STTH2002G-TR

STTH2002 Ultrafast recovery diode Main product characteristics IF(AV) VRRM Tj (max) VF (typ) trr (typ) 20 A 200 V 175° C 0.86 V 16 ns A K K A A K TO-220ACins STTH2002DI Features and benefits ■ ■ ■ ■ ■ ■ ■ K TO-220AC STTH2002D Ultrafast switching Low reverse current Low thermal resistance Reduces switching and conduction losses High Tj Insulating voltage: 2500 Vrms Capacitance: 7 pF K A NC D2PAK STTH2002G Description Single rectifier suited for switch mode power supply and high frequency DC to DC converter. Packaged in D²PAK, TO-220AC and insulated TO220AC, this device is intended for low voltage, high frequency inverters, free wheeling and polarity protection applications Order codes Part Number STTH2002D STTH2002DI STTH2002G STTH2002G-TR Marking STTH2002 STTH2002 STTH2002 STTH2002 May 2006 Rev 1 www.st.com 1/10 Characteristics STTH2002 1 Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj Characteristics Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward current Average forward current, δ = 0.5 Surge non repetitive forward current Storage temperature range Maximum operating junction temperature TO-220AC, D2PAK TO-220ACins tp = 10 ms Sinusoidal Tc = 120° C Tc = 60° C 175 -65 to + 175 175 A °C °C Value 200 35 20 Unit V A A Table 2. Symbol Rth(j-c) Thermal parameters Parameter TO-220AC, D2PAK Junction to case TO-220ACins 5 Value 2.4 ° C/W Unit Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 25° C Tj = 150° C VR = VRRM Min. Typ Max. 10 µA 10 1 IF = 20 A 0.86 100 1.1 0.95 1.15 IF = 25 A 0.94 0.9 1.05 1 V Unit VF (2) Forward voltage drop Tj = 25° C Tj = 125° C Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.75 x IF(AV) + 0.01 IF2(RMS) 2/10 STTH2002 Table 4. Symbol Characteristics Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -200 A/µs, VR = 30 V, Tj = 25 °C IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C Min. Typ 16 33 8 230 2 Max. 20 ns 40 10 A ns V Unit trr Reverse recovery time IRM tfr VFP Reverse recovery current Forward recovery time Forward recovery voltage IF = 20 A, dIF/dt = 100 A/µs, VR = 160 V, Tj = 125 °C IF = 20 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax, Tj = 25 °C IF = 20 A, dIF/dt = 100 A/µs, VFR = 1.1 x VFmax, Tj = 25 °C Figure 1. IM(A) 100 Peak current versus duty cycle Figure 2. Forward voltage drop versus forward current (typical values) IFM(A) T IM 200 180 80 δ d=tp/T tp 160 140 60 P = 10 W 120 100 40 P=5W P=3W 80 60 40 20 Tj=150°C Tj=25°C 20 0 0.0 0.1 δ 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 0.0 0.5 1.0 VFM(V) 1.5 2.0 2.5 Figure 3. Forward voltage drop versus forward current (maximum values) Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration IFM(A) 200 180 160 140 120 100 80 60 40 20 0 0.0 0.5 1.0 1.5 2.0 2.5 Tj=150°C Tj=25°C Zth(j-c)/Rth(j-c) 1.0 Single pulse TO-220AC TO-220ACins D²PAK VFM(V) 0.1 1.E-03 1.E-02 tp(s) 1.E-01 1.E+00 3/10 Characteristics STTH2002 Figure 5. Junction capacitance versus reverse applied voltage (typical values) F=1MHz Vosc=30mVRMS Tj=25°C Figure 6. Reverse recovery charges versus dIF/dt (typical values) C(pF) 1000 400 350 300 250 100 200 150 100 QRR(nC) IF = 20 A VR = 160 V Tj=125 °C Tj=25 °C 50 VR(V) 10 1 10 100 1000 0 10 100 1000 dIF/dt(A/µs) Figure 7. tRR(ns) 80 70 60 Reverse recovery time versus dIF/dt (typical values) IF=20A VR=160V Figure 8. IRM(A) 20 18 16 Peak reverse recovery current versus dIF/dt (typical values) IF= 20 A VR= 160 V Tj = 125 °C 14 12 10 Tj=125 °C 50 40 30 20 Tj = 25 °C 8 6 4 Tj=25 °C 10 0 10 dIF/dt(A/µs) 2 0 dIF/dt(A/µs) 10 100 1000 100 1000 Figure 9. Dynamic parameters versus junction temperature Figure 10. Thermal resistance, junction to ambient, versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 µm) for D2PAK Rth(j-a) (°C/W) 80 D²PAK QRR; IRM [T j] / Q RR; IRM [T j=125°C] 1.4 1.2 1.0 0.8 0.6 QRR IRM IF=20 A VR= 160 V 70 60 50 40 30 20 10 Tj(°C) 0.4 0.2 0.0 25 50 75 100 125 150 SCU(cm²) 0 0 5 10 15 20 25 30 35 40 4/10 STTH2002 Ordering information scheme 2 Ordering information scheme STTH 20 02 XXX Ultrafast switching diode Average forward current 20 = 20 A Repetitive peak reverse voltage 02 = 200 V Package D = TO-220AC in Tube DI = TO-220ACins in Tube G = D2PAK in Tube G-TR = D2PAK in Tape and reel 5/10 Package information STTH2002 3 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm Table 5. T0-220AC dimensions DIMENSIONS REF. Millimeters Min. A H2 ØI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G F1 L9 L4 F D H2 L2 M E G 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 L4 L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/10 STTH2002 Table 6. T0-220ACins dimensions Package information DIMENSIONS REF Millimeters Min. A a1 B ØI L F A I4 b2 C Inches Min. 0.598 0.147 Typ. Max. 0.625 Typ. Max. 15.90 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.80 2.65 1.14 1.14 2.60 a2 B b1 b2 C 14.00 10.40 0.88 1.32 4.60 0.70 2.72 2.70 6.60 3.85 16.40 16.80 2.95 1.70 1.70 0.511 0.393 0.024 0.048 0.173 0.019 0.094 0.094 0.244 0.147 0.622 0.104 0.044 0.044 0.102 0.646 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.661 0.116 0.066 0.066 a1 l2 c2 c1 c2 e a2 M b1 e c1 F ØI I4 L l2 l3 M 7/10 Package information Table 7. D2PAK dimensions DIMENSIONS REF. Millimeters Min. A A E L2 C2 STTH2002 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D B2 C L L3 A1 B2 B G A2 2mm min. FLAT ZONE R C2 C D E G L V2 L2 L3 M R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 11. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STTH2002 Ordering information 4 Ordering information Part Number STTH2002D STTH2002DI STTH2002G STTH2002G-TR Marking STTH2002 STTH2002 STTH2002 STTH2002 Package TO-220AC TO-220ACins D2PAK D2 PAK Weight 1.90 g 2.30 g 1.48 g 1.48 g Base qty 50 50 50 1000 Delivery mode Tube Tube Tube Tape and reel 5 Revision history Date 03-May-2006 Revision 1 First issue Description of Changes 9/10 STTH2002 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10