STTH1R06U

STTH1R06 Turbo 2 ultrafast high voltage rectifier Features A ■ Ultrafast switching ■ Low reverse recovery current ■ Low thermal resistance ■ Reduces switching and conduction losses A K K DO-41 STTH1R06 SMA STTH1R06A Description A The STTH1R06, which is using ST Turbo 2 600 V technology, is specially suited as boost diode in power factor correction circuitry. K The device is also intended for use as a free wheeling diode in power supplies and other power switching applications. SMB STTH1R06U Table 1. October 2009 Doc ID 10203 Rev 5 Device summary Symbol Value IF(AV) 1A VRRM 600 V IR (max) 75 µA Tj 175 °C VF (typ) 1.0 V trr (max) 25 ns 1/9 www.st.com 9 Characteristics STTH1R06 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current IF(AV) Average forward current Tstg Storage temperature range SMA / SMB 7 DO-41 Tc = 100 °C δ = 0.5 SMA Tc = 125 °C δ = 0.5 SMB Tc = 135 °C δ = 0.5 1 A 25 tp = 10ms sinusoidal A 20 -65 to + 175 °C 175 °C Value (max) Unit Maximum operating junction temperature Thermal resistance Parameter L = 10 mm Rth(j-a) V 10 SMA / SMB Symbol Rth(j-l) 600 DO-41 DO-41 Surge non repetitive forward current Table 3. Unit A IFSM Tj Value Junction to lead Junction to ambient (1) L = 10 mm DO-41 45 SMA 30 SMB 25 DO-41 70 °C/W °C/W 1. Rth(j-a) is measured with a copper area S = Scm2 (see Figure 14). Table 4. Symbol Static electrical characteristics Parameter IR Reverse leakage current VF Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C Min. Typ. Max. 1 VR = VRRM µA 10 75 1.7 IF = 1A V 1.0 1.25 To evaluate the conduction losses use the following equation: P = 1.03 x IF(AV) + 0.27 IF2(RMS) 2/9 Unit Doc ID 10203 Rev 5 STTH1R06 Table 5. Characteristics Dynamic characteristics Symbol Parameter trr Reverse recovery time Tj = 25 °C tfr Forward recovery time Tj = 25 °C dIF/dt = 100 A/µs IF = 1A VFR = 1.1 x VFmax 100 ns VFP Forward recovery voltage Tj = 25 °C IF = 1A dIF/dt = 100 A/µs VFR = 1.1 x VFmax 10 V Figure 1. Test conditions Min. IF = 0.5A Irr = 0.25A IR =1A Conduction losses versus average Figure 2. forward current Unit ns 30 45 Forward voltage drop vs forward current IFM(A) P(W) δ = 0.2 δ = 0.1 1.6 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 δ = 0.5 δ = 0.05 1.4 1.2 δ=1 1.0 0.8 0.6 T 0.4 0.2 IF(AV)(A) δ=tp/T tp 0.0 Figure 3. Max. 25 IF = 1A dIF/dt = -50 A/µs VR =30V 1.8 0.0 Typ. 0.2 0.4 0.6 0.8 1.0 1.2 Relative variation of thermal impedance junction to case vs pulse duration (DO-41) Tj=125°C (maximum values) Tj=25°C (maximum values) Tj=125°C (typical values) VFM(V) 0 1 Figure 4. Zth(j-c)/Rth(j-c) 2 3 4 5 Relative variation of thermal impedance junction to case vs pulse duration (SMA) Zth(j-c)/Rth(j-c) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 S = 1cm2 0.6 0.6 δ = 0.5 0.5 0.5 0.4 0.4 0.3 0.2 0.3 δ = 0.2 T 0.2 δ = 0.1 T δ = 0.2 δ = 0.1 0.1 Single pulse 0.0 1.E-01 δ = 0.5 1.E+00 tp(s) 1.E+01 δ=tp/T 1.E+02 0.1 tp(s) Single pulse tp δ=tp/T tp 0.0 1.E+03 1.E-01 Doc ID 10203 Rev 5 1.E+00 1.E+01 1.E+02 1.E+03 3/9 Characteristics Figure 5. STTH1R06 Relative variation of thermal impedance junction to case vs pulse duration (SMB) Figure 6. Zth(j-c)/Rth(j-c) Peak reverse recovery current vs dIF/dt (typical values) IRM(A) 9 1.0 S = 1cm2 0.9 8 0.8 7 VR=400V Tj=125°C IF=2 x IF(AV) IF=IF(AV) 0.7 6 0.6 δ = 0.5 IF=0.5 x IF(AV) 5 0.5 4 IF=0.25 x IF(AV) 0.4 3 0.3 T δ = 0.2 0.2 2 δ = 0.1 0.1 δ=tp/T tp(s) Single pulse 1 tp dIF/dt(A/µs) 0 0.0 1.E-01 1.E+00 Figure 7. 1.E+01 1.E+02 0 1.E+03 50 Reverse recovery time versus dIF/dt Figure 8. (typical values) 100 150 200 250 300 350 400 450 500 Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) trr(ns) 250 140 VR=400V Tj=125°C 130 120 VR=400V Tj=125°C 225 IF=2 x IF(AV) IF=2 x IF(AV) 200 110 100 175 IF=IF(AV) 90 IF=0.5 x IF(AV) 80 150 IF=IF(AV) 125 70 60 100 IF=0.5 x IF(AV) 50 40 75 30 50 20 10 25 dIF/dt(A/µs) 0 50 Figure 9. 100 150 200 250 300 350 400 450 0 500 Reverse recovery softness factor vs dIF/dt (typical values) S factor 50 100 150 200 250 300 350 400 450 500 Figure 10. Relative variations of dynamic parameters vs junction temperature 1.0 6 S factor 0.9 IF=IF(AV) VR=400V Tj=125°C 5 dIF/dt(A/µs) 0 0 0.8 IRM 0.7 4 0.6 0.5 QRR 3 0.4 0.3 2 0.2 1 0.1 dIF/dt(A/µs) 4/9 50 100 150 200 250 300 IF=IF(AV) VR=400V Reference: Tj=125°C 0.0 0 0 Tj(°C) 350 400 450 500 25 Doc ID 10203 Rev 5 50 75 100 125 STTH1R06 Characteristics Figure 11. Transient peak forward voltage vs Figure 12. Forward recovery time vs dIF/dt dIF/dt (typical values) (typical values) tfr(ns) VFP(V) 200 25 IF=IF(AV) Tj=125°C IF=IF(AV) VFR=1.1 x VF max. Tj=125°C 180 160 20 140 120 15 100 80 10 60 40 5 dIF/dt(A/µs) 20 dIF/dt(A/µs) 0 0 0 20 40 60 80 100 120 140 160 180 0 200 20 40 60 80 100 120 140 160 180 200 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead Figure 13. Junction capacitance versus reverse voltage applied (typical values) Rth(j-a)(°C/W) C(pF) 110 100 (epoxy FR4, Cu = 35 µm) (DO-41, SMB) 100 F=1MHz VOSC=30mV Tj=25°C 90 DO-41 Lleads = 10mm 80 70 SMB 60 10 50 40 30 20 10 VR(V) S(cm²) 0 1 1 10 100 0 1000 1 2 3 4 5 6 7 8 9 10 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, Cu = 35 µm) (SMA) Rth(j-a)(°C/W) 140 130 120 110 100 90 80 SMA 70 60 50 40 30 20 S(cm²) 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Doc ID 10203 Rev 5 4.0 4.5 5.0 5/9 Package information 2 STTH1R06 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. SMA dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 16. Footprint (dimensions in mm) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) 6/9 Doc ID 10203 Rev 5 STTH1R06 Package information Table 7. SMB dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 17. Footprint (dimensions in mm) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086) 5.84 (0.300) Table 8. DO-41 (plastic) dimensions Dimensions Ref. A C Doc ID 10203 Rev 5 Inches Min. Max. Min. Max. A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107 C 25.4 D 0.71 ØD ØB C Millimeters 1 0.86 0.028 0.034 7/9 Ordering information 3 Ordering information Table 9. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STTH1R06 STTH1R06 DO-41 0.34 g 2000 Ammopack STTH1R06RL STTH1R06 DO-41 0.34 g 5000 Tape and reel STTH1R06A HR6 SMA 0.068 g 5000 Tape and reel STTH1R06U BR6 SMB 0.11 g 2500 Tape and reel Revision history Table 10. 8/9 STTH1R06 Document revision history Date Revision Changes Apr-2003 1 First issue. 07-Sep-2004 2 DO-41 and SMA packages added. 24-Feb-2005 3 SMA package dimensions update. Reference A1 max. changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080). 02-Jul-2007 4 Reformatted to current standards. Added cathode bars to cover illustrations. Updated dimensions and footprint illustrations for SMA and SMB packages. Corrected part number in Table 9. 30-Sep-2009 5 Updated table 8 package dimensions. 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