STTH208UFY

STTH208-Y Datasheet Automotive high voltage ultrafast rectifier Features SMB Flat SMB Flat Wettable leads • • • • • • AEC-Q101 qualified Very low conduction losses Negligible switching losses Low forward and reverse recovery times High junction temperature ECOPACK2 or ECOPACK3 compliant component on demand Description The STTH208-Y, which is using ST’s new 1000 V planar technology, is especially suited for switching mode base drive and transistor circuits. The device is also intended for use as a free-wheeling diode in power supplies and other power switching applications in automotive K functions. Product status link STTH208-Y Product summary IF(AV) 2A VRRM 800 V Tj (max.) 175 °C VF (typ.) 0.89 V Trr (typ.) 53 ns DS10083 - Rev 2 - March 2022 For further information contact your local STMicroelectronics sales office. www.st.com STTH208-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at Tj= 25 °C, unless otherwise specified) Symbol Parameter Value Unit 800 V VRRM Repetitive peak reverse voltage IF(AV) Average forward current TL=120 °C δ = 0.5 2 A IFSM Forward surge current tp= 8.3 ms 30 A Tstg Storage temperature range -65 to + 175 °C Tj(1) Operating temperature range -40 to + 175 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance Symbol Rth(j-l) Parameter Junction to lead Value Unit 18 °C/W Table 3. Static electrical characteristic Symbol Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj= 25 °C Tj= 125 °C Tj= 25 °C Tj= 150 °C VR=VRRM IF=2 A Min. Typ. Max. - 5 - 1 - µA 50 - 1.55 0.89 Unit V 1.25 1. Pulsetest: tp = 5 ms, δ < 2% 2. Pulsetest: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.05 x IF(AV) + 0.10 IF²(RMS) Table 4. Dynamic electrical characteristics Symbol trr Reverse recovery time tfr Forward recovery time VFP DS10083 - Rev 2 Parameter Forward recovery voltage Tj= 25 °C Tj= 25 °C Test conditions Min. Typ. Max. IF=0.5 A; Irr =0.25 A; IR=1 A - 53 75 IF=2 A; dIF/dt= 50 A/µs; VFR=1.9 V - 200 6 9 Unit ns V page 2/8 STTH208-Y Electrical characteristics (curves) 1.1 Electrical characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 3.5 PF(AV)(W) 100.00 δ = 0.05 3.0 Figure 2. Forward voltage drop versus forward current (typical values) δ = 0.1 δ = 0.2 δ = 0.5 IF(A) δ=1 10.00 2.5 Tj = 150°C 2.0 1.00 1.5 1.0 T 0.5 IF(AV)(A) 0.0 0.0 0.4 0.8 1.2 1.6 0.10 tp δ =tp/T 2.0 2.4 Figure 3. Forward voltage drop versus forward current (maximum values) 100.00 IF(A) 1.00 VF(V) 1.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration Zth(j-l)/Rth(j-l) SMBflat 0.3 0.2 0.10 0.8 0.2 0.5 0.4 Tj = 25°C 0.4 VF(V) 0.8 0.7 0.6 Tj = 150°C 1.6 2.0 2.4 2.8 Figure 5. Junction capacitance versus reverse voltage applied (typical values) 100 0.01 0.0 1.0 0.9 10.00 0.01 0.0 Tj = 25°C Single pulse 0.1 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 6. Thermal resistance junction to ambient versus copper surface under each lead C ( pF ) F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C tp(s) 200 Rth(j-a)(°C/W) 175 epoxy printed circuit board FR4, copper thickness: 35 µm 150 125 10 100 75 50 1 25 VR(V) 1 DS10083 - Rev 2 10 100 1000 0 0 Scu(cm²) 1 2 3 4 5 6 7 8 9 10 page 3/8 STTH208-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 7. SMB Flat package outline Table 5. SMB Flat mechanical data Dimensions Millimeters Ref. Min. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.060 L2 DS10083 - Rev 2 Typ. Inches 0.60 0.024 page 4/8 STTH208-Y SMB Flat package information Figure 8. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS10083 - Rev 2 page 5/8 STTH208-Y Ordering information 3 DS10083 - Rev 2 Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH208UFY F208Y SMBflat 50mg 5000 Tape and reel page 6/8 STTH208-Y Revision history Table 6. Document revision history DS10083 - Rev 2 Date Version Changes 04-Feb-2014 1 Initial release. 01-Mar-2022 2 Updated Section 2.1 SMB Flat package information. page 7/8 STTH208-Y IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS10083 - Rev 2 page 8/8