STTH2R06-Y
Datasheet
Automotive 2 A - 600 V turbo 2 ultrafast rectifier
Features
SMB Flat
SMB Flat
Wettable leads
•
•
•
•
•
•
•
•
AEC-Q101 qualified
Ultrafast recovery
Low switching losses
High surge capability
Low leakage current
High junction temperature
ECOPACK2 or ECOPACK3 compliant component on demand
VRRM guaranteed from -40 to +175 °C
Description
The STTH2R06-Y is an ultrafast recovery power rectifier dedicated to energy
recovery in automotive application housed in SMB Flat to improve space saving.
It is especially designed for clamping function in energy recovery block.
The compromise between forward voltage drop and recovery time offers optimized
performances.
Product status link
STTH2R06-Y
Product summary
IF(AV)
2A
VRRM
600 V
Tj (max.)
175 °C
VF (typ.)
1.1 V
Trr (typ.)
35 ns
DS10492 - Rev 2 - May 2022
For further information contact your local STMicroelectronics sales office.
www.st.com
STTH2R06-Y
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at Tj= 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
600
V
VRRM
Repetitive peak reverse voltage, Tj = -40 to +175 °C
IF(AV)
Average forward current
TL = 110 °C δ =
0.5
2
A
IFSM
Forward surge current
tp = 10 ms
28
A
Tstg
Storage temperature range
-65 to + 175
°C
T (1)
Operating temperature range
-40 to + 175
°C
j
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance
Symbol
Rth(j-l)
Parameter
Junction to lead
Value
Unit
18
°C/W
Max.
Unit
Table 3. Static electrical characteristic
Symbol
Parameter
IR(1)
Reverse leakage current
VF(2)
Forward voltage drop
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Tj = 150 °C
VR = VRRM
IF = 2 A
Min.
Typ.
-
2
12
-
85
1.9
-
1.1
1.4
Min.
Typ.
Max.
-
35
50
µA
V
1. Pulsetest: tp = 5 ms, δ < 2%
2. Pulsetest: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 1.10 x IF(AV) + 0.15 IF²(RMS)
Table 4. Dynamic electrical characteristics
Symbol
trr
Reverse recovery time
tfr
Forward recovery time
VFP
DS10492 - Rev 2
Parameter
Forward recovery voltage
Test conditions
Tj = 25 °C IF = 1 A; dIF/dt = -50 A/µs; VR = 30 V
Tj = 25 °C IF = 2 A; dIF/dt = 100 A/µs; VFR = 2.5 V
-
80
-
7
Unit
ns
V
page 2/9
STTH2R06-Y
Electrical characteristics (curves)
1.1
Electrical characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
4
Figure 2. Forward voltage drop versus forward current
(typical values)
PF(AV) (W)
10.00
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
IF(A)
δ=1
3
Tj = 150°C
1.00
2
Tj = 25°C
0.10
T
1
IF(AV) (A)
0
0.0
0.5
1.0
tp
δ =tp/T
1.5
VF(V)
0.01
2.0
2.5
Figure 3. Forward voltage drop versus forward current
(maximum values)
0.0
0.5
1.0
1.5
2.5
2.0
Figure 4. Relative variation of thermal impedance junction
to lead versus pulse duration
IF(A)
Zth(j- l) /Rth(j- l )
10.00
1.0
0.9
0.8
Tj = 150°C
1.00
0.7
0.6
0.5
Tj = 25°C
0.4
0.10
0.3
0.2
0.01
0.0
0.5
1.0
1.5
2.0
2.5
t p (s)
0.0
3.0
Figure 5. Peak reverse recovery current versus dIF/dt
(typical values)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Figure 6. Reverse recovery time versus dIF/dt (typical
values)
t RR(n s )
IRM(A)
300
9
8
Single pulse
0.1
VF(V)
VR = 400 V
Tj = 125 °C
VR = 400 V
Tj = 125 °C
250
IF = 2 x IF(av)
7
IF = IF(av)
6
5
200
IF = 0.5 x IF(av)
150
IF = 2 x IF(av)
4
100
3
2
50
IF = IF(av)
IF = 0.5 x IF(av)
1
dI F/dt (A/µ s)
0
0
50
DS10492 - Rev 2
100
150
200
250
300
350
400
450
500
dI F/dt (A/µ s)
0
0
50
100
150
200
250
300
350
400
450
500
page 3/9
STTH2R06-Y
Electrical characteristics (curves)
Figure 7. Reverse recovery charges versus dIF/dt (typical
values)
400
QRR(n C)
1.2
VR = 400 V
Tj = 125 °C
350
Figure 8. Relative variation of dynamic parameters versus
junction temperature
1.0
IF = 2 x IF(av)
300
0.8
250
t RR
IF = IF(av)
0.6
200
IRM
IF = 0.5 x IF(av)
150
0.4
100
QRR
0.2
dI F/dt (A/µ s)
0
0
100
200
300
400
IF = IF(av)
VR = 400 V
Reference: T j = 125 °C
Tj (°C)
50
0.0
25
50
75
100
125
500
Figure 9. Transient peak forward voltage versus dIF/dt
(typical values)
VFP(V)
Figure 10. Forward recovery time versus dIF/dt (typical
values)
120
12
t FR(ns)
IF = IF(AV)
VFR = 2.5 V
Tj = 125 °C
IF = IF(AV)
Tj = 125 °C
10
100
8
80
6
60
4
40
20
2
dI F/dt (A/µ s)
0
20
40
60
80
100
120
140
160
180
dI F/dt (A/µ s)
0
200
Figure 11. Junction capacitance versus reverse voltage
applied (typical values)
20
40
60
80
100
120
140
160
180
200
Figure 12. Thermal resistance junction to ambient versus
copper surface under each lead
C(pF)
Rth(j-a)(°C/W)
100
150
F = 1 MHz
Vosc = 30 mVRMS
Tj = 25 °C
SMB-Flat
Epoxy printed board FR4, copper thickness: 70 μm
120
90
10
60
30
VR(V)
1
1
DS10492 - Rev 2
10
100
1000
SCu (cm²)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 4/9
STTH2R06-Y
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMB Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 13. SMB Flat package outline
Table 5. SMB Flat mechanical data
Dimensions
Millimeters
Ref.
Min.
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.043
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.200
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.060
L2
DS10492 - Rev 2
Typ.
Inches
0.60
0.024
page 5/9
STTH2R06-Y
SMB Flat package information
Figure 14. Footprint recommendations, dimensions in mm (inches)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
5.84
(0.230)
millimeters
(inches)
DS10492 - Rev 2
page 6/9
STTH2R06-Y
Ordering information
3
DS10492 - Rev 2
Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STTH2R06UFY
F2R6Y
SMBflat
50 mg
5000
Tape and reel
page 7/9
STTH2R06-Y
Revision history
Table 6. Document revision history
DS10492 - Rev 2
Date
Version
Changes
04-Aug-2014
1
Initial release.
02-May-2022
2
Updated Section 2.1 SMB Flat package information.
page 8/9
STTH2R06-Y
IMPORTANT NOTICE – READ CAREFULLY
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products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names
are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2022 STMicroelectronics – All rights reserved
DS10492 - Rev 2
page 9/9
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