STTH30AC06CWL

STTH30AC06C Datasheet Turbo 2 ultrafast high voltage rectifier Features A1 K A2 A2 A1 K A2 TO3P-3L STTH30AC06CP A1 K TO-3PF STTH30AC06CPF • • • • • Ultrafast switching Low reverse current Low thermal resistance Reduces switching and conduction losses Insulated package TO-3PF: – Insulated voltage: 2500 VDC Description K A1 TO-247 LL STTH30AC06CWL A2 The STTH30AC06C uses ST Turbo 2 600 V technology. It is suited as boost diode specially for use in air conditioning equipment as continuous mode interleaved power factor correction. Product status link STTH30AC06C Product summary IF(AV) 2 x 15 A VRRM 600 V trr (typ) 40 ns VF (typ) 1.15 V Tj 175 °C DS9831 - Rev 5 - April 2018 For further information contact your local STMicroelectronics sales office. www.st.com STTH30AC06C Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values per diode at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward rms current 30 A IF(AV) Average forward current IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Per diode 15 Per device 30 tp = 10 ms sinusoidal 140 A -65 to +175 °C 175 °C Max. value Unit Maximum operating junction temperature A Table 2. Thermal parameters Symbol Parameter TO3P-3L, TO247 LL Rth(j-c) Junction to case TO-3PF Rth(c) Coupling Per diode 1.5 Total 0.85 Per diode 3.5 Total 2.7 TO3P-3L, TO247 LL) 0.2 TO-3PF 1.9 °C/W Table 3. Static electrical characteristics (per diode) Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 15 A IF = 30 A Min. Typ. - 40 400 µA 1.95 1.15 - Unit 10 - Max. 1.45 2.25 1.42 V 1.8 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 μs, δ < 2 % To evaluate the conduction losses, use the following equation: P = 1.1 x IF(AV) + 0.023 x IF2(RMS) DS9831 - Rev 5 page 2/15 STTH30AC06C Characteristics Table 4. Dynamic characteristics (per diode) Symbol trr IRM tfr VFP DS9831 - Rev 5 Parameters Test conditions Min. IF = 0.5 A, Irr = 0.25 A, IR = 1 A - IF = 1 A, dIF/dt = 50 A/μs, VR = 30 V - 40 55 - 4 5.5 A 100 ns Reverse recovery time Tj = 25 °C Reverse recovery current Tj = 125 °C IF = 15 A, dIF/dt = 100 A/μs, VR = 400 V Tj = 25 °C IF = 15 A, dIF/dt = 100 A/μs, VFR = 1.9 V Forward recovery time Forward recovery voltage Typ. Unit 30 - Max. 2.5 ns V page 3/15 STTH30AC06C Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Forward voltage drop versus forward current (typical values, per diode) PF(AV)(W) 100.0 30 δ=0.05 δ=0.5 δ=0.2 δ=0.1 I F (A) δ=1.0 25 10.0 20 Tj = 150 °C 15 Tj = 25 °C 1.0 10 T 5 0 0 2 4 6 8 δ=tp/T tp 12 14 10 IF(AV) (A) 16 18 0.0 20 Figure 3. Forward voltage drop versus forward current (maximum values, per diode) 100.0 VF(V) 0.1 0.4 0.8 1.2 1.6 2.0 2.4 2.8 Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration (TO3P-3L, TO247 LL) I F (A) Z th(j-c) / R th(j-c) 1.0 0.9 TO3P-3L / TO-247 LL 0.8 10.0 Tj = 150 °C 0.7 0.6 0.5 Tj = 25 °C 1.0 0.4 0.3 0.2 VF(V) 0.1 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 Single pulse 0.1 3.2 t p(s) 0.0 1.E-04 Figure 5. Relative variation of thermal impedance, junction to case, versus pulse duration (TO3P-3L) 1.0 0.9 1.E-02 1.E-01 1.E+00 Figure 6. Peak reverse recovery current versus dIF/dt (typical values, per diode) Z th(j-c) / R th(j-c) IRM(A) 16 TO-3PF 1.E-03 IF = 15 A VR = 400 V Tj = 125 °C 0.8 0.7 12 0.6 0.5 8 0.4 0.3 0.2 0.1 4 Single pulse t p(s) 0.0 1.E-03 DS9831 - Rev 5 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 dlF/dt(A/µs) 0 0 5 0 100 150 200 250 300 350 400 450 500 page 4/15 STTH30AC06C Characteristics (curves) Figure 7. Reverse recovery time versus dIF/dt (typical values, per diode) tRR(ns) 800 400 IF = 15 A 350 QRR(nC) IF = 15 A 700 VR = 400 V Tj = 125 °C VR = 400 V Tj = 125 °C 600 300 500 250 400 200 300 150 200 100 100 50 dlF/dt(A/µs) dlF/dt(A/µs) 0 0 0 0 5 0 100 150 200 250 300 350 400 450 5 0 100 150 200 250 300 350 400 450 500 500 Figure 9. Reverse recovery softness factor versus dIF/dt (typical values, per diode) 2.0 Figure 8. Reverse recovery charges versus dIF/dt (typical values, per diode) Figure 10. Relative variations of dynamic parameters versus junction temperature SFACTOR 1.4 IF = 15 A VR = 400 V Tj = 125 °C IF = 15 A 1.2 1.5 VR = 400 V Ref: Tj = 125 °C 1.0 SFACTOR 0.8 1.0 I RM 0.6 0.5 0.4 Q RR 0.2 dlF/dt(A/µs) Tj(°C) 0.0 0 50 100 150 200 250 300 350 400 450 500 0.0 25 Figure 11. Transient peak forward voltage versus dIF/dt (typical values, per diode) 8 VFP(V) 50 75 100 125 Figure 12. Forward recovery time versus dIF/dt (typical values, per diode) tFR(ns) 120 IF = 15 A IF = 15 A Tj = 125 °C VFR = 1.5 V Tj = 125 °C 100 6 80 60 4 40 2 20 dlF/dt(A/µs) 0 100 150 DS9831 - Rev 5 200 250 300 350 400 450 dlF/dt(A/µs) 0 500 100 150 200 250 300 350 400 450 500 page 5/15 STTH30AC06C Characteristics (curves) Figure 13. Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) 1000 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C 100 VR(V) 10 1 DS9831 - Rev 5 1 0 100 1000 page 6/15 STTH30AC06C Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 TO3P-3L package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque: 0.8 to 1.0 N·m Figure 14. TO3P-3L package outline Seating plane A A1 E ØP E1 E2 Q D Q1 ØP1 D1 L2 L1 A2 b2 b1(2x) L b(3x) c e DS9831 - Rev 5 (2x) page 7/15 STTH30AC06C TO3P-3L package information Table 5. TO3P-3L package mechanical data Dimensions Ref. DS9831 - Rev 5 Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 4.60 4.80 5 0.18 0.19 0.19 A1 1.45 1.50 1.65 0.05 0.06 0.06 A2 1.20 1.40 1.60 0.04 0.05 0.06 b 0.80 1.00 1.20 0.03 0.04 0.05 b1 1.80 2.00 2.20 0.07 0.08 0.08 b2 2.80 3.00 3.20 0.11 0.12 0.12 c 0.55 0.60 0.75 0.02 0.02 0.03 D 19.70 19.90 20.10 0.77 0.78 0.79 D1 13.70 13.90 14.10 0.54 0.54 0.55 E 15.40 15.60 15.80 0.60 0.61 0.62 E1 13.40 13.60 13.80 0.53 0.53 0.54 E2 9.40 9.60 9.90 0.37 0.38 0.39 e 5.15 5.45 5.75 0.20 0.21 0.22 L 19.80 20 20.20 0.78 0.78 0.79 L1 3.30 3.50 3.70 0.13 0.14 0.14 L2 18.20 18.40 18.60 0.71 0.72 0.73 Diam. P 3.30 3.40 3.50 0.13 0.13 0.14 Diam. P1 3.10 3.20 3.30 0.12 0.12 0.13 Q 4.80 5 5.20 0.19 0.19 0.20 Q1 3.60 3.80 4 0.14 0.15 0.16 page 8/15 STTH30AC06C TO-3PF package information 2.2 TO-3PF package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque: 0.8 to 1.0 N·m Figure 15. TO-3PF package outline A H C DIA L5 L L2 L3 L6 L4 N F2(3X) D1 D R L7 F(3X) E G1 G Projection DS9831 - Rev 5 page 9/15 STTH30AC06C TO-3PF package information Table 6. TO-3PF mechanical data Dim. mm Min. Max. A 5.30 5.70 C 2.80 3.20 D 3.10 3.50 D1 1.80 2.20 E 0.80 1.10 F 0.65 0.95 F2 1.80 2.20 G 10.30 11.50 G1 DS9831 - Rev 5 Typ. 5.45 H 15.30 15.70 L 9.80 L2 22.80 23.20 L3 26.30 26.70 L4 43.20 44.40 L5 4.30 4.70 L6 24.30 24.70 L7 14.60 15 N 1.80 2.20 R 3.80 4.20 Dia 3.40 3.80 10 10.20 page 10/15 STTH30AC06C TO-247 long leads package information 2.3 TO-247 long leads package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Maximum torque value: 1.0 N·m Figure 16. TO-247 long leads package outline Heat-sink plane A D H V3 L5 L2 L4 DIA L L1 M F1 L3 F2 3 G V 1 2 F E 3 2 1 Back view Projection V1 DS9831 - Rev 5 page 11/15 STTH30AC06C TO-247 long leads package information Table 7. TO-247 long leads package mechanical data Dim. mm. Min. Max. Min. Typ. Max. A 4.90 5.15 0.192 0.202 D 1.85 2.10 0.072 0.082 E 0.55 0.67 0.021 0.026 F 1.07 1.32 0.042 0.051 F1 1.90 2.38 0.074 0.093 F2 2.87 3.38 0.110 0.133 G 10.90 BSC 0.429 BSC H 15.77 16.02 0.620 0.630 L 20.82 21.07 0.810 0.820 L1 4.16 4.47 0.163 0.175 L2 5.49 5.74 0.216 0.225 L3 20.05 20.30 0.789 0.799 L4 3.68 3.93 0.144 0.154 L5 6.04 6.29 0.237 0.247 M 2.25 2.55 0.088 0.100 V 10° 10° V1 3° 3° V3 20° 20° DIA DS9831 - Rev 5 Typ. Inches 3.55 3.66 0.139 0.143 page 12/15 STTH30AC06C STTH30AC06C Ordering information 3 STTH30AC06C Ordering information Table 8. Ordering information DS9831 - Rev 5 Order code Marking Package Weight Base qty. STTH30AC06CP STTH30AC06C TO3P-3L 5.26 g 30 STTH30AC06CPF TH30AC06C TO-3PF 5.6 g 30 STTH30AC06CWL STTH30AC06CWL TO-247 LL 4.36 g 30 Delivery mode Tube page 13/15 STTH30AC06C Revision history Table 9. Document revision history DS9831 - Rev 5 Date Version Changes 13-Nov-2013 1 Initial release. 25-Jun-2015 2 Update of cover page and Table 7. Format updated to current standard. 01-Jul-2015 3 Updated Features. 05-Sep-2016 4 Updated Figure 16. 18-Apr-2018 5 Updated TO247LL POA drawing. page 14/15 STTH30AC06C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS9831 - Rev 5 page 15/15