®
STTH208/U
HIGH VOLTAGE ULTRAFAST RECTIFIER
MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS
s s
2A 800 V 175 °C 1.25 V
s
s
s
Low forward voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology
DO-15 STTH208
DESCRIPTION The STTH208, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications.
SMB STTH208U
ABSOLUTE RATINGS (limiting values) Symbol VRRM V(RMS) IF(AV) Parameter Repetitive peak reverse voltage RMS voltage Average forward current Tl = 60°C Tl = 100°C IFSM Forward surge current t = 8.3 ms δ =0.5 δ =0.5 DO-15 SMB DO-15 SMB Tstg Tj Storage temperature range Maximum operating junction temperature Value 800 560 2 2 45 35 - 50 + 175 + 175 °C °C A Unit V V A
January 2003 - Ed: 1
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STTH208/U
THERMAL PARAMETERS Symbol Rth (j-l) Junction to lead Parameter L = 10 mm DO-15 SMB Rth (j-a) Junction to ambient L = 10 mm DO-15 Value 40 25 110 Unit °C/W
STATIC ELECTRICAL CHARACTERISTICS Symbol IR Parameter Reverse leakage current Tests conditions VR = 800V Tj = 25°C Tj = 125°C VF Forward voltage drop IF = 2 A Tj = 25°C Tj = 150°C To evaluate the maximum conduction losses use the following equation : P = 1.05 x IF(AV) + 0.10 x IF2(RMS) DYNAMIC ELECTRICAL CHARACTERISTICS Symbol trr tfr VFP Parameter Reverse recovery time Forward recovery time Forward recovery voltage Tests conditions IF = 0.5 A Irr = 0.25 A IR = 1A IF = 2 A dIF/dt = 50 A/µs VFR = 1.1 x VF max Tj = 25°C Tj = 25°C Min. Typ. Max. 75 200 9 Unit ns ns V 0.89 Min. Typ. Max. 5 50 1.65 1.25 V Unit µA
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STTH208/U
Fig. 1: Conduction losses versus average current.
P(W)
3.5 3.0 100.0
Fig. 2: Forward voltage drop versus forward current.
IFM(A)
δ = 0.1 δ = 0.05
δ = 0.2
δ = 0.5
Tj=150°C (maximum values)
2.5
δ=1
2.0 1.5
10.0
Tj=150°C (typical values)
Tj=25°C (maximum values)
1.0 1.0 0.5
T
IF(AV)(A)
0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
δ=tp/T
2.0 2.2
tp
0.1 2.4 0.00 0.25 0.50 0.75 1.00 1.25
VFM(V)
1.50 1.75 2.00 2.25 2.50 2.75 3.00
Fig. 3-1: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, Lleads = 10mm) (DO-15).
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01
Single pulse δ = 0.2 δ = 0.1 δ = 0.5
Fig. 3-2: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, S=1cm2) (SMB).
Zth(j-c)/Rth(j-c)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3
δ = 0.2 δ = 0.1 δ = 0.5
T
0.2 0.1
T
tp(s)
1.E+01
δ=tp/T
1.E+02
tp
0.0 1.E+03 1.E-01
Single pulse
tp(s)
1.E+00 1.E+01
δ=tp/T
1.E+02
tp
1.E+03
1.E+00
Fig. 4: Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35µm).
Rth(j-a)(°C/W)
110 100 90 80
SMB
70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DO-15 Lleads=10mm
S(cm²)
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STTH208/U
PACKAGE MECHANICAL DATA SMB DIMENSIONS
E1
REF.
Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60
Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063
D
A1 A2 b
1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75
E
c
A1
E E1
b
C L
A2
D L
FOOTPRINT (in millimeters)
2.3
1.52
2.75
1.52
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STTH208/U
PACKAGE MECHANICAL DATA DO-15 DIMENSIONS
C A C
REF.
Millimeters Min. Max.
6.75 3.53 31 0.88
Inches Min.
0.238 0.116 1.024 0.028
Max.
0.266 0.139 1.220 0.035
A B
D
B
6.05 2.95 26 0.71
C D
Ordering code STTH208 STTH208U STTH208RL
s
Marking STTH208 U08 STTH208
Package DO-15 SMB DO-15
Weight 0.4 g 0.11 g 0.4 g
Base qty 1000 2500 6000
Delivery mode Ammopack Tape & reel Tape & reel
Epoxy meets UL 94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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