STTH3L06U

STTH3L06 Turbo 2 ultrafast high voltage rectifier Datasheet - production data Description K A A K SMB This device uses ST Turbo 2 600 V technology, and is particularly suited as boost diode in discontinuous or critical mode power factor corrections. A K It is also intended for use as a freewheeling diode in power supplies and other power switching applications. SMC Table 1: Device summary DO-201AD Symbol Value IF(AV) 3A VRRM 600 V Features IR (max.) 100 µA     Tj (max.) 175 °C VF (typ.) 0.85 V trr (typ.) 60 ns Ultrafast switching Low forward voltage drop Low thermal resistance Low leakage current (platinum doping) Table 2: Order codes April 2016 DocID8322 Rev 4 This is information on a product in full production. Part number Marking STTH3L06 STTH3L06 STTH3L06U 3L6U STTH3L06S S06 1/11 www.st.com Characteristics 1 STTH3L06 Characteristics Table 3: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) Forward rms current 10 A IF(AV) Average forward current δ = 0.5, square wave 3 A IFSM Surge non repetitive forward current, tp = 10 ms sinusoidal DO-201AD 70 A SMB/SMC 60 A Tstg Storage temperature range -65 to +175 °C +175 °C Tj DO-201AD/SMC TI = 100 °C SMB TI = 80 °C Maximum operating junction temperature Table 4: Thermal parameters Symbol Rth(j-l) Rth(j-a) Parameter DO-201AD L = 10 mm 20 SMB 25 SMC 20 DO-201AD L = 10 mm 75 Junction to lead Junction to ambient Maximum Unit °C/W Table 5: Static electrical characteristics Symbol Parameter IR Reverse leakage current VF Forward voltage drop Test conditions Tj = 25 °C Tj = 150 °C Tj = 25 °C Tj = 150 °C VR = VRRM IF = 3 A Min. Typ. - Max. 3 - 15 - 100 1.3 - 0.85 1.05 Min. Typ. Max. IF = 1 A; dIF/dt = -50 A/μs; VR = 30 V - 60 85 IF = 3 A; dIF/dt = 100 A/μs; VFR = 1.1 x VFmax - 100 IF = 3 A; dlF/dt = 100 A/µs - 7.5 Unit µA V To evaluate the conduction losses use the following equation: P = 0.89 x IF(AV) + 0.055 IF2(RMS) Table 6: Dynamic characteristics Symbol trr Reverse recovery time tfr Forward recovery time VFP 2/11 Parameters Forward recovery voltage Test conditions Tj = 25 °C Unit ns Tj = 25 °C DocID8322 Rev 4 V STTH3L06 Characteristics 1.1 Characteristics (curves) Figure 1: Conduction losses versus average current 4.5 Figure 2: Forward voltage drop versus forward current 1.E+02 P(W) δ = 0.1 δ = 0.05 δ=1 δ = 0.5 δ = 0.2 IFM(A) T j = 150 °C (Maximum values) 4.0 1.E+01 3.5 T j = 150 °C (Typical values) 3.0 2.5 1.E+00 2.0 T j = 25 °C (Maximum values) 1.5 T 1.0 1.E-01 0.5 δ = tp /T IF(AV)(A) 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 tp 3.5 4.0 VFM(V) 1.E-02 0.0 Figure 3: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy printed circuit FR4, eCU = 35 µm) Zth(j-a)/Rth(j-a) 0.9 1.5 2.0 3.0 3.5 V R = 400 V T j = 125° C IF = 2 x IF(AV) 16 0.8 2.5 IRM(A) 18 DO-201AD L leads=10mm 1.0 Figure 4: Peak reverse recovery current versus dIF/dt (typical values) 20 1.0 0.5 14 IF = IF(AV) 0.7 12 0.6 0.5 10 0.4 8 0.3 IF = 0.25 x IF(AV) 6 0.2 0.1 IF = 0.5 x IF(AV) 4 Single pulse tP(s) 0.0 1.E-01 1.E+00 1.E+01 1.E+02 2 1.E+03 dIF/dt(A/µs) 0 0 Figure 5: Reverse recovery time versus dIF/dt (typical values) 100 150 200 250 300 350 400 450 500 Figure 6: Reverse recovery charges versus dIF/ dt (typical values) t (ns) 700 RR 500 V R = 400 V T j = 125 °C 600 50 QRR(nC) V R = 400 V T j = 125 °C 450 IF = 2 x IF(AV) 400 500 IF = IF(AV) 350 IF = 2 x IF(AV) 300 400 IF = 0.5 x IF(AV) 250 IF = IF(AV) 300 IF = 0.5 x IF(AV) 200 150 200 100 100 dIF/dt(A/µs) 50 dIF/dt(A/µs) 0 0 0 20 40 60 80 100 120 140 160 180 200 DocID8322 Rev 4 0 20 40 60 80 100 120 140 160 180 3/11 200 Characteristics STTH3L06 Figure 7: Softness factor versus dIF/dt (typical values) Figure 8: Relative variations of dynamic parameters versus junction temperature Sfactor 2.0 IF = IF(AV) V R = 400 V T j = 125 °C 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 dIF/dt(A/µs) 0.2 0.0 0 20 40 60 80 100 120 140 160 180 200 Figure 9: Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 10 t (ns) 200 fr IF = IF(AV) T = 125 °C j 9 Figure 10: Forward recovery time versus dIF/dt (typical values) IF = IF(AV) 180 8 160 7 140 6 120 5 100 4 80 3 60 VFR = 1.1 x VF max. T = 125 °C j 40 2 dIF/dt(A/µs) 1 20 dlF/dt(A/µs) 0 0 0 20 40 60 80 100 120 140 160 180 Figure 11: Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, eCU = 35 μm) (SMB / SMC) 100 0 200 Rth(j-a)(C°/W) 20 40 60 80 100 120 140 160 Rth(°C/W) 90 SMB 80 200 Figure 12: Thermal resistance versus lead length 100 90 180 DO-201AD R th(j-a) 80 70 70 60 60 SMC 50 50 40 40 30 30 R th(j-l) 20 20 SCu (cm²) 10 0 0.0 4/11 10 Lleads (mm) 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 DocID8322 Rev 4 5 10 15 20 25 Package information STTH3L06 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.    2.1 Epoxy meets UL94, V0 Band indicated cathode (DO-201AD) Bending method: see application note AN1471 (DO-201AD) DO-201AD package information Figure 13: DO-201AD package outline Table 7: DO-201AD package mechanical data Dimensions Ref. Millimeters Min. A B Inches Max. Min. 9.5 25.4 Max. 0.3740 1.000 C 5.3 0.2087 D 1.3 0.0512 E 1.25 0.0492 DocID8322 Rev 4 5/11 Package information 2.2 STTH3L06 SMC package information Figure 14: SMC package outline Table 8: SMC package mechanical data Dimensions Ref. 6/11 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 2.90 3.20 0.1142 0.1260 c 0.15 0.40 0.0059 0.0157 D 5.55 6.25 0.2185 0.2461 E 7.75 8.15 0.3051 0.3209 E1 6.60 7.15 0.2598 0.2815 E2 4.40 4.70 0.1732 0.1850 L 0.75 1.50 0.0295 0.0591 DocID8322 Rev 4 Package information STTH3L06 Figure 15: SMC recommended footprint 5.11 (0.201) 1.54 (0.061) 1.54 (0.061) 3.14 (0.124) 8.19 (0.323) millimeters (inches) DocID8322 Rev 4 7/11 Package information 2.3 STTH3L06 SMB package information Figure 16: SMB package outline Table 9: SMB package mechanical data Dimensions Ref. 8/11 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 1.95 2.20 0.0768 0.0867 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1556 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 DocID8322 Rev 4 Package information STTH3L06 Figure 17: SMB recommended footprint 1.62 0.064 2.60 (0.102) 1.62 0.064 2.18 (0.086) 5.84 (0.230) millimeters (inches) DocID8322 Rev 4 9/11 Ordering information 3 STTH3L06 Ordering information Table 10: Ordering information 4 Order code Marking Package Weight DO-201AD 1.12 g STTH3L06 STTH3L06 STTH3L06-RL STTH3L06 STTH3L06U 3L6U SMB STTH3L06S S06 SMC Base qty. Delivery mode 600 Ammopack 1900 Tape and reel 0.11 g 2500 Tape and reel 0.243 g 2500 Tape and reel Revision history Table 11: Document revision history 10/11 Date Revision Changes October-2001 1 First issue 07-Sep-2004 2 SMB, SMC and DPAK packages added. 14-Oct-2005 3 Changed marking of STTH3L06U from 3L06U to 3L6U. Added ECOPACK statement. 29-Apr-2016 4 Removed DPAK package information. Minor text changes DocID8322 Rev 4 STTH3L06 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID8322 Rev 4 11/11