STTH2002CT

STTH2002C High efficiency ultrafast diode Datasheet - production data Features A1 K       A2 K K A1 A2 A2 K A1 K TO-220AB  Suited for SMPS Low losses Low forward and reverse recovery times Low leakage current High junction temperature Insulated package: TO-220FPAB  Insulating voltage = 2000 VRMS sine ECOPACK®2 compliant component for D²PAK on demand TO-220FPAB Description I2PAK K A1 Dual center tap rectifier suited for switch mode power supplies and high frequency DC/DC converters. A2 Packaged in TO-220AB, TO-220FPAB, I2PAK or D2PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. K K Table 1: Device summary A2 A2 A1 A1 D2PAK December 2015 DocID10176 Rev 3 This is information on a product in full production. Symbol Value IF(AV) 2 x 10 A VRRM 200 V Tj (max) 175 °C VF (typ) 0.78 V trr (typ) 22 ns 1/16 www.st.com Characteristics 1 STTH2002C Characteristics Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) Forward rms current 30 A IF(peak) Average forward current δ = 0.5, square wave TO-220AB, D2PAK, I2PAK TC = 150 °C Per diode 10 TC = 140 °C Per device 20 TC = 130 °C Per diode 15 TC = 115 °C Per device 30 TC = 120 °C Per diode 10 TC = 85 °C Per device 20 TO-220FPAB IFSM Surge non repetitive forward current Tstg Storage temperature range tp = 10 ms sinusoidal Maximum operating junction temperature Tj A 90 A -65 to + 175 °C 175 °C (1) Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameter Symbol Parameter TO-220AB, D2PAK, I2PAK Rth(j-c) Value Per diode 2.5 Per device 1.6 Per diode 5 Per device 3.8 Junction to case TO-220FPAB TO-220AB, D2PAK, I2PAK Rth(c) Coupling TO-220FPAB When the diodes 1 and 2 are used simultaneously: ΔTj(diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) 2/16 DocID10176 Rev 3 Unit °C/W 0.7 °C/W 2.5 STTH2002C Characteristics Table 4: Static electrical characteristics (per diode) Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 150 °C VR = VRRM Min. Typ. - 10 - IF = 10 A - IF = 20 A - IF = 10 A - IF = 20 A - Max. 6 100 Unit µA 1.1 1.25 0.78 0.89 V 1.05 Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.73 x IF(AV) + 0.020 IF2(RMS) Table 5: Dynamic electrical characteristics (per diode) Symbol Parameter Test conditions Min. Typ. Max. Unit 22 27 ns 200 ns trr Reverse recovery time Tj= 25 °C IF= 1 A, VR= 30 V, dIF/dt= 100 A/µs - tfr Forward recovery time Tj = 25 °C IF = 10 A, dIF/dt = 100 A/µs, VFR = 1.1 x VFmax, - VFP Forward recovery voltage Tj = 25 °C IF = 10 A, dIF/dt = 100 A/µs - 2.4 IRM Reverse recovery current Tj = 125 °C IF = 10 A, VR = 160 V, dIF/dt = 200 A/µs - 7.0 DocID10176 Rev 3 V 9.0 A 3/16 Characteristics 1.1 STTH2002C Characteristics (curves) Figure 1: Peak current versus duty cycle (per diode) Figure 2: Forward voltage drop versus forward current (typical values, per diode) IM(A) 80 70 IM T 60 δ=tp/T 50 tp P = 20W 40 P = 10W 30 P = 5W 20 10 δ 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 3: Forward voltage drop versus forward current (maximum values, per diode) Figure 4: Relative variation of thermal impedance junction to case versus pulse duration Z th(j-c) /Rth(j-c) 1.0 TO-220AB, D2PAK, I2PAK Single pulse t p(s) 0.1 1.E-0 3 Figure 5: Relative variation of thermal impedance junction to case versus pulse duration 1.E-0 2 1.E-0 1 1.E+00 Figure 6: Junction capacitance versus reverse voltage applied (typical values, per diode) Z th(j-c ) /Rth(j-c) C(pF) 1.0 100 f=1MHz V OS C =30mV T j=25°C TO-220FPAB RMS Single pulse 0.1 t p(s) VR(V) 10 0.0 1.E-0 3 4/16 1.E-0 2 1.E-0 1 1.E+0 0 1.E+01 DocID10176 Rev 3 0 50 10 0 15 0 200 STTH2002C Characteristics Figure 7: Reverse recovery charges versus dIF/dt (typical values, per diode) Figure 8: Reverse recovery time versus dIF/dt (typical values, per diode) Figure 9: Peak reverse recovery current versus dIF/dt (typical values, per diode) Figure 10: Dynamic parameters versus junction temperature Qrr ; IRM [Tj]/Qrr ;IRM [T j=125°C] 1.4 IF =10A V R =160V 1.2 1.0 IRM 0.8 Q rr 0.6 0.4 0.2 Tj (°C) 0.0 25 50 75 100 125 150 Figure 11: Thermal resistance junction to ambient versus copper surface under tab 80 Rth(j-a) (°C/W) D²PAK 70 60 50 40 30 20 Epoxy printed board FR4, e CU= 35 µm 10 0 0 5 10 15 20 SCu(cm²) DocID10176 Rev 3 25 30 35 40 5/16 Package information 2 STTH2002C Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     6/16 Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N·m (for TO-220AB and TO-220FPAB) Maximum torque value: 0.7 N·m (for TO-220AB and TO-220FPAB) DocID10176 Rev 3 STTH2002C 2.1 Package information D²PAK package information Figure 12: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID10176 Rev 3 7/16 Package information STTH2002C Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 8/16 Inches 0.4 typ. 0° 0.015 8° DocID10176 Rev 3 0° 8° STTH2002C Package information Figure 13: D²PAK recommended footprint (dimensions in mm) DocID10176 Rev 3 9/16 Package information 2.2 STTH2002C I²PAK package information Figure 14: I²PAK package outline Table 7: I²PAK package mechanical data mm Dim. Min. Typ. Max. A 4.40 – 4.60 A1 2.40 – 2.72 b 0.61 – 0.88 b1 1.14 – 1.70 c 0.49 – 0.70 c2 1.23 – 1.32 D 8.95 – 9.35 e 2.40 – 2.70 e1 4.95 – 5.15 E 10 – 10.40 L 13 – 14 L1 3.50 – 3.93 L2 1.27 – 1.40 Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory. 10/16 DocID10176 Rev 3 STTH2002C 2.3 Package information TO-220AB type A (DZ) package information Figure 15: TO-220AB package outline DocID10176 Rev 3 11/16 Package information STTH2002C Table 8: TO-220AB package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.24 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 0.620 D1 12/16 Inches 1.27 typ. 0.050 typ. E 10 10.40 0.394 0.409 e 2.4 2.7 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.260 J1 2.4 2.72 0.094 0.107 L 13.0 14.0 0.512 0.551 L1 3.5 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θP 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 DocID10176 Rev 3 STTH2002C 2.4 Package information TO-220FPAB package information Figure 16: TO-220FPAB package outline A B H Dia L6 L2 L7 L3 L5 F1 L4 D F2 F E G1 G DocID10176 Rev 3 13/16 Package information STTH2002C Table 9: TO-220FPAB package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.50 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1.0 0.03 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.40 2.70 0.094 0.106 H 10.00 10.40 0.393 0.409 L2 14/16 Inches 16.00 typ. 0.63 typ. L3 28.60 30.60 1.126 1.205 L4 9.80 10.6 0.386 0.417 L5 2.90 3.60 0.114 0.142 L6 15.90 16.40 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia 3.0 3.20 0.118 0.126 DocID10176 Rev 3 STTH2002C 3 Ordering information Ordering information Table 10: Ordering information Order code 4 Marking Package Weight Base qty Delivery mode STTH2002CT STTH2002CT TO-220AB 1.9g 50 Tube STTH2002CG STTH2002CG D2PAK 1.38g 50 Tube STTH2002CG-TR STTH2002CG D2PAK 1.38g 1000 Tape and reel STTH2002CR STTH2002CR I2PAK 1.5g 50 Tube STTH2002CFP STTH2002CFP TO-220FPAB 1.9g 50 Tube Revision history Table 11: Document revision history Date Revision Feb-2004 1 First issue. 23-Jun-2010 2 Updated Table 1. Updated ECOPACK statement. 3 Updated features, Table 1: "Device summary" and packages silhouette in cover page. Updated Section 1: "Characteristics" and Table 10: "Ordering information" Updated Section 2.2: "D²PAK package information". 14-Dec-2015 Changes DocID10176 Rev 3 15/16 STTH2002C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 16/16 DocID10176 Rev 3