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STTH3010WY

STTH3010WY

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    DO-247

  • 描述:

    DIODE GEN PURP 1KV 30A DO247-2

  • 数据手册
  • 价格&库存
STTH3010WY 数据手册
STTH3010-Y Automotive ultrafast recovery - high voltage diode Datasheet − production data Features ■ AEC-Q101 qualified ■ Ultrafast soft recovery ■ Very low conduction and switching losses ■ High frequency and/or high pulsed current operation ■ High reverse voltage capability ■ High junction temperature ■ A K K A NC D2PAK STTH3010GY ® ECOPACK 2 compliant component (STTH3010WY) Description A The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability like automotive applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. June 2012 This is information on a product in full production. K DO-247 STTH3010WY Table 1. Doc ID 018923 Rev 1 Device summary IF(AV) 30 A VRRM 1000 V Tj 175 °C VF (typ) 1.30 V trr (typ) 42 ns 1/9 www.st.com 9 Characteristics STTH3010-Y 1 Characteristics Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current DO-247 Tc = 105 °C D2PAK Tc = 105 °C Value Unit 1000 V 50 A 30 A 300 A 180 A IF(AV) Average forward current, δ = 0.5 IFRM Repetitive peak forward current IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal Tstg Storage temperature range -65 to +175 °C Operating junction temperature range -40 to +175 °C Tj Table 3. tp = 5 µs, F = 5 kHz square Thermal parameters Symbol Parameter Value Unit 1.1 °C/W DO-247 Rth(j-c) Table 4. Symbol IR(1) Junction to case D2PAK Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Min. Typ Forward voltage drop Tj = 100 °C µA 10 100 2 IF = 30 A Tj = 150 °C 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.3 x IF(AV) + 0.013 IF2(RMS) 2/9 Unit 15 VR = VRRM Tj = 25 °C VF(2) Max. Doc ID 018923 Rev 1 1.4 1.8 1.3 1.7 V STTH3010-Y Characteristics Table 5. Dynamic characteristics Symbol Parameter Test conditions Min. Typ Max. IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C Unit 100 IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25 °C 53 70 IF = 1 A, dIF/dt = -200 A/µs, VR = 30 V, Tj = 25 °C 42 55 Reverse recovery current IF = 30 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125 °C 24 32 A S Softness factor IF = 30 A, dIF/dt = -200 A/µs, VR = 600 V, Tj = 125 °C 1 tfr Forward recovery time IF = 30 A dIF/dt = 100 A/µs VFR = 1.5 x VFmax, Tj = 25 °C 450 ns Forward recovery voltage IF = 30 A, dIF/dt = 100 A/µs, Tj = 25 °C Reverse recovery time trr IRM VFP Figure 1. Conduction losses versus average current Figure 2. V Forward voltage drop versus forward current IFM(A) P(W) 200 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 =0.5 =0.2 =1 180 =0.1 160 Tj=150°C (Maximum values) 140 =0.05 120 Tj=150°C (Typical values) 100 80 Tj=25°C (Maximum values) 60 T 40 20 IF(AV)(A) 0 5 Figure 3. 10 15 20 25 30 35 40 Relative variation of thermal impedance junction to case versus pulse duration VFM(V) 0 0.0 0.5 Figure 4. 1.0 1.5 2.0 2.5 3.0 3.5 Peak reverse recovery current versus dIF/dt (typical values) IRM(A) Zth(j-c)/Rth(j-c) 60 1.0 0.9 5 ns VR=600V Tj=125°C Single pulse 50 0.8 0.7 IF= 2 x IF(AV) IF= IF(AV) 40 0.6 30 0.5 IF=0.5 x IF(AV) 0.4 20 0.3 0.2 10 0.1 0.0 1.E-03 tp(s) dIF/dt(A/µs) 0 1.E-02 1.E-01 1.E+00 0 50 Doc ID 018923 Rev 1 100 150 200 250 300 350 400 450 500 3/9 Characteristics Figure 5. STTH3010-Y Reverse recovery time versus dIF/dt (typical values) Figure 6. Reverse recovery charges versus dIF/dt (typical values) Qrr(µC) trr(ns) 7 700 VR=600V Tj=125°C 600 IF= 2 x IF(AV) 500 VR=600V Tj=125°C 6 IF= 2 x IF(AV) 5 IF= IF(AV) 400 4 IF= IF(AV ) 300 3 200 2 IF=0.5 x IF(AV) 100 1 IF=0.5 x IF(AV) dIF/dt(A/µs) dIF/dt(A/µs) 0 0 0 50 Figure 7. 100 150 200 250 300 350 400 450 500 Softness factor versus dIF/dt (typical values) 0 50 Figure 8. 100 150 200 250 300 350 400 450 500 Relative variations of dynamic parameters versus junction temperature S factor 2.0 1.50 IF = 2 x IF(AV) VR=600V Tj=125°C 1.8 IF = IF(AV) VR=600V Reference: Tj=125°C Sfactor 1.6 1.25 1.4 1.2 1.0 1.00 0.8 tRR 0.6 0.4 0.75 dIF/dt(A/µs) 0.50 0 4/9 50 100 150 200 250 300 350 400 450 IRM 0.2 QRR 0.0 25 50 500 Doc ID 018923 Rev 1 Tj(°C) 75 100 125 STTH3010-Y Figure 9. Characteristics Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) tfr(ns) VFP(V) 800 25 IF = IF(AV) Tj=125°C IF = IF(AV) VFR = 1.5 x V F max. Tj=125°C 700 20 600 15 500 10 400 5 300 dIF/dt(A/µs) 0 100 200 300 dIF/dt(A/µs) 200 0 400 500 0 100 200 300 400 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz Vosc=30mVRMS Tj=25°C 100 VR(V) 10 1 10 100 Doc ID 018923 Rev 1 1000 5/9 Package information 2 STTH3010-Y Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.80 N·m (DO-247) ● Maximum torque value: 1.0 N·m (DO-247) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. DO-247 dimensions Dimensions Ref. V Millimeters Inches Min. Max Min. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 Dia V F2 A H F3 2.00 2.00 G L5 0.078 2.40 0.078 10.90 0.094 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.169 L L2 L4 F2 L3 L2 F3 L3 F M E 0.728 14.20 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 6/9 18.50 D V2 G 0.145 L1 Doc ID 018923 Rev 1 3.55 3.65 0.139 0.143 STTH3010-Y Package information Table 7. D2PAK dimensions Dimensions Ref. A E Millimeters Inches Min. Max Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 C2 L2 D L L3 A1 B2 R C B G A2 2mm min. FLAT ZONE V2 R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 12. D2PAK footprint (all dimensions in mm) 16.90 10.30 5.08 1.30 8.90 Doc ID 018923 Rev 1 3.70 7/9 Ordering information 3 STTH3010-Y Ordering information Table 8. Ordering information Order code Marking Package Weight Base qty Delivery mode STTH3010WY STTH3010WY DO-247 4.4 g 30 Tube 1.49 g 1000 Tape and reel STTH3010GY-TR 4 STTH3010GY D PAK Revision history Table 9. 8/9 2 Document revision history Date Revision 28-Jun-2012 1 Description of Changes First issue. Doc ID 018923 Rev 1 STTH3010-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 018923 Rev 1 9/9
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