STTH30L06CW

STTH30L06C Turbo 2 ultratfast high voltage rectifier Datasheet - production data Description A1 K This device uses ST Turbo 2 600 V technology, and is particularly suited as boost diode in discontinuous or critical mode power factor corrections. A2 K It is also intended for use as a freewheeling diode in power supplies and other power switching applications. Table 1: Device summary A2 TO-247 K A1 A2 Symbol Value IF(AV) up to 2 x 20 A VRRM 600 V VF (typ.) 0.95 V trr (max.) 55 ns A1 D²PAK Features      Ultrafast switching Low reverse current Low thermal resistance Reduce switching and conduction losses ECOPACK®2 compliant component for D²PAK on demand December 2016 DocID10761 Rev 2 This is information on a product in full production. 1/12 www.st.com Characteristics 1 STTH30L06C Characteristics Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward rms current 30 A Average forward current δ = 0.5, square wave IF(AV) IFSM Surge non repetitive forward current Tstg Storage temperature range Tj TC = 140 °C Per diode 15 TC = 125 °C Per device 30 TC = 120 °C Per diode 20 TC = 110 °C Per device 40 tp = 10 ms sinusoidal A 130 A -65 to +175 °C +175 °C Maximum operating junction temperature Table 3: Thermal parameters Symbol Parameter Max. value Junction to case Rth(j-c) Per diode 1.7 Total 1.15 Coupling Rth(c) Unit °C/W 0.6 °C/W When the diodes 1 and 2 are used simultaneously: ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) Table 4: Static electrical characteristics (per diode) Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 150 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 15 A IF = 30 A Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.94 x IF(AV) + 0.017 x IF2(RMS) 2/12 DocID10761 Rev 2 Min. Typ. Max. 40 400 - 15 - Unit µA 1.55 0.95 1.2 1.76 1.15 1.45 V STTH30L06C Characteristics Table 5: Dynamic electrical characteristics (per diode) Symbol trr IRM tfr VFP Parameter Test conditions Reverse recovery time Reverse recovery current Typ. Max. Unit IF = 0.5 A IR = 1 A Irr = 0.25 A - IF = 1 A VR = 30 V dlF/dt = 50 A/µs - 60 85 Tj = 125 °C IF = 15 A VR = 400 V dlF/dt = 100 A/µs - 8.5 12 A IF = 15 A VFR = 1.1 x VFmax. dlF/dt = 100 A/µs 300 ns Tj = 25 °C Tj = 25 °C Forward recovery time Forward recovery voltage Min. DocID10761 Rev 2 55 ns - 3.0 V 3/12 Characteristics 1.1 STTH30L06C Characteristics (curves) Figure 1: Conduction losses versus average forward current (per diode) Figure 2: Forward voltage drop versus forward current (per diode) P(W) 24 δ = 0.1 22 δ = 0.2 δ = 0.5 δ = 0.05 20 18 δ= 1 16 14 12 10 8 T 6 4 2 δ=tp/T IF(AV) (A) tp 0 0 2 4 6 8 10 12 14 16 18 20 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration Figure 4: Peak reverse recovery current versus dlF/dt (typical values, per diode) Zth(j-c) /R t h(j-c) IRM (A) 1.0 35 V R =400V T j=125°C 0.9 IF=2 x IF(AV) 30 0.8 0.7 IF=IF(AV) 25 IF=0.5 x IF(AV) 0.6 20 0.5 15 0.4 10 0.3 T 0.2 5 Single pulse 0.1 δ=tp/T t p (s) dI F/dt(A/µs) tp 0 0.0 0 1.E-03 1.E-02 1.E-01 50 100 150 200 250 300 350 400 450 500 1.E+00 Figure 5: Reverse recovery time versus dlF/dt (typical values, per diode) Figure 6: Reverse recovery charges versus dlF/dt (typical values, per diode) t rr (ns) Q rr (nC) 1800 800 V R=400V T j=125°C V R =400V T j=125°C 1600 700 IF=2 x IF(AV) 1400 600 1200 IF=2 x IF(AV) 500 IF= IF(AV) 1000 400 IF=0.5 x IF(AV) 800 IF= IF(AV) IF=0.5 x IF(AV) 300 600 200 400 100 200 dI F/dt(A/µs) dI F /dt(A/µs) 0 0 0 4/12 50 100 150 200 250 300 350 400 450 500 DocID10761 Rev 2 0 100 200 300 400 500 STTH30L06C Characteristics Figure 7: Reverse recovery softness factor versus dlF/dt (typical values, per diode) Figure 8: Relative variation of dynamic parameters versus junction temperature SQfactor rr (nC) 1.6 1800 V R =400V T j=125°C 1600 1.4 IF< 2 x IF(AV) V R =400V T j=125°C IF=2 x IF(AV) 1400 1.2 1200 1.0 IF= IF(AV) 1000 0.8 800 IF=0.5 x IF(AV) 0.6 600 0.4 400 0.2 200 dIFF/dt(A/µs) /dt(A/µs) dI 0.0 0 00 50 100 100 150 200 200 250 300 300 350 400 400 450 500 Figure 9: Transient peak forward voltage versus dlF/dt (typical values, per diode) t fr (ns) V FP(V) 260 12 IF=IF(AV) V FR =1.1 x V F max. T j=125°C 240 IF=IF(AV) Tj=125°C 11 Figure 10: Forward recovery time versus dlF/dt (typical values, per diode) 220 10 200 9 180 8 160 7 140 6 120 5 100 4 80 3 60 2 40 1 20 dI F /dt(A/µs) dI F/dt(A/µs) 0 0 0 50 100 150 200 250 300 350 400 450 0 500 Figure 11: Junction capacitance versus reverse voltage applied (typical values, per diode) 1000 200 300 400 500 Figure 12: Thermal resistance, junction to ambient, versus copper surface under tab (D²PAK) 80 C(pF) 100 Rth(j-a) (°C/W) 70 F=1MHz V OSC=30mV RMS T j=25°C 60 50 40 100 30 20 Epoxy printed board FR4, eCU= 35 µm 10 SCu(cm²) V R (V) 0 10 1 10 100 1000 DocID10761 Rev 2 0 5 10 15 20 25 30 35 5/12 40 Package information 2 STTH30L06C Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     6/12 Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.8 N·m Maximum torque value: 1.0 N·m DocID10761 Rev 2 Package information STTH30L06C 2.1 D²PAK package information Figure 13: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID10761 Rev 2 7/12 Package information STTH30L06C Table 6: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 0.4 typ. 0° 0.015 8° 0° Figure 14: D²PAK recommended footprint (dimensions in mm) 8/12 DocID10761 Rev 2 8° Package information STTH30L06C 2.2 TO-247 package information Figure 15: TO-247 package outline 0075325_8 DocID10761 Rev 2 9/12 Package information STTH30L06C Table 7: TO-247 package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Typ. Max. A 4.85 5.15 0.191 0.203 A1 2.20 2.60 0.086 0.102 b 1.00 1.40 0.039 0.055 b1 2.00 2.40 0.078 0.094 b2 3.00 3.40 0.118 0.133 c 0.40 0.80 0.015 0.031 D(1) 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 0.620 e 5.30 5.60 0.209 L 14.20 14.80 0.559 0.582 L1 3.70 4.30 0.145 0.169 L2 5.45 18.50 0.215 0.220 0.728 ØP(2) 3.55 3.65 0.139 0.143 ØR 4.50 5.50 0.177 0.217 S 5.30 5.70 0.209 5.50 Notes: (1)Dimension (2)Resin 10/12 Min. D plus gate protusion does not exceed 20.5 mm thickness around the mounting hole is not less than 0.9 mm. DocID10761 Rev 2 0.216 0.224 Ordering information STTH30L06C 3 Ordering information Table 8: Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode STTH30L06CG-TR STTH30L06CG D2PAK 1.48 g 1000 Tape and reel STTH30L06CW STTH30L06CW TO-247 4.46 g 50 Tube Revision history Table 9: Document revision history Date Revision Changes 07-Sep-2004 1 Initial release. 14-Dec-2016 2 Removed TO-220AB package information. DocID10761 Rev 2 11/12 STTH30L06C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 12/12 DocID10761 Rev 2