STTH2002DI

STTH2002 Ultrafast recovery diode Datasheet - production data A Description K K NC A TO-220AC A K TO-220AC Ins K This single rectifier is suited for switch mode power supplies and high frequency DC to DC converters. Packaged in D²PAK, TO-220AC and insulated TO-220AC, this device is intended for low voltage, high frequency inverters, freewheeling and polarity protection applications K K A A NC NC D 2PAK Table 1: Device summary Symbol Value IF(AV) 20 A VRRM 200 V Tj (max.) 175 °C VF (typ.) 0.86 V trr (typ.) 16 ns Features        Ultrafast switching Low reverse current Low thermal resistance Reduces switching and conduction losses High Tj Insulated package: TO-220AC Ins  Insulating voltage = 2500 VRMS sine ECOPACK®2 compliant component for D²PAK on demand August 2017 DocID12365 Rev 3 This is information on a product in full production. 1/15 www.st.com Characteristics 1 STTH2002 Characteristics Table 2: Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) Forward rms current 35 A IF(AV) Average forward current δ = 0.5, square wave 20 A IFSM Surge non repetitive forward current 175 A Tstg Storage temperature range -65 to +175 °C 175 °C Tj TO-220AC, D2PAK TC = 120 °C TO-220AC Ins TC = 60 °C tp = 10 ms sinusoidal Maximum operating junction temperature Table 3: Thermal parameter Symbol Parameter Max. value TO-220AC, Rth(j-c) D2PAK Junction to case Unit 2.4 °C/W TO-220AC Ins 5 Table 4: Static electrical characteristics Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 150 °C VF (2) Forward voltage drop VR = VRRM IF = 20 A Tj = 25 °C Tj = 125 °C IF = 25 A Notes: test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.75 x IF(AV) + 0.01 x IF2(RMS) 2/15 DocID12365 Rev 3 Typ. Max. - 10 100 - 1.00 1.10 - 0.86 0.95 - 10 - Tj = 150 °C (1)Pulse Min. 1.15 - 0.94 1.05 - 0.90 1.00 Unit µA V STTH2002 Characteristics Table 5: Dynamic electrical characteristics Symbol Parameter Test conditions IF = 1 A, dIF/dt = -200 A/μs, VR = 30 V trr tfr Reverse recovery time Forward recovery time Forward recovery voltage IRM Reverse recovery current Typ. Max. - 16 20 Tj = 25 °C IF = 1 A, dIF/dt = -50 A/μs, VR = 30 V VFP Min. Tj = 25 °C Tj = 125 °C IF = 20 A, dIF/dt = 100 A/μs VFR = 1.1 x VFmax IF = 20 A, dIF/dt = -100 A/μs, VR = 160 V DocID12365 Rev 3 Unit ns - 33 40 - 230 ns - 2 V - 8 10 A 3/15 Characteristics 1.1 STTH2002 Characteristics (curves) Figure 2: Forward voltage drop versus forward current (typical values) Figure 1: Peak current versus duty cycle IM (A) 100 T 200 IF (A) IM 180 80 δ=tp/T d tp 160 140 60 120 P = 10 W 100 80 40 P= 5W Tj = 150 °C 60 P= 3W Tj = 25 °C 40 20 20 0 0.0 0.1 0.0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.5 1.0 1.5 2.0 2.5 1.0 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration Figure 3: Forward voltage drop versus forward current (maximum values) IF (A) 200 VF (V) 0 δ 1.0 180 Zth(j-c) /Rth(j-c) Single pulse 160 140 120 100 80 Tj = 150 °C 60 Tj = 25 °C 40 20 tp(s) VF (V) 0.1 1.E-03 0 0.0 0.5 1.0 1.5 2.0 1.E-02 1.E-01 1.E+00 2.5 Figure 5: Junction capacitance versus reverse applied voltage (typical values) Figure 6: Reverse recovery charges versus dIF/dt (typical values) C(pF) 400 1000 F=1MHz V osc=30mV RMS Tj=25°C Q rr (nC) IF = 20 A VR = 160 V 350 300 250 Tj = 125 °C 200 100 150 100 Tj = 25 °C 50 VR(V) 10 4/15 dIF/dt (A/µs) 0 1 10 100 1000 DocID12365 Rev 3 10 100 1000 STTH2002 Characteristics Figure 7: Reverse recovery time versus dIF/dt (typical values) Figure 8: Peak reverse recovery current versus dIF/dt (typical values) t rr (ns) 80 IRM (A) 20 IF = 20 A VR = 160 V 70 IF = 20 A VR = 160 V 18 16 60 Tj = 125 °C 14 50 12 40 10 Tj = 25 °C 30 8 Tj = 125 °C 6 20 4 10 2 dIF/dt (A/µs) Tj = 25 °C 0 0 10 100 1000 Figure 9: Relative variation of dynamic parameters versus junction temperature 10 dIF/dt (A/µs) 100 1000 Figure 10: Thermal resistance, junction to ambient, versus copper surface under tab R th (j-a) (°C/W) 80 1.4 D²PAK IF = 20 A VR = 160 V Reference: Tj = 125 °C 1.2 70 Epoxy printed board FR4, copper thickness = 35 µm 60 1.0 50 IRM 0.8 0.6 40 30 Qrr 20 0.4 10 SCu(cm²) 0.2 0 Tj(°C) 0 0.0 25 50 75 100 125 5 10 15 20 25 30 35 150 DocID12365 Rev 3 5/15 40 Package information 2 STTH2002 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     6/15 Cooling method: by conduction (C) Epoxy meets UL94,V0 Recommended torque value: 0.55 N·m (for TO-220AC and TO-220AC Ins) Maximum torque value: 0.70 N·m (for TO-220AC and TO-220AC Ins) DocID12365 Rev 3 STTH2002 2.1 Package information D²PAK package information Figure 11: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID12365 Rev 3 7/15 Package information STTH2002 Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 8/15 Inches 0.4 typ. 0° 0.015 8° DocID12365 Rev 3 0° 8° STTH2002 Package information Figure 12: D²PAK recommended footprint (dimensions in mm) DocID12365 Rev 3 9/15 Package information 2.2 STTH2002 TO-220AC package information Figure 13: TO-220AC package outline 10/15 DocID12365 Rev 3 STTH2002 Package information Table 7: TO-220AC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M ØI 2.6 typ. 3.75 0.102 typ. 3.85 DocID12365 Rev 3 0.147 0.151 11/15 Package information 2.3 STTH2002 TO-220 AC Ins package information Figure 14: TO-220AC Ins package outline 12/15 DocID12365 Rev 3 STTH2002 Package information Table 8: TO-220AC Ins package mechanical data Dimensions Ref. Millimeters Min. A Typ. 15.20 a1 Inches Max. Min. 15.90 0.598 3.75 Typ. Max. 0.625 0.147 a2 13.00 14.00 0.511 0.551 B 10.00 10.40 0.393 0.409 b1 0.61 0.88 0.024 0.034 b2 1.23 1.32 0.048 0.051 C 4.40 4.60 0.173 0.181 c1 0.49 0.70 0.019 0.027 c2 2.40 2.72 0.094 0.107 e 4.80 5.40 0.189 0.212 F 6.20 6.60 0.244 0.259 L 2.65 2.95 0.104 0.116 I2 1.14 1.70 0.044 0.066 I4 15.80 16.80 0.622 M ØI 16.40 2.60 3.75 0.645 0.661 0.102 3.85 DocID12365 Rev 3 0.147 0.151 13/15 Ordering information 3 STTH2002 Ordering information Table 9: Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH2002D STTH2002 TO-220AC 1.87 g 50 Tube STTH2002DI STTH 2002DI TO-220AC ins 1.76 g 50 Tube STTH2002 D2PAK 1.38 g 1000 Tape and reel STTH2002G-TR 4 Revision history Table 10: Document revision history Date Revision 03-May-2006 1 First issue. 05-Sep-2011 2 Updated dimension e and deleted l3 in Table 7. 3 Updated features and package silhouette in cover page. Updated Section 1: "Characteristics", Figure 10: "Thermal resistance, junction to ambient, versus copper surface under tab", Section 2: "Package information" and Section 3: "Ordering information". 16-Aug-2017 14/15 Changes DocID12365 Rev 3 STTH2002 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID12365 Rev 3 15/15