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STTH20R04FP

STTH20R04FP

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO220FP-2

  • 描述:

    Diode Standard 400V 20A Through Hole TO-220FPAC

  • 数据手册
  • 价格&库存
STTH20R04FP 数据手册
STTH20R04 High efficiency rectifier Features ■ ■ ■ ■ ■ A K Ultrafast recovery Low power losses High surge capability Low leakage current High junction temperature A K K A TO-220FPAC STTH20R04FP K DO-247 STTH20R04W K Description The STTH20R04 is an ultrafast recovery power rectifier dedicated to energy recovery in PDP application. A A K NC It is especially designed for clamping function in energy recovery block. The compromise between forward voltage drop and recovery time offers optimized performances. TO-220AC STTH20R04D D2PAK STTH20R04G Table 1. Device summary IF(peak) VRRM trr (typ) Tj VF (typ) 20 A 400 V 18 ns 175 °C 1.15 V November 2007 Rev 1 1/10 www.st.com 10 Characteristics STTH20R04 1 Table 2. Symbol VRRM IF(RMS) Characteristics Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage RMS forward current DO-247, TO-220AC, D2PAK IF(peak) Peak working forward current TO-220FPAC IFSM Tstg Tj Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 135 °C δ = 0.5 Square signal Tc = 105 °C δ = 0.5 Square signal tp = 10 ms sinusoidal 20 A Value 400 50 Unit V A 150 -65 to + 175 175 A °C °C Table 3. Symbol Rth(j-c) Thermal parameters Parameter DO-247, TO-220AC, D2PAK Junction to case TO-220FPAC 5 Value 2.8 °C/W Unit Table 4. Symbol IR (1) VF (2) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C VR = VRRM Min Typ Max 20 µA 20 1.5 IF = 20 A 1.15 200 1.7 V 1.35 Unit 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.05 x IF(AV) + 0.015 IF2(RMS) Table 5. Symbol trr tfr VFP IRM Sfactor Recovery characteristics Parameter Reverse recovery time Tj = 25 °C Tj = 25 °C Tj = 25 °C Test conditions IF = 0.5 A, Irr = 0.25 A, IR = 1 A IF = 1 A, VR = 30 V, dIF/dt = -50 A/µs IF = 20 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax IF = 20 A , dIF/dt = 100 A/µs 1.7 8 0.3 Min Typ 18 35 Max 25 ns 45 150 2.5 11 ns V A Unit Forward recovery time Peak forward voltage Reverse recovery current Softness factor I = 20 A, VCC = 200 V Tj = 125 °C F dIF/dt = 200 A/µs 2/10 STTH20R04 Characteristics Figure 1. P(W) 35 Conduction losses versus average forward current δ=0.2 δ=1 Figure 2. Forward voltage drop versus forward current δ=0.1 δ=0.5 200 180 160 IFM(A) 30 25 20 15 10 5 0 0.0 2.5 5.0 δ=0.05 Tj=125°C (Maximum values) 140 120 100 80 60 T Tj=125°C (Typical values) Tj=25°C (Maximum values) 40 tp IF(av) (A) 7.5 10.0 12.5 15.0 17.5 δ=tp/T 20.0 22.5 20 0 VFM(V) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 25.0 0.0 Figure 3. Relative variation of thermal Figure 4. impedance junction to case versus pulse duration 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 tP(s) Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) Single pulse TO-220FPAC 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-04 Single pulse TO-220AC TO-247 tP(s) 1.E-03 1.E-02 1.E-01 1.E+00 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 5. IRM(A) 18 16 14 12 10 IF=IF(AV) VR=200V Tj=125°C Peak reverse recovery current versus dIF/dt (typical values) Figure 6. Reverse recovery time versus dIF/dt (typical values) 100 90 80 70 60 50 trr(ns) IF=IF(AV) VR=200V Tj=125°C 8 6 4 2 0 0 50 100 150 200 250 300 350 400 450 500 40 30 20 dIF/dt(A/µs) 10 0 0 50 100 150 dIF/dt(A/µs) 200 250 300 350 400 450 500 3/10 Characteristics STTH20R04 Figure 7. QRR(nC) Reverse recovery charges versus dIF/dt (typical values) Figure 8. S factor Reverse recovery softness factor versus dIF/dt (typical values) 400 350 300 250 200 150 IF=IF(AV) VR=200V Tj=125°C 0.9 0.8 0.7 0.6 0.5 0.4 0.3 IF < 2 x IF(AV) VR=200V Tj=125°C 100 50 0 0 50 100 150 200 250 300 350 400 450 500 0.2 dIF/dt(A/µs) 0.1 0.0 0 50 100 150 dIF/dt(A/µs) 200 250 300 350 400 450 500 Figure 9. Relative variations of dynamic parameters versus junction temperature Figure 10. Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 10 9 IF=IF(AV) Tj=125°C 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 IRM SFACTOR 8 7 6 5 4 3 0.4 0.2 0.0 25 50 QRR Tj(°C) 75 IF=IF(AV) VR=200V Reference: Tj=125°C 2 1 dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 100 125 0 Figure 11. Forward recovery time versus dIF/dt (typical values) tfr(ns) IF=IF(AV) VFR=1.1 x V F max. Tj=125°C Figure 12. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C 300 250 200 150 100 50 100 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 VR(V) 10 1 10 100 1000 4/10 STTH20R04 Package information 2 Package information ● ● ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque calue: 0.8 N·m Maximum torque value: 1.0 N·m In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6. DO-247 dimensions Dimensions Ref. Millimeters Min. A V Inches Min. Typ. Max. 0.203 0.102 0.031 0.055 0.078 Typ. Max. 4.85 2.20 0.40 1.00 2.00 2.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5° 60° 3.55 5.15 0.191 2.60 0.086 0.80 0.015 1.40 0.039 D E Dia V F F2 H A F3 G 2.40 0.078 0.429 15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5° 60° 3.65 0.139 0.094 L5 H L L2 L4 F2 L3 F3 V2 F G M E L1 D 0.620 0.793 0.169 L L1 L2 L3 L4 L5 M V V2 Dia. 0.582 0.118 0.143 5/10 Package information Table 7. TO-220AC dimensions Dimensions Ref. Millimeters Min. A H2 ØI L5 L7 L6 L2 C A STTH20R04 Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/10 STTH20R04 Table 8. D2PAK dimensions Package information Dimensions Ref. Millimeters Min. A A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D L L3 A1 B2 B G A2 R B2 C C2 C D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 7/10 Package information Table 9. TO-220FPAC dimensions Dimensions Ref. Millimeters Min. A A H B STTH20R04 Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 B D E Dia F L6 L2 L3 L5 F1 L4 D L7 F1 G G1 H L2 L3 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L4 L5 L6 L7 Dia. 8/10 STTH20R04 Ordering information 3 Ordering information Table 10. Ordering information Marking STTH20R04FP STTH20R04D STTH20R04W STTH20R04G STTH20R04G Package TO-220FPAC TO-220AC DO-247 D2PAK Weight 1.64 g 1.86 g 4.4 g 1.48 g 1000 Tape and reel Base qty 50 50 50 50 Delivery mode Tube Tube Tube Tube Order code STTH20R04FP STTH20R04D STTH20R04W STTH20R04G STTH20R04G-TR 4 Revision history Table 11. Date 08-Nov-2007 Document revision history Revision 1 First issue Description of changes 9/10 STTH20R04 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10
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