STTH20003TV

STTH20003TV Ultrafast high voltage rectifier Mian product characteristics IF(AV) VRRM Tj (max) VF (typ) trr (max) up to 2 x 100 A 300 V 150° C 0.95 V 90 ns A1 A2 K1 K2 K1 A1 K2 A2 ISOTOP STTH20003TV Features and benefits ■ ■ ■ ■ Combines highest recovery and reverse voltage performance Ultrafast, soft and noise-free recovery Package insulation voltage 2500 Vrms low inductance and low capacitance allow simpler layout Description Dual rectifiers suited for Switch Mode Power Supply and high frequency DC to DC converters. Packaged in ISOTOP™, this device is intended for use in low voltage, high frequency inverters, free wheeling operation, welding equipment and telecom power supplies. Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 85° C δ = 0.5 tp = 10 ms sinusoidal Per diode Per device Order codes Part number STTH20003TV Marking STTH20003TV Absolute ratings (limiting values, per diode, Tc = 25° C unless otherwise stated) Parameter Value 300 180 100 A 200 100 -55 to + 150 150 A °C °C Unit V A TM: ISOTOP is a registered trademark of STMicroelectronics September 2006 Rev 2 1/7 www.st.com 7 Characteristics STTH20003TV 1 Characteristics Table 2. Symbol Rth(j-c) Rth(c) Junction to case Total Coupling 0.35 0.1 °C/W Thermal resistance Parameter Per diode Value (max). 0.55 Unit When diodes 1 and 2 are used simultaneously: ∆ Tj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 3. Symbol IR(1) VF(2) Static electrical characteristics (per diode) Parameter Reverse leakage current Forward voltage drop Test conditions Tj = 25° C Tj = 125° C Tj = 25° C Tj = 150° C VR = 300 V Min. Typ Max. 200 0.2 2 1.20 IF = 100 A V 0.8 0.95 Unit µA mA 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.75 x IF(AV) + 0.0020 IF2(RMS) Table 4. Symbol Dynamic characteristics (per diode) Parameter Reverse recovery time Reverse recovery current Softness factor Forward recovery time Forward recovery voltage Test conditions IF = 0.5 A Irr = 0.25 A IR = 1 A Tj = 25° C IF = 1 A dIF/dt = -50 A/µs VR = 30 V VR = 200 V IF = 100 A dIF/dt = -200 A/µs IF = 100 A VR = 200 V dIF/dt = -200 A/µs dIF/dt = 200 A/µs IF = 100 A VFR = 1.1 x VFmax IF = 100 A dIF/dt = 200 A/µs VFR = 1.1 x VFmax 0.3 1400 5 ns V Min Typ Max Unit 55 ns 90 18 A trr IRM Sfactor tfr VFP Tj = 125° C Tj = 125° C Tj = 25° C Tj = 25° C 2/7 STTH20003TV Characteristics Figure 1. Conduction losses versus Figure 2. average forward current (per diode) 500 δ=1 Forward voltage drop versus forward current (per diode) P1(W) 120 100 80 60 40 20 IF(av) (A) 0 0 20 40 60 80 δ=tp/T tp IFM(A) Tj=125°C (Typical values) δ = 0.2 δ = 0.1 δ = 0.05 δ = 0.5 100 Tj=25°C Tj=125°C 10 T 100 120 1 0.0 VFM(V) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Figure 3. Relative variation of thermal Figure 4. impedance junction to case versus pulse duration 40 35 30 25 20 15 T Peak reverse recovery current versus dIF/dt (90% confidence, per diode) 1.0 0.8 0.6 0.4 0.2 Zth(j-c)/Rth(j-c) IRM(A) VR=200V Tj=125°C IF=IF(av) IF=0.5xIF(av) IF=2xIF(av) 10 Single pulse tp(s) 1E-2 1E-1 δ=tp/T tp 5 0 0 50 0.0 1E-3 dIF/dt(A/µs) 100 150 200 250 300 350 400 450 500 1E+0 5E+0 Figure 5. Reverse recovery time versus dIF/dt (90% confidence, per diode) Figure 6. Softness factor (tb/ta) versus dIF/dt (typical values, per diode) 260 240 220 200 180 160 140 120 100 80 60 40 20 0 trr(ns) VR=200V Tj=125°C 0.6 0.5 0.4 IF=IF(av) IF=0.5xIF(av) S factor VR=200V Tj=125°C IF=2xIF(av) 0.3 0.2 0.1 dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 0.0 dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 3/7 Characteristics STTH20003TV Figure 7. Relative variations of dynamic Figure 8. parameters versus junction temperature (reference: Tj = 125° C) 8 S factor Transient peak forward voltage versus dIF/dt (90% confidence, per diode) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 25 VFP(V) IF=IF(av) Tj=125°C 7 6 5 4 3 2 1 100 125 IRM Tj(°C) 50 75 0 dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 Figure 9. Forward recovery time versus dIF/dt (90% confidence, per diode) 1000 900 800 700 600 500 400 300 200 100 0 tfr(ns) VFR=1.1 x VF max. IF=IF(av) Tj=125°C dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 4/7 STTH20003TV Package information 2 Package information ● ● ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 1.3 Nm Maximum torque value: 1.5 Nm ISOTOP Dimensions Dimensions Ref. Millimeters Min. E G2 Table 5. Inches Min. 0.465 0.350 0.307 0.030 0.077 1.488 1.240 0.990 0.939 Max. 0.480 0.358 0.323 0.033 0.081 1.504 1.248 1.004 0.951 Max. 12.20 9.10 8.20 0.85 2.05 38.20 31.70 25.50 24.15 A C 11.80 8.90 7.8 0.75 1.95 37.80 31.50 25.15 23.85 A1 A A1 C2 E2 B C C2 F1 F D D1 E P1 E1 G D1 D S E2 G 24.80 typ. 14.90 12.60 3.50 4.10 4.60 4.00 4.00 30.10 15.10 12.80 4.30 4.30 5.00 4.30 4.40 30.30 0.976 typ. 0.587 0.496 0.138 0.161 0.181 0.157 0.157 1.185 0.594 0.504 0.169 0.169 0.197 0.69 0.173 1.193 B G1 G2 ØP G1 E1 F F1 P P1 S In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information STTH20003TV 3 Ordering information Ordering type STTH20003TV Marking STTH20003TV Package ISOTOP Weight Base qty Delivery mode Tube 27 g 10 (without screws) (with screws) 4 Revision history Date 1999 5-Sep-2006 Revision 2C 2 First issue Reformatted to current standards. Thermal resistance updated in Table 2. Description of Changes 6/7 STTH20003TV Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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