STTH310UFY

STTH310-Y Datasheet Automotive 3 A - 1000 V ultrafast rectifier Features SMB Flat SMB Flat Wettable leads • • • • • • AEC-Q101 qualified Very low conduction losses Negligible switching losses Low forward and reverse recovery times High junction temperature ECOPACK2 or ECOPACK3 compliant component on demand Description The STTH310-Y, which is using ST’s new 1000 V planar technology, is especially suited for switching mode base drive and transistor circuits. The device is also intended for use as a free-wheeling diode in power supplies and other power switching applications in automotive K functions. Product status link STTH310-Y Product summary IF(AV) 3A VRRM 1000 V Tj (max.) 175 °C VF (typ.) 0.98 V Trr (typ.) 52 ns DS10085 - Rev 2 - March 2022 For further information contact your local STMicroelectronics sales office. www.st.com STTH310-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at Tj= 25 °C, unless otherwise specified) Symbol Parameter Value Unit 1000 V VRRM Repetitive peak reverse voltage IF(AV) Average forward current TL = 95 °C δ = 0.5 3 A IFSM Forward surge current tp = 8.3 ms 30 A Tstg Storage temperature range -65 to + 175 °C Tj(1) Operating temperature range -40 to + 175 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance Symbol Rth(j-l) Parameter Value Unit 16 °C/W Junction to lead Table 3. Static electrical characteristic Symbol Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 3 A Min. Typ. Max. - 10 - 1 - µA 50 - 1.7 0.98 Unit 1.42 V 1. Pulsetest: tp = 5 ms, δ < 2% 2. Pulsetest: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 1.20 x IF(AV) + 0.075 IF²(RMS) Table 4. Dynamic electrical characteristics Symbol trr Reverse recovery time tfr Forward recovery time VFP DS10085 - Rev 2 Parameter Forward recovery voltage Test conditions Tj = 25 °C Tj = 25 °C IF = 0.5 A; Irr = 0.25 A; IR = 1 A IF = 3 A; dIF/dt = 50 A/µs; VFR = 4 V Min. Typ. Max. - 52 75 - 300 8 12 Unit ns V page 2/8 STTH310-Y Electrical characteristics (curves) 1.1 Electrical characteristics (curves) Figure 1. Average forward power dissipation versus average forward current PF(AV)(W) Figure 2. Forward voltage drop versus forward current (typical values) IF(A) 100 6 δ = 0.05 5 δ = 0.1 δ = 0.5 δ = 0.2 δ =1 10 Tj = 150 °C 4 Tj = 25 °C 3 1 2 T 0.1 1 IF(AV)(A) 0 0.0 0.5 1.0 1.5 2.0 tp δ =tp/T 2.5 3.0 VF(V) 3.5 4.0 Figure 3. Forward voltage drop versus forward current (maximum values) 0.01 0.0 0.8 1.2 1.6 2.0 2.4 Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration IF(A) 100 0.4 1.0 Zth(j-l)/Rth(j-l) SMBflat 0.9 0.8 10 Tj = 150 °C 0.7 Tj = 25 °C 0.6 0.5 1 0.4 0.3 0.1 0.2 0.01 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 Single pulse 0.1 VF(V) 3.6 Figure 5. Junction capacitance versus reverse voltage applied (typical values) tp(s) 0.0 1. E-04 1. E-03 1. E-02 1. E-01 1. E+00 1. E+01 Figure 6. Thermal resistance junction to ambient versus copper surface under each lead C (pF) Rth(j-a)(°C/W) 150 100 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C SMB-Flat Epoxy printed board FR4, copper thickness: 70 μm 120 90 10 60 30 VR(V) 1 1 DS10085 - Rev 2 10 100 1000 SCu (cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 3/8 STTH310-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 7. SMB Flat package outline Table 5. SMB Flat mechanical data Dimensions Millimeters Ref. Min. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.060 L2 DS10085 - Rev 2 Typ. Inches 0.60 0.024 page 4/8 STTH310-Y SMB Flat package information Figure 8. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS10085 - Rev 2 page 5/8 STTH310-Y Ordering information 3 DS10085 - Rev 2 Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH310UFY F310Y SMBflat 50 mg 5000 Tape and reel page 6/8 STTH310-Y Revision history Table 6. Document revision history DS10085 - Rev 2 Date Version Changes 05-Feb-2014 1 Initial release. 18-Mar-2022 2 Updated Section 2.1 SMB Flat package information. page 7/8 STTH310-Y IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS10085 - Rev 2 page 8/8