STTH2L06UFY

STTH2L06-Y Datasheet Automotive 2 A - 600 V turbo 2 ultrafast rectifier Features SMB Flat SMB Flat Wettable leads • • • • • • • • AEC-Q101 qualified Ultrafast recovery Low switching losses High surge capability Low leakage current High junction temperature ECOPACK2 or ECOPACK3 compliant component on demand VRRM guaranteed from -40 to +175 °C Description The STTH2L06-Y is an ultrafast recovery power rectifier dedicated to energy recovery in automotive application housed in SMB Flat to improve space saving. It is especially designed for clamping function in energy recovery block. The compromise between forward voltage drop and recovery time offers optimized performances. Product status link STTH2L06-Y Product summary IF(AV) 2A VRRM 600 V Tj (max.) 175 °C VF (typ.) 0.9 V Trr (typ.) 50 ns DS10490 - Rev 2 - April 2022 For further information contact your local STMicroelectronics sales office. www.st.com STTH2L06-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at Tj= 25 °C, unless otherwise specified) Symbol Parameter Value Unit 600 V VRRM Repetitive peak reverse voltage, Tj = -40 to +175 °C IF(AV) Average forward current TL = 125 °C δ = 0.5 2 A IFSM Forward surge current tp = 10 ms 30 A Tstg Storage temperature range -65 to + 175 °C Tj(1) Operating temperature range -40 to + 175 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance Symbol Rth(j-l) Parameter Junction to lead Value Unit 18 °C/W Max. Unit Table 3. Static electrical characteristic Symbol Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 150 °C VR = 600 V IF = 2 A Min. Typ. - 2 12 - 85 1.4 - 0.9 1.15 Min. Typ. Max. - 50 70 µA V 1. Pulsetest: tp = 5 ms, δ < 2% 2. Pulsetest: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.95 x IF(AV) + 0.10 IF²(RMS) Table 4. Dynamic electrical characteristics Symbol trr Reverse recovery time tfr Forward recovery time VFP DS10490 - Rev 2 Parameter Forward recovery voltage Test conditions Tj = 25 °C IF = 1 A; dIF/dt = -50 A/µs; VR = 30 V Tj = 25 °C IF = 2 A; dIF/dt = 100 A/µs; VFR = 2.5 V - 80 - 7 Unit ns V page 2/9 STTH2L06-Y Electrical characteristics (curves) 1.1 Electrical characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Forward voltage drop versus forward current (typical values) PF(AV) (W) IF(A) 3.0 δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 10.00 δ=1 2.5 2.0 Tj = 150°C 1.00 Tj = 25°C 1.5 0.10 1.0 T 0.5 IF(AV) (A) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 tp δ =tp/T 1.4 1.6 1.8 2.0 2.2 0.0 2.4 Figure 3. Forward voltage drop versus forward current (maximum values) 10.00 VF(V) 0.01 IF(A) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration 1.0 Zth(j- l) /Rth(j- l ) 0.9 0.8 0.7 Tj = 150°C 1.00 0.6 Tj = 25°C 0.5 0.4 0.10 0.3 0.2 Single pulse 0.1 VF(V) 0.01 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Figure 5. Peak reverse recovery current versus dIF/dt (typical values) t p (s) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 6. Reverse recovery time versus dIF/dt (typical values) IRM(A) t RR(n s ) 15.0 500 VR = 400 V Tj = 125 °C VR = 400 V Tj = 125 °C 450 IF = 2 x IF(av) 12.5 400 350 IF = 0.5 x IF(av) 10.0 IF = IF(av) 300 7.5 IF = 2 x IF(av) 250 200 5.0 150 100 2.5 dI F/dt (A/µ s) 0.0 IF = IF(av) 50 IF = 0.5 x IF(av) dI F/dt (A/µ s) 0 0 50 DS10490 - Rev 2 100 150 200 250 300 350 400 450 500 0 50 100 150 200 250 300 350 400 450 500 page 3/9 STTH2L06-Y Electrical characteristics (curves) Figure 7. Reverse recovery charges versus dIF/dt (typical values) Qrr (n C) 1.4 800 VR = 400 V Tj = 125 °C 700 Figure 8. Relative variation of dynamic parameters versus junction temperature IF = IF(av) VR = 400 V Reference: T j = 125 °C 1.2 IF = 2 x IF(av) 600 1.0 QRR 500 0.8 IF = IF(av) 400 0.6 IF = 0.5 x IF(av) 300 0.4 200 IRM 0.2 100 dI F/dt (A/µ s) 0 0 100 200 300 400 Tj (°C) 0.0 25 50 75 100 125 500 Figure 9. Transient peak forward voltage versus dIF/dt (typical values) 12 t RR VFP(V) Figure 10. Forward recovery time versus dIF/dt (typical values) 100 t FR(ns) IF = 2 A VFR = 2.5 V Tj = 125 °C IF = 2 A Tj = 125 °C 10 80 8 60 6 40 4 20 2 dI F/dt (A/µ s) 0 20 40 60 80 100 120 140 160 180 200 Figure 11. Junction capacitance versus reverse voltage applied (typical values) dI F/dt (A/µ s) 0 20 40 60 80 100 120 140 160 180 200 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead Rth(j-a)(°C/W) C(pF) 150 100 SMB-Flat Epoxy printed board FR4, copper thickness: 70 μm F = 1 MHz Vosc = 30 mVRMS Tj = 25 °C 120 90 10 60 30 SCu (cm²) VR(V) 1 1 DS10490 - Rev 2 10 100 1000 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/9 STTH2L06-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 13. SMB Flat package outline Table 5. SMB Flat mechanical data Dimensions Millimeters Ref. Min. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.060 L2 DS10490 - Rev 2 Typ. Inches 0.60 0.024 page 5/9 STTH2L06-Y SMB Flat package information Figure 14. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS10490 - Rev 2 page 6/9 STTH2L06-Y Ordering information 3 DS10490 - Rev 2 Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH2L06UFY F2L6Y SMBflat 50 mg 5000 Tape and reel page 7/9 STTH2L06-Y Revision history Table 6. Document revision history DS10490 - Rev 2 Date Version Changes 04-Aug-2014 1 Initial release. 26-Apr-2022 2 Updated Section 2.1 SMB Flat package information. page 8/9 STTH2L06-Y IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS10490 - Rev 2 page 9/9