STTH310S

STTH310 High voltage ultrafast rectifier Main product characteristics IF(AV) VRRM Tj VF (max) trr (max) 3A 1000 V 175° C 1.42 V 75 ns SMC STTH310S Features and benefits ■ ■ ■ ■ ■ Low forward voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology DO-201AD STTH310 DO-201AD C2 STTH310 Description The STTH310, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. Order codes Part Number STTH310 STTH310RL STTH310S STTH310-C2 Marking STTH310B STTH310 S10 STTH 310 April 2007 Rev 2 1/7 www.st.com 7 Characteristics STTH310 1 Table 1. Symbol VRRM IF(AV) Characteristics Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage Average forward current, δ = 0.5 TL = 75° C TL = 75° C tp = 8.3 ms Sinusoidal δ = 0.5 δ = 0.5 DO-201AD SMC DO-201AD SMC Value 1000 3 A 3 55 A 45 - 50 to + 175 + 175 °C °C Unit V IFSM Tstg Tj Forward surge current Storage temperature range Maximum operating junction temperature Table 2. Symbol Rth(j-l) Rth(j-a) Thermal parameters Parameter L = 10 mm Junction to lead SMC Junction to ambient L = 10 mm DO-201AD 20 75 °C/W DO-201AD Value 20 Unit Table 3. Symbol IR Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Forward voltage drop Tj = 25° C Tj = 150° C VR = VRRM Min. Typ Max. 10 µA 50 1.7 IF = 3 A V 0.98 1.42 Unit VF To evaluate the conduction losses use the following equation: P = 1.20 x IF(AV) + 0.075 IF2(RMS) Table 4. Symbol trr tfr VFP Dynamic electrical characteristics Parameter Reverse recovery time Forward recovery time Forward recovery voltage IF = 0.5 A IR = 1 A Test conditions Irr = 0.25 A Tj = 25° C Min. Typ Max. 75 300 12 Unit ns ns V IF = 3 A dIF/dt = 50 A/µs VFR = 1.1 x VFmax Tj = 25° C 2/7 STTH310 Characteristics Figure 1. P(W) 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.0 0.5 Conduction losses versus average current δ = 0.1 δ = 0.05 δ=1 δ = 0.2 δ = 0.5 Figure 2. IFM(A) 100.0 Forward voltage drop versus forward current Tj=150°C (maximum values) Tj=150°C (typical values) 10.0 Tj=25°C (maximum values) 1.0 T IF(AV)(A) 1.0 1.5 2.0 2.5 δ=tp/T 3.0 tp 0.1 3.5 0.0 0.5 1.0 VFM(V) 1.5 2.0 2.5 Figure 3. Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, Lleads = 10 mm) (DO-201AD) Figure 4. Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, S = 1cm2) (SMC) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 δ = 0.5 Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 δ = 0.2 δ = 0.1 δ = 0.5 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01 Single pulse δ = 0.2 δ = 0.1 0.3 T 0.2 0.1 Single pulse T tp(s) 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 tp(s) 1.E+00 1.E+01 0.0 1.E-01 δ=tp/T 1.E+02 tp 1.E+03 1.E+00 Figure 5. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35 µm) Rth(j-a)(°C/W) 110 100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 DO-201AD Lleads=10mm SMB S(cm²) 3/7 Package mechanical data STTH310 2 Package mechanical data ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) SMC Dimensions Dimensions Ref. E1 Table 5. Millimeters Min. Max. 2.45 0.20 2.20 0.40 6.25 8.15 7.15 4.70 1.50 Inches Min. 0.075 0.002 0.077 0.006 0.218 0.305 0.260 0.173 0.030 Max. 0.096 0.008 0.087 0.016 0.246 0.321 0.281 0.185 0.059 A1 D 1.90 0.05 1.95 0.15 5.55 7.75 6.60 4.40 0.75 A2 b E c D A1 E b C E2 L A2 E1 E2 L Figure 6. Footprint (dimensions in mm) 1.54 5.11 1.54 3.14 8.19 4/7 STTH310 Table 6. DO-201AD dimensions Package mechanical data Dimensions Ref. Millimeters Min. B Note 1 Inches Min. Max. 0.374 1.000 Max. 9.50 A E E Note 1 B A B 25.40 ØD Note 2 C D E 5.30 1.30 1.25 0.209 0.051 0.049 ØC Notes 1 - The lead diameter ø D is not controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15mm) Table 7. DO-201AD C2 dimensions Dimensions Ref. Millimeters Min. A B E J A C I R0.5 R0.5 MAX 55.9° Inches Min. Typ. Max. 0.374 0.699 0.208 0.051 0.122 0.142 0.161 0.094 0.124 0.153 0.063 Typ. Max. 9.5 13.75 17.75 0.541 5.3 1.3 C D E F 50.8° 10° max 3.1 2.4 3.6 3.15 1.6 4.1 3.9 K F D MIN B G H I J K 3.8 14.9 0.5 G = D + 0.2 to 0.4 mm (G = hole in the PCB) H 15.6 0.587 0.6 18.78 4.8 0.150 0.8 0.614 0.019 0.024 0.031 0.739 0.189 The difference between E dimensions on both sides of resinous body (which Note express the bending centering) musn’t be larger than 0.7 millimeter. In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information STTH310 3 Ordering information Part Number STTH310S STTH310 STTH310RL STTH310-C2 Marking S10 STTH310 STTH310 STTH 310 Package SMC DO-201AD DO-201AD DO-201AD C2 Weight 0.245 g 1.16 g 1.16 g 1.12 g Base qty 2500 600 1900 500 Delivery mode Tape & reel Ammopack Tape & reel Box 4 Revision history Date Jan-2003 03-Apr-2007 Revision 1 2 First release. DO-201AD C2 package added. SMC Package information updated. Description of Changes 6/7 STTH310 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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