF=1.5A VR=160V 7 Figure 12. Relative variations of dynamic parameters versus junction temperature IF=1.5A VR=160V 1.2 6 1.0 5 IRM 0.8 4 0.6 3 Tj=125°C 2 0.2 Tj=25°C 1 Tj (°C) dIF/dt(A/µs) 0 10 100 0.0 25 1000 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (typical values) Rth(j-a)(°C/W) 200 QRR 0.4 50 75 100 125 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 Rth(j-a)(°C/W) SMA SMB 150 150 100 100 Epoxy printed board FR4, eCu = 35 µm Epoxy printed board FR4, eCu = 35 µm 50 50 SCu (cm²) SCu (cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 15. Thermal resistance junction to ambient versus lead length (DO-41) 100 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 16. Thermal resistance junction to ambient versus lead length (DO-15) Rth(j-a) (°C/W) Rth(j-a) (°C/W) 100 DO-41 90 DO-15 80 80 70 60 60 50 40 40 30 20 20 10 L leads (mm) L leads (mm) 0 0 1 DS4743 - Rev 4 2 3 4 5 0 6 7 8 9 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 6/15 STTH1R02 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 17. SMB package outline E1 D E A1 C A2 L DS4743 - Rev 4 b page 7/15 STTH1R02 SMB package information Table 5. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 Figure 18. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS4743 - Rev 4 page 8/15 STTH1R02 SMA package information 2.2 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 19. SMA package outline E1 D E A1 C A2 L b Table 6. SMA package mechanical data Dimensions Millimeters Ref. DS4743 - Rev 4 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 9/15 STTH1R02 SMA package information Figure 20. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS4743 - Rev 4 page 10/15 STTH1R02 DO-41 package information 2.3 DO-41 package information • Epoxy meets UL 94, V0 Figure 21. DO-41 package outline C C A ØD ØB Table 7. DO-41 package mechanical data Dimensions Ref. DS4743 - Rev 4 Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 4.07 - 5.20 0.160 - 0.205 B 2.04 - 2.71 0.080 - 0.107 C 25.40 - 1.000 - D 0.71 - 0.028 - 0.86 0.0034 page 11/15 STTH1R02 DO-15 package information 2.4 DO-15 package information • Epoxy meets UL 94, V0 Figure 22. DO-15 package outline C C A ØD ØB Table 8. DO-15 package mechanical data Dimensions Ref. DS4743 - Rev 4 Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 6.05 - 6.75 0.238 - 0.266 B 2.95 - 3.53 0.116 - 0.139 C 26.00 - 31.00 1.024 - 1.220 D 0.71 - 0.88 0.028 - 0.0035 page 12/15 STTH1R02 Ordering information 3 Ordering information Table 9. Ordering information DS4743 - Rev 4 Order code Marking Package Weight Base qty. Delivery mode STTH1R02A R1A SMA 0.068 g 5000 Tape and reel STTH1R02U 1R2S SMB 0.107 g 2500 Tape and reel STTH1R02 STTH1R02 DO-41 0.34 g 2000 Ammopack STTH1R02RL STTH1R02 DO-41 0.34 g 5000 Tape and reel STTH1R02Q STTH1R02Q DO-15 0.40 g 1000 Ammopack STTH1R02QRL STTH1R02Q DO-15 0.40 g 6000 Tape and reel page 13/15 STTH1R02 Revision history Table 10. Document revision history DS4743 - Rev 4 Date Revision Changes 03-May-2006 1 First issue. 13-Oct-2006 2 Added DO-15 and SMB packages. 08-Mar-2007 3 Replaced Figure 8. Replaced ecu with copper thickness. 05-Dec-2018 4 Updated Section Applications. Minor text changes. page 14/15 STTH1R02 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS4743 - Rev 4 page 15/15