STTH2R02A

STTH2R02 Datasheet 200 V - 2 A ultrafast recovery diode Features • • • • Very low conduction losses Negligible switching losses Low forward voltage drop High junction temperature • ECOPACK®2 compliant Applications • • • • Switching diode LED Lighting Auxiliary power supply Flyback diode Description The STTH2R02 uses ST's patented 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. Packaged in SMA, SMB, the STTH2R02 is optimized for use low voltage, high frequency inverters, free wheeling and polarity protection Product status STTH2R02 Product summary Symbol Value IF(AV) 2A VRRM 200 V T j(max.) 175 °C VF(typ.) 0.7 V trr(typ.) 15 ns DS4744 - Rev 3 - December 2018 For further information contact your local STMicroelectronics sales office. www.st.com STTH2R02 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current δ = 0.5, square wave IFSM Surge non repetitive forward current Tstg Storage temperature range Tj SMA TL = 90 °C SMB TL = 90 °C Value Unit 200 V 2 A 75 A -65 to +175 °C +175 °C tp = 10 ms sinusoidal Operating junction temperature Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value Unit 30 °C/W SMA / SMB For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Min. VR = VRRM IF = 6 A Tj = 25 °C Tj = 100 °C Tj = 150 °C IF = 2 A Typ. - Max. 3 2 - 20 Unit µA 1.20 - 0.89 1.00 - 0.76 0.85 - 0.70 0.80 V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.68 x IF(AV) + 0.06 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS4744 - Rev 3 page 2/13 STTH2R02 Characteristics Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise specified) Symbol trr IRM tfr VFP DS4744 - Rev 3 Parameters Min. Typ. Max. IF = 1 A, dIF/dt = -50 A/μs, VR = 30 V - 23 30 IF = 1 A, dIF/dt = -100 A/μs, VR = 30 V - 15 20 Reverse recovery current IF = 2 A, dIF/dt = -200 A/μs, VR = 160 V, Tj = 125 °C - 3 4 Forward recovery time IF = 2 A, dIF/dt = 100 A/μs, VFR = 1.1 VF(max.) - 40 ns Forward recovery voltage IF = 2 A, dIF/dt = 100 A/μs - 2.0 V Reverse recovery time Test conditions Unit ns A page 3/13 STTH2R02 Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Forward voltage drop versus forward current (typical values) Figure 1. Peak current versus duty cycle IM(A) 100 IF (A) T 50 IM 80 tp δd=tp/T 40 60 30 P = 5W 40 Tj=150°C 20 P = 2W P = 1W 20 0 VF (V) δ 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 3. Forward voltage drop versus forward current (maximum values) 50 Tj=25°C 10 0 0.0 0.5 1.5 2.0 2.5 Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration (SMA) IFM(A) 1.0 Zth(j-a) /Rth(j-a) SMA Scu=1cm² 0.9 40 1.0 0.8 0.7 30 0.6 0.5 Tj=150°C 20 0.4 0.3 Tj=25°C 0.2 10 Single pulse 0.1 VFM(V) t P(s) 0.0 0 0.0 DS4744 - Rev 3 0.5 1.0 1.5 2.0 2.5 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 page 4/13 STTH2R02 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction to lead versus pulse duration (SMB) C(pF) Zth(j-a) /Rth(j-a) 1.0 Figure 6. Junction capacitance versus reverse voltage applied (typical values) 100 F=1MHz Vosc=30mVRMS Tj=25°C SM B Scu=1cm² 0.9 0.8 0.7 0.6 10 0.5 0.4 0.3 0.2 0.1 Single pulse VR(V) t P(s) 1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1 1.E+03 Figure 7. Reverse recovery charges versus dIF/dt (typical values) 10 100 1000 Figure 8. Reverse recovery time versus dIF/dt (typical values) t RR(ns) QRR (nC) 60 60 IF= 2 A VR= 160V IF = 2 A VR=160V 50 50 40 40 30 Tj=125°C 30 Tj=125°C 20 20 10 Tj=25°C Tj=25°C 10 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 10 100 1000 Figure 9. Peak reverse recovery current versus dIF/dt (typical values) 100 1000 Figure 10. Relative variations of dynamic parameters versus junction temperature QRR ; IRM [T j ] / Q RR ; IRM [T j =125°C] IRM (A) 6 10 1.4 IF = 2 A VR=160V IF= 2 A VR=160V 1.2 5 1.0 4 IRM 0.8 3 0.6 Tj=125°C 2 QRR 0.4 Tj=25°C 1 0.2 Tj (°C) dIF/dt(A/µs) 0.0 0 10 DS4744 - Rev 3 100 1000 25 50 75 100 125 150 page 5/13 STTH2R02 Characteristics (curves) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (typical values) Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (typical values) Rth(j-a) (°C/W) Rth(j-a) (°C/W) 200 Epoxy printed circuit board FR4, copper thickness: 35 µm 200 SMA Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm 150 150 100 100 50 50 SMB S(Cu)(cm²) S(Cu)(cm²) 0 0 0.0 0.5 DS4744 - Rev 3 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 6/13 STTH2R02 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 13. SMA package outline E1 D E A1 C A2 L b Table 5. SMA package mechanical data Dimensions Ref. DS4744 - Rev 3 Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 7/13 STTH2R02 SMA package information Figure 14. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS4744 - Rev 3 page 8/13 STTH2R02 SMB package information 2.2 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 15. SMB package outline E1 D E A1 C A2 L DS4744 - Rev 3 b page 9/13 STTH2R02 SMB package information Table 6. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 Figure 16. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS4744 - Rev 3 page 10/13 STTH2R02 Ordering information 3 Ordering information Table 7. Ordering information DS4744 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode STTH2R02A R2A SMA 0.068 g 5000 Tape and reel STTH2R02U R2U SMB 0.107 g 2500 Tape and reel page 11/13 STTH2R02 Revision history Table 8. Document revision history DS4744 - Rev 3 Date Revision Changes 03-May-2006 1 First issue. 13-Oct-2006 2 Maximum Tj set to 175° C for all packages in Table 1. 11-Dec-2018 3 Removed DO-15 package information. page 12/13 STTH2R02 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS4744 - Rev 3 page 13/13