STTH30R04WY

STTH30R04-Y Automotive ultrafast recovery diode Datasheet - production data Features A • Ultrafast switching K • Low reverse current • Low thermal resistance • Reduces switching and conduction losses • High junction temperature K A TO-220AC STTH30R04DY • AEC-Q101 qualified A K DO-247 STTH30R04WY Table 1. Device summary Symbol Value IF(AV) 30 A VRRM 400 V Tj (max) 175° C VF (typ) 1.0 V trr (typ) 24 ns September 2013 This is information on a product in full production. • ECOPACK®2 compliant component Description The compromise-free, high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. DocID024454 Rev 1 1/10 www.st.com 10 Characteristics 1 STTH30R04-Y Characteristics Table 2. Absolute ratings (limiting values at 25° C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 400 V IF(RMS) RMS forward current 50 A 30 A 280 A IF(AV) Average forward current, δ = 0.5 TO-220AC / DO-247 IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal Tstg Storage temperature range -65 to +175 °C Operating junction temperature range -40 to +175 °C Tj Tc = 135° C Table 3. Thermal parameters Symbol Rth(j-c) Parameter Junction to case TO-220AC / DO-247 Value Unit 0.8 °C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Min Typ Tj = 25° C IR(1) Reverse leakage current Tj = 100° C Tj = 150° C VF(2) Forward voltage drop VR = VRRM 30 15 150 µA 1.35 IF = 15 A 0.83 1.04 1.55 IF = 30 A Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.95 x IF(AV) + 0.01 x IF2(RMS) 2/10 3 Tj = 25° C Tj = 100° C Unit 15 Tj = 125° C Tj = 25° C Max DocID024454 Rev 1 1.32 1.0 1.25 V STTH30R04-Y Characteristics Table 5. Dynamic characteristics Symbol Test conditions Parameter trr Reverse recovery time Min Typ Max IF = 1 A, dIF/dt = -200 A/µs, VR = 30 V, Tj = 25° C 24 35 IF = 1 A, dIF/dt = -15 A/µs, VR = 30 V, Tj = 25° C 73 100 IF = 1 A, IR = 1 A, IRR = 0.25 A, Tj = 25° C IRM tfr VFP 50 ns 45 Reverse recovery current IF = 30 A, dIF/dt = -200 A/µs, VR = 320 V, Tj = 125° C Forward recovery time dIF/dt = 100 A/µs IF = 30 A VFR = 1.1 x VFmax, Tj = 25° C Forward recovery voltage IF = 30 A dIF/dt = 100 A/µs VFR = 1.1 x VFmax, Tj = 25° C Figure 1. Conduction losses versus average current Unit 10 14 A 500 ns 2.9 V Figure 2. Forward voltage drop versus forward current PF(AV)(W) IFM(A) 1000.0 d=1 d = 0.5 d = 0.2 TJ=150°C (Maximum values) 45 d = 0.1 40 d = 0.05 TJ=150°C (Typical values) 100.0 35 30 25 10.0 20 TJ=25°C =25°C (Maximum values) 15 T 1.0 10 5 VFM(V) tp d=tp/T IF(AV)(A) 0.1 0 0 5 10 15 20 25 30 35 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration 1.0 0.0 40 0.8 1.2 1.6 2.0 2.4 2.8 Figure 4. Peak reverse recovery current versus dIF/dt (typical values) Zth(j-c)/Rth(j-c) 22 Single pulse TO-220AC DO-247 0.4 IRM(A) IF= 30 A VR=320 V 20 18 16 14 12 Tj=125° C 10 8 6 Tj=25° C 4 2 0.1 1.E-03 tp(s) 1.E-02 dIF/dt(A/µs) 0 1.E-01 1.E+00 10 DocID024454 Rev 1 100 1000 3/10 Characteristics STTH30R04-Y Figure 5. Reverse recovery time versus dIF/dt (typical values) 180 Figure 6. Reverse recovery charges versus dIF/dt (typical values) tRR(ns) 750 700 650 600 550 500 450 400 350 300 250 200 150 100 50 0 IF= 30 A VR=320 V 160 140 120 Tj=125° C 100 80 60 Tj=25° C 40 20 dIF/dt(A/µs) 0 10 100 1.4 Tj=125° C Tj=25° C dIF/dt(A/µs) 100 1000 Figure 8. Transient peak forward voltage versus dIF/dt (typical values) QRR [Tj]/QRR [Tj = 125° C] and IRM [Tj]/IRM [Tj = 125° C] VFp(V) 5 IF= 30 A VR=320 V 1.2 IF= 30 A VR=320 V 10 1000 Figure 7. Relative variations of dynamic parameters versus junction temperature QRR(nC) IF=30 A Tj=125 °C 4.5 4 1.0 3.5 IRM 0.8 3 2.5 0.6 2 QRR 0.4 1.5 1 0.2 0.5 T j(°C) 0.0 dIF/dt(A/µs) 0 25 50 75 100 125 150 Figure 9. Forward recovery time versus dIF/dt (typical values) 2000 0 50 100 150 200 250 300 350 400 450 500 Figure 10. Junction capacitance versus reverse voltage applied (typical values) tFR(ns) C(pF) 1000 IF=30 A VFR=1.1 x V F max. Tj=125°C 1800 1600 F=1MHz VOSC=30mVRMS Tj=25°C 1400 1200 1000 100 800 600 400 dIF/dt(A/µs) 200 VR(V) 0 10 0 4/10 100 200 300 400 500 1 DocID024454 Rev 1 10 100 1000 STTH30R04-Y 2 Package information Package information • Epoxy meets UL94, V0 • Lead-free package • Cooling method: by conduction (C) • Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. DO-247 dimension definitions V Dia V A H L5 L L2 L4 F2 L3 L1 F3 D V2 F G DocID024454 Rev 1 M E 5/10 Package information STTH30R04-Y Table 6. DO-247 dimension values Dimensions Ref. Millimeters Min. Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F2 F3 2.00 2.00 G 0.078 2.40 0.078 10.90 0.094 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 L2 L3 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 6/10 Typ. Inches 3.55 3.65 DocID024454 Rev 1 0.139 0.143 STTH30R04-Y Package information Figure 12. TO-220AC dimension definitions A H2 ØI C L5 L7 L6 L2 F1 D L9 L4 F M E G DocID024454 Rev 1 7/10 Package information STTH30R04-Y Table 7. TO-220AC dimension values Dimensions Ref. Millimeters Min. Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 16.4 0.645 L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 8/10 Typ. Inches 2.6 3.75 0.102 3.85 DocID024454 Rev 1 0.147 0.151 STTH30R04-Y 3 Ordering information Ordering information Table 8. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STTH30R04DY STTH30R04DY TO-220AC 1.86 g 50 Tube STTH30R04WY STTH30R04WY DO-247 4.40 g 30 Tube Revision history Table 9. Document revision history Date Revision 30-Sep-2013 1 Description of changes First issue DocID024454 Rev 1 9/10 STTH30R04-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 DocID024454 Rev 1