STTH3BCF060U

STTH3BCF060 600 V high voltage rectifier for BC2 topology Features A ■ optimized freewheel diode for BC2 topology (ST patent) ■ low conduction losses ■ high voltage rectifier ■ improves efficiency by up to 2.5% compared to conventional continuous mode PFC using standard ultrafast 600 V PN diodes ■ ■ performance efficiency improved by up to 0.5% compared to 600 V Schottky power diodes with no reverse recovery charges used in CCM PFC at 200 kHz SMB STTH3BCF060U Table 1. provides a cost/performance optimized solution to meet the 80+ efficiency requirements ■ supports PFC working up to 300 kHz ■ suitable for PFC up to 400 W ■ compatible with standard PFC controller ICs K Device summary Symbol Value IF(AV) 3A VRRM 600 V IR (max) 100 µA Tj 175 °C Description The STTH3BCF060 is a specific freewheel diode used in continuous mode power factor correction working in the BC2 topology. This diode has been especially designed for the dedicated BC2 topology. Therefore, its electrical characteristics offer the best possible efficiency with a P-N optimized structured diode. As a result, SMPS efficiency growth up to 2.5% can be produced at an optimized cost. October 2010 Doc ID 17524 Rev 2 1/8 www.st.com 8 Characteristics 1 STTH3BCF060 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward rms current 10 A IF(AV) Average forward current δ = 0.5 TL = 55 °C 3 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 45 A Tstg Storage temperature range - 65 to + 175 °C 175 °C Maximum Unit 25 °C/W Tj Table 3. Maximum operating junction temperature Thermal resistance Symbol Rth(j-l) Table 4. Symbol Parameter Junction to lead Static electrical characteristics Parameter Test conditions Tj = 25 °C IR Reverse leakage current VF Forward voltage drop Tj= 150 °C Tj = 25 °C Tj = 150 °C Min. Typ. Max. Unit 3 VR = VRRM µA 15 100 1.7 IF = 3 A V 1.0 1.25 To evaluate the maximum conduction losses use the following equation: P = 1.03 x IF(AV) + 0.09 IF2(RMS) Table 5. Symbol Parameter trr Reverse recovery time tfr Forward recovery time VFP 2/8 Dynamic electrical characteristics Forward recovery voltage Test conditions Tj = 25 °C IF = 1 A, VR = 30 V dIF/dt = -50 A/µs Tj = 25 °C IF = 3 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax Doc ID 17524 Rev 2 Min. Typ. Max. 35 Unit ns 100 ns 10 V STTH3BCF060 Figure 1. Characteristics Conduction losses versus average Figure 2. current Forward voltage drop versus forward current IFM(A) P(W) 50 5.0 δ = 0.1 δ = 0.2 δ = 0.05 4.5 δ = 0.5 45 4.0 3.5 35 3.0 30 2.5 25 2.0 20 1.5 Tj=150°C (maximum values) 40 δ=1 Tj=150°C (typical values) Tj=25°C (maximum values) 15 T 1.0 10 0.5 δ=tp/T IF(AV)(A) 5 tp 0.0 VFM(V) 0 0.0 0.5 Figure 3. 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Relative variation of thermal impedance junction ambient versus pulse duration 0.0 0.5 Figure 4. Zth(j-a)/Rth(j-a) 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Peak reverse recovery current versus dI F /dt (typical values) IRM(A) 13 1.0 VR=400V Tj=125°C 12 0.9 IF=2 x IF(AV) 11 0.8 10 0.7 9 0.6 8 IF=IF(AV) IF=0.5 x IF(AV) 7 0.5 6 0.4 0.3 IF=0.25 x IF(AV) 5 SMB SCu = 1cm2 4 Single pulse 3 0.2 2 0.1 tp(s) 1 0.0 dIF/dt(A/µs) 0 1.E-01 1.E+00 Figure 5. 1.E+01 1.E+02 1.E+03 0 50 Reverse recovery time versus dIF/dt Figure 6. (typical values) 100 150 200 250 300 350 400 450 500 Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) trr(ns) 450 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 VR=400V Tj=125°C VR=400V Tj=125°C 400 IF=2 x IF(AV) 350 IF=2 x IF(AV) 300 IF=IF(AV) IF=0.5 x IF(AV) 250 IF=IF(AV) 200 IF=0.5 x IF(AV) 150 100 50 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 50 100 150 200 250 300 350 400 450 500 0 50 Doc ID 17524 Rev 2 100 150 200 250 300 350 400 450 500 3/8 Characteristics Figure 7. STTH3BCF060 Softness factor versus dIF/dt (typical values) Figure 8. S factor 1.0 3.0 S factor 0.9 IF=IF(AV) VR=400V Tj=125°C 2.5 Relative variations of dynamic parameters versus junction temperature IRM 0.8 0.7 2.0 0.6 QRR 0.5 1.5 0.4 1.0 0.3 IF=IF(AV) VR=400V Reference: Tj=125°C 0.2 0.5 0.1 dIF/dt(A/µs) 0.0 0 50 Figure 9. 100 150 200 250 300 Tj(°C) 0.0 350 400 450 500 Transient peak forward voltage versus dIF/dt (typical values) 25 50 75 100 125 Figure 10. Forward recovery time versus dIF/dt (typical values) tfr(ns) VFP(V) 200 20 IF=IF(AV) Tj=125°C 18 IF=IF(AV) VFR=1.1 x VF max. Tj=125°C 180 16 160 14 140 12 120 10 100 8 80 6 60 4 40 2 20 dIF/dt(A/µs) 0 dIF/dt(A/µs) 0 0 20 40 60 80 100 120 140 160 180 200 Figure 11. Junction capacitance versus reverse voltage applied (typical values) 0 20 40 60 80 100 120 140 160 180 200 Figure 12. Thermal resistance junction to ambient versus copper surface under lead Rth(j-a)(°C/W) C(pF) 110 100 F=1MHz VOSC=30mVRMS Tj=25°C Epoxy printed circuit board, FR4 copper thickness = 35 µm 100 90 80 70 60 10 50 40 30 20 10 VR(V) 1 4/8 SCU(cm²) 0 1 10 100 1000 0.0 0.5 Doc ID 17524 Rev 2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STTH3BCF060 2 Application information Application information Figure 13. Application schematic L MAIN STTH8BC065 L V MAINS Q STTH8BC060 STTH3BCF060 2.1 BC2 topology description (ST patent) No hard switching occurs at turn-on with BC2 topology. Inductor L in series with the power MOS Q configuration suppresses the switch-on losses. Added winding, coupled with the main boost inductor Lmain, in series with the STTH3BCF060 freewheel diode brings back both recovery current from the STTH8BC065 and damping current towards the power circuit. Another added winding in series with STTH8BC065 boost diode discharges the nominal current stored in inductor L flowing through STTH8BC060 diode towards output bulk capacitor. These two added phases compared with conventional continuous mode PFC, bring back the current corresponding to the usual switching losses in the circuit, hence BC2 (back current circuit). Doc ID 17524 Rev 2 5/8 Package information 3 STTH3BCF060 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. SMB dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 14. Footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 6/8 Doc ID 17524 Rev 2 STTH3BCF060 4 Ordering information Ordering information Table 7. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode STTH3BCF060U 3BC6 SMB 0.11 g 2500 Tape and reel Revision history Table 8. Document revision history Date Revision Changes 18-May-2010 1 First issue. 28-Oct-2010 2 Updated document title. Modified Section 2.1. Doc ID 17524 Rev 2 7/8 STTH3BCF060 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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