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STTH30ST06WY

STTH30ST06WY

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    DO-247

  • 描述:

    DIODEHYPER600V30ADO247

  • 数据手册
  • 价格&库存
STTH30ST06WY 数据手册
STTH30ST06-Y Automotive Turbo 2 ultrafast high voltage rectifier Datasheet − production data Features • Aluminum ribbon bonding • Ultrafast switching . • Low reverse current • Low thermal resistance • Reduces switching and conduction losses $ 1& $ '2 . 'ð3$. The STTH30ST06-Y, which uses ST Turbo 2, 600 V technology, is packaged in DO-247 and D²PAK with aluminum ribbon to ensure a high robustness. It especially suited for use in switching power supplies and automotive applications, industrial applications, as rectification and boost diode for circuits working in continuous conduction mode. Symbol Value IF(AV) 30 A VRRM 600 V trr (typ) 39 ns Tj -40 to +175 °C VF (typ) 1.75 V This is information on a product in full production. • AEC-Q101 qualified Description Table 1. Device summary January 2015 • ECOPACK®2 compliant component (DO-247) DocID025082 Rev 1 1/11 www.st.com Characteristics 1 STTH30ST06-Y Characteristics Table 2. Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter Value Uni t VRRM Repetitive peak reverse voltage 600 V VRRM Repetitive peak reverse voltage, Tj = -40 °C 560 V IF(RMS) Forward rms current 64 A 30 A 160 A IF(AV) Average forward current, δ = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal Tstg Storage temperature range -65 to + 175 °C Maximum operating junction temperature -40 to + 175 °C Tj Tc = 65 °C Table 3. Thermal resistance Symbol Rth(j-c) Parameter Junction to case (DO-247, D²PAK) Value Unit 1.25 °C / W Table 4. Static electrical characteristics Symbol Parameter Test conditions IR (1) Reverse leakage current VF (2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C To evaluate the conduction losses use the following equation: DocID025082 Rev 1 Max. Unit µA 50 500 3.6 IF = 30 A 2. Pulse test: tp = 380 µs, δ < 2% 2/11 Typ 50 VR = VRRM 1. Pulse test: tp = 5 ms, δ < 2% P = 1.45 x IF(AV) + 0.025 IF2(RMS) Min. V 1.75 2.2 STTH30ST06-Y Characteristics Table 5. Dynamic electrical characteristics Symbol Parameter IRM Reverse recovery current Sfactor Test conditions Tj = 125 °C Softness factor IF = 30 A, VR = 400 V dIF/dt = -100 A/µs Max. Unit 4 5.5 A 39 50 IF = 0.5 A, Irr = 0.25 A Tj = 25 °C I = 1 A R tfr Forward recovery time VFP Forward recovery voltage ns 30 200 IF = 30 A, VFR = 4 V dIF/dt = 300 A/µs Figure 1. Average forward power dissipation versus average forward current 100 Typ 0.3 IF = 1 A, VR = 30 V dIF/dt = -50 A/µs Reverse recovery time trr Min. 7 V Figure 2. Forward voltage drop versus forward current I FM (A) PF(AV)(W) d = 0.05 d = 0.1 d = 0.5 d = 0.2 1000.0 d=1 80 Tj=125°C (Maximum values) 100.0 Tj=125 °C (Typical values) 60 Tj=25 °C (Maximum values) 10.0 40 d = tp/T 0 1.0 T 20 0 5 10 15 20 IF(AV)(A) tp 25 30 35 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration 1.0 0.1 0.0 40 Zth(j-c)/Rth(j-c) 3.0 4.0 5.0 6.0 IF=I F(AV) VR=400 V Tj=125 °C 12 0.7 10 0.6 0.5 8 0.4 6 0.3 0.2 2.0 IRM(A) 14 0.8 1.0 Figure 4. Peak reverse recovery current versus dIF/dt (typical values) 16 0.9 V FM (V) 4 Single pulse 2 0.1 0.0 1.E-04 tp(s) 1.E-03 1.E-02 1.E-01 1.E+00 0 dIF/dt(A/µs) 0 50 DocID025082 Rev 1 100 150 200 250 300 350 400 450 500 3/11 11 Characteristics STTH30ST06-Y Figure 5. Reverse recovery time versus dIF/dt (typical values) 100 trr(ns) 350 IF = IF(AV) VR = 400 V Tj = 125°C 90 Figure 6. Reverse recovery charges versus dIF/dt (typical values) Q RR (nC) I =I F F(AV) VR = 400 V Tj = 125°C 300 80 70 250 60 200 50 150 40 100 30 20 50 10 dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 S factor 50 100 150 200 250 300 350 450 500 IF = IF(AV) VR = 400 V Reference: Tj = 125 °C SFACTOR 2.0 0.4 400 Figure 8. Relative variation of dynamic parameters versus junction temperature 2.5 IF = IF(AV) VR = 400 V Tj = 125°C 0.5 0 500 Figure 7. Reverse recovery softness factor versus dIF/dt (typical values) 0.6 dIF/dt(A/µs) 0 1.5 0.3 1.0 0.2 IRM 0.5 0.1 dIF/dt(A/µs) 0.0 0 50 100 150 200 250 300 350 400 450 500 0.0 25 QRR Tj(°C) 50 75 100 125 Figure 9. Transient peak forward voltage versus Figure 10. Forward recovery time versus dIF/dt dIF/dt (typical values) (typical values) VFP(V) 200 12 10 I F = I F(AV) VFR = 4 V Tj = 125°C 160 IF = I F(AV) T j = 125 °C 8 tfr(ns) 120 6 80 4 40 2 0 200 4/11 dIF/dt(A/µs) dIF/dt(A/µs) 250 300 350 400 450 500 0 200 DocID025082 Rev 1 250 300 350 400 450 500 STTH30ST06-Y Characteristics Figure 11. Junction capacitance versus reverse Figure 12. Junction capacitance versus reverse voltage applied (typical values) voltage applied (typical values) 1000 C(pF)  F=1 MHz VOSC=30 mVRMS Tj=25 °C 5WK MD ƒ&:  (SR[\SULQWHGERDUG)5FRSSHUWKLFNQHVV —P 'ð3$.      100    VR(V) 1 10 100 6 FPð &8  10 1000  DocID025082 Rev 1         5/11 11 Package information 2 STTH30ST06-Y Package information • Epoxy meets UL94, V0 • Lead-free package • Cooling method: by conduction (C) • Recommended torque value: 0.55 N·m (1.0 N·m maximum) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 13. D2PAK dimension definitions A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm 6/11 DocID025082 Rev 1 STTH30ST06-Y Package information Table 6. D2PAK dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R 16 0.40 typ. V2 0° 0.63 0.208 0.016 typ. 8° 0° 8° Figure 14. Footprint (dimensions in mm) 16.90 12.2 5.08 2.54 1.60 9.75 DocID025082 Rev 1 3.50 7/11 11 Package information STTH30ST06-Y Figure 15. DO-247 dimension definitions V Dia V A H L5 L L2 L4 F2 L1 F3 L3 D V2 F G 8/11 DocID025082 Rev 1 M E STTH30ST06-Y Package information Table 7. DO-247 dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F2 F3 2.00 2.00 G 0.078 2.40 0.078 10.90 0.094 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.145 0.169 L2 L3 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 3.55 3.65 DocID025082 Rev 1 0.139 0.143 9/11 11 Ordering information 3 STTH30ST06-Y Ordering information Table 8. Ordering information 4 Ordering type Marking Package Weight Base qty Delivery mode STTH30ST06WY STTH30ST06WY DO-247 4.40 g 30 Tube STTH30ST06GY-TR STTH30ST06GY D²PAK 1.48 g 1000 Tape and reel Revision history Table 9. Document revision history 10/11 Date Revision 14-Jan-2015 1 Changes First issue. DocID025082 Rev 1 STTH30ST06-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID025082 Rev 1 11/11 11
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