STTH2R06RL

STTH2R06 High efficiency ultrafast diode Features A ■ Very low conduction losses ■ Negligible switching losses ■ Low forward and reverse recovery times ■ High junction temperature K Description The STTH2R06 uses ST Turbo 2 600 V planar Pt doping technology. It is specially suited for switching mode base drive and transistor circuits. Packaged in axial, SMA, SMB and SMC, this device is intended for use in high frequency inverters, free wheeling and polarity protection. DO-41 STTH2R06 SMA STTH2R06A SMB STTH2R06U SMC STTH2R06S Table 1. December 2009 Doc ID 10757 Rev 4 Device summary Symbol Value IF(AV) 2A VRRM 600 V Tj 175 °C VF(typ) 1.0 V trr (typ) 35 ns 1/10 www.st.com 10 Characteristics 1 STTH2R06 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current IF(AV) Average forward current δ = 0.5 DO-41 TL = 70 °C SMA TL = 85 °C SMB TL = 100 °C SMC TL = 115 °C Unit 600 V 7 A 2 A DO-41 40 tp = 10ms SMA / SMB / sinusoidal SMC 30 A IFSM Surge non repetitive forward current Tstg Storage temperature range -65 to + 175 °C Operating junction temperature range -40 to + 175 °C Maximum Unit Tj Table 3. Thermal resistance Symbol Parameter DO-41 Rth(j-l) Table 4. Symbol L = 5 mm 35 SMA 30 SMB 25 SMC 20 Junction to lead °C/W Static electrical characteristics Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 2 A Min. Typ. Max. - - 2 - 12 85 - - 1.7 - 1.0 1.25 V 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the maximum conduction losses use the following equation: P = 1 x IF(AV) + 0.125 IF2(RMS) Doc ID 10757 Rev 4 Unit µA 1. Pulse test: tp = 5 ms, δ < 2 % 2/10 Value STTH2R06 Table 5. Characteristics Dynamic electrical characteristics Symbol Test conditions Parameter Min. Typ. Max. - - 30 IF = 0.5 A, Irr = 0.25 A, IR = 1 A Reverse recovery time trr Tj = 25 °C VFP Forward recovery voltage Figure 1. ns IF = 1 A, dIF/dt = -50 A/µs VR = 30 V IF = 2 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax Forward recovery time tfr Tj = 25 °C Unit Conduction losses versus average Figure 2. forward current - 35 50 - - 100 ns - - 10 V Forward voltage drop versus forward current IFM(A) P(W) 3.0 δ = 0.1 δ = 0.05 10 δ = 0.5 δ = 0.2 Tj=150°C (maximum values) 9 2.5 8 7 δ=1 2.0 Tj=150°C (typical values) 6 5 1.5 4 1.0 Tj=25°C (maximum values) 3 T 2 0.5 δ=tp/T IF(AV)(A) 1 tp 0.0 VFM(V) 0 0.0 0.5 Figure 3. 1.0 1.5 2.0 2.5 0.00 0.25 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Zth(j-a)/Rth(j-a) 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 Peak reverse recovery current versus dIF/dt (typical values) IRM(A) 1.0 9 SMA/SMB/SMC: SCU = 1cm2 0.9 VR=400V Tj=125°C 8 IF=2 x IF(AV) 0.8 7 SMA 0.7 IF=IF(AV) 6 0.6 IF=0.5 x IF(AV) 5 SMC 0.5 DO-41 4 0.4 3 0.3 SMB 2 0.2 0.1 1 Single pulse 1.E-02 dIF/dt(A/µs) tp(s) 0 0.0 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0 50 Doc ID 10757 Rev 4 100 150 200 250 300 350 400 450 500 3/10 Characteristics Figure 5. STTH2R06 Reverse recovery time versus dIF/dt Figure 6. (typical values) trr(ns) Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) 400 300 VR=400V Tj=125°C VR=400V Tj=125°C 350 250 IF=2 x IF(AV) 300 200 250 IF=2 x IF(AV) 150 IF=IF(AV) 200 IF=IF(AV) IF=0.5 x IF(AV) IF=0.5 x IF(AV) 150 100 100 50 50 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 50 Figure 7. 100 150 200 250 300 350 400 450 0 500 Relative variations of dynamic parameters versus junction temperature 100 Figure 8. 200 300 400 500 Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 1.2 30 IF=IF(AV) Tj=125°C 1.0 25 0.8 20 trr IRM 0.6 QRR 15 IF=IF(AV) VR=400V Reference: Tj=125°C 0.4 10 0.2 5 Tj(°C) dIF/dt(A/µs) 0.0 0 25 50 Figure 9. 75 100 125 0 50 100 150 200 250 Forward recovery time versus dIF/dt Figure 10. Junction capacitance versus (typical values) reverse voltage applied (typical values) C(pF) tfr(ns) 300 100 IF=IF(AV) VFR=1.1 x VF max. Tj=125°C F=1MHz VOSC=30mVRMS Tj=25°C 250 200 150 10 100 50 dIF/dt(A/µs) VR(V) 0 1 0 4/10 50 100 150 200 250 1 Doc ID 10757 Rev 4 10 100 1000 STTH2R06 Characteristics Figure 11. Thermal resistance junction to ambient versus copper surface under each lead Figure 12. Thermal resistance versus lead length (DO-41) Rth(j-a)(°C/W) Rth(°C/W) 120 120 epoxy FR4, eCU = 35 µm Rth(j-a) 100 100 SMA SMB 80 80 60 60 SMB 40 Rth(j-l) 40 20 20 Llead(mm) SCU(cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 Doc ID 10757 Rev 4 10 15 20 25 5/10 Package information 2 STTH2R06 Package information ● Epoxy meets UL 94, V0 ● Band indicates cathode ● Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. DO-41 (plastic) dimensions Dimensions Ref. Table 7. C A Inches Min. Max. Min. Max. A 4.07 5.20 0.160 0.205 B 2.04 2.71 0.080 0.107 C 25.4 D 0.71 ØD ØB C Millimeters 1 0.86 0.028 0.034 SMA dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L 6/10 b Doc ID 10757 Rev 4 STTH2R06 Package information Figure 13. Footprint (dimensions in mm) 2.63 1.4 1.4 1.64 5.43 Table 8. SMB dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 14. Footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Doc ID 10757 Rev 4 7/10 Package information Table 9. STTH2R06 SMC dimensions Dimensions Ref. E1 D E A2 E2 L b Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 (1) b 2.90 3.20 0.114 0.126 c(1) 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.059 1. Dimensions b and c apply to plated leads Figure 15. Footprint, dimensions in mm (inches) 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.322) 8/10 Inches Min. A1 C Millimeters Doc ID 10757 Rev 4 STTH2R06 3 Ordering information Ordering information Table 10. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STTH2R06 STTH2R06 DO-41 0.34 g 2000 Ammopack STTH2R06RL STTH2R06 DO-41 0.34 g 5000 Tape and reel STTH2R06A R6A SMA 0.068 g 5000 Tape and reel STTH2R06U R6U SMB 0.11 g 2500 Tape and reel STTH2R06S R62 SMC 0.243 g 2500 Tape and reel Revision history Table 11. Document revision history Date Revision Changes 07-Sep-2004 1 First issue 1-Jun-2005 2 SMC package addition. 30-Sep-2009 3 Updated Table 6 package dimensions. 04-Dec-2009 4 Updated Table 9 package dimensions. Doc ID 10757 Rev 4 9/10 STTH2R06 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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