STTH30R04G

STTH30R04 Ultrafast recovery diode Datasheet - production data $ . Description . $ $ ' 2  72  $& . The compromise-free, high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. . . $ $ $ $ 'ð3$. Table 1. Device summary Symbol Value IF(AV) 30 A VRRM 400 V Tj (max) 175° C VF (typ) 0.97 V trr (typ) 24 ns Features  Ultrafast switching  Low reverse current  Low thermal resistance  Reduces switching and conduction losses  High junction temperature  ECOPACK®2 compliant component December 2015 This is information on a product in full production. DocID13392 Rev 2 1/13 www.st.com 13 Characteristics 1 STTH30R04 Characteristics Table 2. Absolute ratings (limiting values at 25° C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 400 V IF(RMS) RMS forward current 50 A IF(AV) Average forward current,  = 0.5 TO-220AC / DO-247 / D²PAK Tc = 120 °C 30 A IFRM Repetitive peak forward current tp = 10 ms, F = 1 KHz 500 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 300 A Tstg Storage temperature range -65 to +175 °C Operating junction temperature range -40 to +175 °C Tj Table 3. Thermal parameters Symbol Rth(j-c) Parameter Junction to case TO-220AC / DO-247 / D²PAK Value Unit 1.15 °C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Min Typ Tj = 25° C IR(1) Reverse leakage current Tj = 100° C Tj = 150° C VF (2) Forward voltage drop VR = VRRM 30 15 150 µA 1.26 IF = 15 A 0.8 1.0 1.45 IF = 30 A Tj = 150° C 1. Pulse test: tp = 5 ms,  < 2% 2. Pulse test: tp = 380 µs,  < 2% To evaluate the conduction losses use the following equation: P = 0.9 x IF(AV) + 0.01 x IF2(RMS) 2/13 3 Tj = 25° C Tj = 100° C Unit 15 Tj = 125° C Tj = 25° C Max DocID13392 Rev 2 1.3 0.97 1.2 V STTH30R04 Characteristics Table 5. Dynamic characteristics Symbol Test conditions Parameter trr Reverse recovery time Min Typ Max IF = 1 A, dIF/dt = -200 A/µs, VR = 30 V, Tj = 25° C 24 35 IF = 1 A, dIF/dt = -15 A/µs, VR = 30 V, Tj = 25° C 78 100 IF = 1 A, IR = 1 A, IRR = 0.25 A, Tj = 25° C IRM tfr VFP 50 IF = 30 A, dIF/dt = -200 A/µs, VR = 320 V, Tj = 125° C Forward recovery time IF = 30 A, dIF/dt = 100 A/µs, VFR = 1.1 x VFmax, Tj = 25° C Forward recovery voltage IF = 30 A, dIF/dt = 100 A/µs, VFR = 1.1 x VFmax, Tj = 25° C PF(AV)(W) d = 0.1 A 500 ns 2.9 V ,)0$ 7- ƒ& 0D[LPXPYDOXHV  d = 0.05 35  30  25  20  7- ƒ& 7\SLFDO YDOXHV  15 T  10 5 7- ƒ& 0D[LPXPYDOXHV  tp d=tp/T IF(AV)(A) 9)09  0 0 5 10 15 20 25 30 35  40 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration 1.0 14  45 40 10 Figure 2. Forward voltage drop versus forward current  d=1 d = 0.5 d = 0.2 ns 50 Reverse recovery current Figure 1. Conduction losses versus average current Unit Zth(j-c)/Rth(j-c)             Figure 4. Peak reverse recovery current versus dIF/dt (typical values) 22 Single pulse TO-220AC DO-247  IRM(A) IF= 30 A VR=320 V 20 18 16 14 12 Tj=125° C 10 8 6 Tj=25° C 4 2 0.1 1.E-03 tp(s) 1.E-02 dIF/dt(A/µs) 0 1.E-01 1.E+00 10 DocID13392 Rev 2 100 1000 3/13 Characteristics STTH30R04 Figure 5. Reverse recovery time versus dIF/dt (typical values) tRR(ns) 180 140 120 Tj=125° C 100 80 60 Tj=25° C 40 20 dIF/dt(A/µs) 0 10 100 Tj=125° C Tj=25° C dIF/dt(A/µs) 100 1000 Figure 8. Transient peak forward voltage versus dIF/dt (typical values) QRR [Tj]/QRR [Tj = 125° C] and IRM [Tj]/IRM [Tj = 125° C] VFp(V) 5 IF= 30 A VR=320 V 1.2 IF= 30 A VR=320 V 10 1000 Figure 7. Relative variations of dynamic parameters versus junction temperature 1.4 QRR(nC) 750 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 IF= 30 A VR=320 V 160 Figure 6. Reverse recovery charges versus dIF/dt (typical values) IF=30 A Tj=125 °C 4.5 4 1.0 3.5 IRM 0.8 3 2.5 0.6 2 QRR 1.5 0.4 1 0.2 0.5 T j(°C) 0.0 dIF/dt(A/µs) 0 25 50 75 100 125 150 Figure 9. Forward recovery time versus dIF/dt (typical values) 2000 0 50 100 150 200 250 300 350 400 450 500 Figure 10. Junction capacitance versus reverse voltage applied (typical values) C(pF) tFR(ns) 1000 IF=30 A VFR=1.1 x V F max. Tj=125°C 1800 1600 F=1MHz VOSC=30mVRMS Tj=25°C 1400 1200 100 1000 800 600 400 dIF/dt(A/µs) 200 VR(V) 10 0 0 4/13 100 200 300 400 500 1 DocID13392 Rev 2 10 100 1000 STTH30R04 Characteristics Figure 11. Thermal resistance junction to ambient versus copper surface under tab (D²PAK)  5WK MD ƒ&: 'ð3$.        6&8FPð         DocID13392 Rev 2     5/13 Package information 2 STTH30R04 Package information  Epoxy meets UL94, V0  Lead-free package  Cooling method: by conduction (C)  Recommended torque value: 0.55 N·m (TO-220AC)  Maximum torque value: 0.7 N·m (TO-220AC) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 D²PAK package information Figure 12. D2PAK package outline A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESSTHAN 2mm 6/13 DocID13392 Rev 2 STTH30R04 Package information Table 6. D2PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R V2 0.40 typ. 0° 0.016 typ. 8° 0° 8° Figure 13. Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 3.70 8.90 DocID13392 Rev 2 7/13 Package information 2.2 STTH30R04 DO-247 package information Figure 14. DO-247 package outline V Dia V A H L5 L L2 L4 F2 L3 L1 F3 D V2 F G 8/13 DocID13392 Rev 2 M E STTH30R04 Package information Table 7. DO-247 package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F2 F3 2.00 2.00 G 0.078 2.40 0.078 10.90 0.094 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 L2 L3 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 3.55 3.65 DocID13392 Rev 2 0.139 0.143 9/13 Package information 2.3 STTH30R04 TO-220AC package information Figure 15. TO-220AC package outline A H2 ØI C L5 L7 L6 L2 F1 D L9 L4 F M E G 10/13 DocID13392 Rev 2 STTH30R04 Package information Table 8. TO-220AC package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.4 0.645 L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 2.6 3.75 0.102 3.85 DocID13392 Rev 2 0.147 0.151 11/13 Ordering information 3 STTH30R04 Ordering information Table 9. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STTH30R04D STTH30R04D TO-220AC 1.86 g 50 Tube STTH30R04G STTH30R04G D²PAK 1.48 g 50 Tube STTH30R04G-TR STTH30R04G D²PAK 1.48 g 1000 Tape and reel STTH30R04W STTH30R04W DO-247 4.40 g 30 Tube Revision history Table 10. Document revision history 12/13 Date Revision Description of changes 31-Mar-2007 1 First issue. 11-Dec-2015 2 Updated Table 4 and reformatted to current standard. Removed DOP3I package information. DocID13392 Rev 2 STTH30R04 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID13392 Rev 2 13/13