STTH20L03CT

STTH20L03C High frequency secondary rectifier Datasheet - production data Description A1 K Dual center tap fast recovery epitaxial diodes suited for switch mode power supply and high frequency DC to DC converters. A2 K Packaged either in TO-220AB and D2PAK, this device is particularly intended for secondary rectification inside SMPS with high space and power density. K A1 A2 Table 1: Device summary TO-220AB K K Symbol Value IF(AV) 2 x 10 A VRRM 300 V Tj -40 to +175 °C VF (typ.) 0.8 V trr (typ.) 26 ns A2 A2 A1 A1 D2PAK Features    Ultrafast, soft and noise-free recovery Low forward voltage drop meaning very small conduction losses ECOPACK®2 compliant component for D²PAK on demand October 2016 DocID023115 Rev 2 This is information on a product in full production. 1/13 www.st.com Characteristics 1 STTH20L03C Characteristics Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 300 V IF(RMS) Forward rms current 30 A IF(AV) Average forward current δ = 0.5, square wave IFSM Surge non repetitive forward current Tstg Tj TC = 155 °C Per diode 10 TC = 150 °C Per device 20 A tp = 10 ms sinusoidal 150 A Storage temperature range -65 to +175 °C Maximum operating junction temperature range -40 to +175 °C Max. value Unit Table 3: Thermal parameters Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Per diode 1.5 Total 1.0 °C/W 0.5 °C/W When the diodes 1 and 2 are used simultaneously: ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) Table 4: Static electrical characteristics (per diode) Symbol Parameter Test conditions IR(1) Reverse leakage current VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 10 A Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.8 x IF(AV) + 0.015 x IF2(RMS) 2/13 DocID023115 Rev 2 Min. Typ. - Max. 10 - 10 100 - 0.95 1.2 - 0.8 0.95 Unit µA V STTH20L03C Characteristics Table 5: Dynamic electrical characteristics (per diode) Symbol Parameter Test conditions Tj = 25 °C trr IRM Reverse recovery time Reverse recovery current Sfactor Softness factor QRR Reverse recovery charges tfr VFP Tj = 125 °C Forward recovery time Forward recovery voltage Tj = 25 °C Min. Typ. Max. IF = 1 A, VR = 30 V, dlF/dt = - 100 A/µs - 26 35 IF = 10 A, VR = 200 V, dlF/dt = - 200 A/µs - 55 72 - 9 12 A - 0.3 - 250 375 nC 200 ns 3.5 V IF = 10 A, VR = 200 V, dlF/dt = - 200 A/µs IF = 10 A, VFR = 1.05 V, dlF/dt = 100 A/µs DocID023115 Rev 2 Unit ns - 2.5 3/13 Characteristics 1.1 STTH20L03C Characteristics (curves) Figure 1: Conduction losses versus average forward current (per diode) Figure 2: Forward voltage drop versus forward current (per diode) PF(AV) (W) 16 δ = 0.05 14 δ = 0.1 δ = 0.5 δ = 0.2 δ = 1.0 12 10 8 6 T 4 2 IF(AV) (A) δ = tp/T tp 0 0 2 4 6 8 10 12 14 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration Figure 4: Peak reverse recovery current versus dlF/dt (typical values, per diode) Figure 5: Reverse recovery time versus dlF/dt (typical values, per diode) Figure 6: Reverse recovery charges versus dlF/dt (typical values, per diode) 400 Q rr (nC) IF =I F(AV) VR=200 V Tj=125 °C 350 300 250 200 150 100 dI F/dt(A/µs) 50 0 0 4/13 DocID023115 Rev 2 50 100 150 200 250 300 350 400 450 500 STTH20L03C Characteristics Figure 7: Reverse recovery softness factor versus dlF/dt (typical values, per diode) 0.8 Figure 8: Relative variation of dynamic parameters versus junction temperature Sfactor IF=IF(AV) VR=200 V Tj=125 °C 0.7 0.6 0.5 0.4 0.3 0.2 dI F/dt(A/µs) 0.1 0.0 0 50 100 150 200 250 300 350 400 450 500 Figure 9: Transient peak forward voltage versus dlF/dt (typical values, per diode) Figure 10: Forward recovery time versus dlF/dt (typical values, per diode) t fr (ns) 180 IF =I F(AV) VFR=1.05 V Tj=125 °C 160 140 120 100 80 60 40 20 dI F/dt(A/µs) 0 0 Figure 11: Junction capacitance versus reverse voltage applied (typical values, per diode) 50 100 150 200 250 300 350 400 450 500 Figure 12: Thermal resistance, junction to ambient, versus copper surface under tab 80 Rth(j-a) (°C/W) D²PAK 70 60 50 40 30 20 Epoxy printed board FR4, e CU= 35 µm 10 SCu(cm²) 0 0 DocID023115 Rev 2 5 10 15 20 25 30 35 5/13 40 Package information 2 STTH20L03C Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     6/13 Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N·m (for TO-220AB) Maximum torque value: 0.7 N·m (for TO-220AB) DocID023115 Rev 2 Package information STTH20L03C 2.1 D²PAK package information Figure 13: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID023115 Rev 2 7/13 Package information STTH20L03C Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 8/13 Inches 0.4 typ. 0° 0.015 8° DocID023115 Rev 2 0° 8° Package information STTH20L03C Figure 14: D²PAK recommended footprint (dimensions in mm) DocID023115 Rev 2 9/13 Package information 2.2 STTH20L03C TO-220AB package information Figure 15: TO-220AB package outline 10/13 DocID023115 Rev 2 Package information STTH20L03C Table 7: TO-220AB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.240 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 0.620 D1 1.27 typ. 0.050 typ. E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.260 J1 2.40 2.72 0.094 0.107 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θP 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 DocID023115 Rev 2 11/13 Ordering information 3 STTH20L03C Ordering information Table 8: Ordering information Order code 4 Marking Package Weight Base qty. Delivery mode STTH20L03CT STTH20L03CT TO-220AB 1.9 g 50 Tube STTH20L03CG-TR STTH20L03CG D2PAK 1.38 g 1000 Tape and reel Revision history Table 9: Document revision history 12/13 Date Revision Changes 22-Jun-2012 1 Initial release. 07-Oct-2016 2 Updated cover page and Table 8: "Ordering information". Updated Section 2.1: "D²PAK package information". DocID023115 Rev 2 STTH20L03C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID023115 Rev 2 13/13