STTH3R02S

STTH3R02 Ultrafast recovery diode Datasheet - production data Table 1. Device summary A K A A K DO-201AD STTH3R02 K DO-15 STTH3R02Q IF(AV) 3A VRRM 200 V Tj (max) 175 °C VF (typ) 0.7 V trr (typ) 16 ns A K SMC STTH3R02S Features • Very low conduction losses • Negligible switching losses • Low forward and reverse recovery times • High junction temperature Description The STTH3R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. Packaged in DO-201AD, DO-15, and SMC, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. April 2014 This is information on a product in full production. DocID12359 Rev 3 1/9 www.st.com Characteristics 1 STTH3R02 Characteristics Table 2. Absolute ratings (limiting values at Tj = 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IFRM Repetitive peak forward current IF(RMS) Value Unit 200 V tp = 5 µs, F = 5 kHz 110 A DO-201AD / DO-15 70 SMC 70 Forward rms current A DO-15 Tlead = 50 °C IF(AV) Average forward current, δ = 0.5 DO-201AD Tlead = 90 °C 3 A 75 A -65 to + 175 °C SMC Tc = 110 °C IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal Tstg Storage temperature range Tj Maximum operating junction temperature 175 °C TL Maximum lead temperature for soldering during 10 s at 4 mm from case 230 °C Value Unit Table 3. Thermal parameters Symbol Parameter Rth(j-l) Junction to lead Rth(j-c) Junction to case Lead Length = 10 mm on infinite DO-15 heatsink DO-201AD 45 30 SMC °C/W 20 Table 4. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Min. Unit µA 3 IF = 9 A 30 1.20 0.89 1.0 0.76 0.85 0.70 0.80 V IF = 3 A Tj = 150 °C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.68 x IF(AV) + 0.04 IF2(RMS) 2/9 Max. 3 VR = VRRM Tj = 25 °C Tj = 100 °C Typ. DocID12359 Rev 3 STTH3R02 Characteristics Table 5. Dynamic characteristics Symbol trr Test conditions Parameter Typ. Max. IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C 24 30 IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25 °C 16 20 Reverse recovery current IF = 3 A, dIF/dt = -200 A/µs, VR = 160 V, Tj = 125 °C 3.5 4.5 Forward recovery time IF = 3 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax, Tj = 25 °C 40 ns Forward recovery voltage IF = 3 A, dIF/dt = 100 A/µs, Tj = 25 °C 1.9 V Reverse recovery time IRM tfr VFP Figure 1. peak current versus duty cycle Min. Unit ns A Figure 2. Forward voltage drop versus forward current (typical values) IM(A) IFM(A) 100 50 T IM δd=tp/T 80 tp 40 60 30 P = 10 W 40 20 P=5W P=3W Tj=150°C 10 20 Tj=25°C δ 0 0.0 0.1 VFM(V) 0 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.0 1.0 Figure 3. Forward voltage drop versus forward current (maximum values) 0.5 1.0 1.5 2.0 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration - DO-201AD IFM(A) Zth(j-a) /Rth(j-a) 50 1.0 Epoxy printed circuit board FR4, eCU = 35 µm 0.9 40 0.8 DO-201AD Lleads=10 mm 0.7 30 0.6 0.5 20 0.4 Tj=150°C 0.3 Tj=25°C 10 0.2 0.1 VFM(V) tP(s) 0 0.0 0.5 1.0 1.5 Single pulse 2.0 0.0 1.E-01 DocID12359 Rev 3 1.E+00 1.E+01 1.E+02 1.E+03 3/9 9 Characteristics STTH3R02 Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration - DO-15 Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration - SMC Zth(j-a)/Rth(j-a) (j-a) Zth(j-a) /Rth(j-a) 1.0 1.0 Epoxy printed circuit board FR4, eCU = 35 µm 0.9 Epoxy printed circuit board FR4, eCU = 35 µm 0.9 DO-15 Lleads=10 mm 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 SMC Scu=1 cm² 0.2 0.2 Single pulse 0.1 Single pulse 0.1 tP(s) 0.0 1.E-01 tP(s) 0.0 1.E+00 1.E+01 1.E+02 1.E-03 1.E+03 Figure 7. Junction capacitance versus reverse applied voltage (typical values) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 8. Reverse recovery charges versus dIF/dt (typical values) C(pF) QRR(nC) 80 100 F=1MHz Vosc=30mVRMS Tj=25°C IF=3A VR=160V 70 60 50 Tj=125°C 40 10 30 20 Tj=25°C 10 dIF/dt(A/µs) VR(V) 1 0 1 10 100 1000 Figure 9. Reverse recovery time versus dIF/dt (typical values) 10 100 1000 Figure 10. Peak reverse recovery current versus dIF/dt (typical values) IRM(A) tRR(ns) 60 8 IF=3A VR=160V IF=3A VR=160V 7 50 6 40 5 Tj=125°C 30 4 Tj=125°C 3 Tj=25°C 20 2 10 Tj=25°C 1 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 10 4/9 100 1000 10 DocID12359 Rev 3 100 1000 STTH3R02 Ordering information scheme Figure 11. Dynamic parameters versus junction Figure 12. Thermal resistance junction to temperature ambient versus copper surface under each lead QRR; IRM [T j] / Q RR; IRM [T j=125°C] Rth(j-a) (°C/W) 100 1.4 IF=3A VR=160V 1.2 Epoxy printed circuit board FR4, eCU = 35 µm 90 80 1.0 70 DO-15 60 IRM 0.8 50 DO-201AD 0.6 40 QRR 30 0.4 20 0.2 10 Tj(°C) SCu(cm²) 0.0 0 25 50 75 100 125 150 Figure 13. Thermal resistance versus copper surface under each lead for SMC 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 14. Thermal resistance versus lead length for DO-201AD package Rth(°C/W) Rth(j-a) (°C/W) 100 100 Epoxy printed circuit board FR4, eCU = 35 µm SMC DO-201AD 90 80 Rth(j-a) 80 70 60 60 50 40 40 Rth(j-l) 30 20 20 10 SCU(cm²) 0.0 2 Lleads(mm) 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5 5.0 10 15 20 25 Ordering information scheme Figure 15. Ordering information scheme STTH 3 R 02 XXX Ultrafast switching diode Average forward current 3=3A Model R Repetitive peak reverse voltage 02 = 200 V Package Blank = DO-201 in Ammopack RL = DO-201 in Tape and reel Q = DO-15 in Ammopack QRL = DO-15 in Tape and reel S= SMC in Tape and reel DocID12359 Rev 3 5/9 9 Package information 3 STTH3R02 Package information • Epoxy meets UL94, V0 • Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. DO-201AD dimensions Dimensions Ref. Millimeters Min. B E Min. Max. B A Note 1 Max. Inches E A Note 1 B 9.50 25.40 0.374 1.000 ØD Note 2 ØC C 5.30 0.209 D 1.30 0.051 E 1.25 0.049 1 - The lead diameter ø D is not controlled over zone E Notes 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15mm) Table 7. DO-15 dimensions Dimensions C C A Ref. D B 6/9 DocID12359 Rev 3 Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 STTH3R02 Package information Table 8. SMC dimensions Dimensions Ref. Millimeters E1 D E A1 C A2 E2 L b Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 Figure 16. SMC footprint (dimensions in mm) 2.20 4.25 2.20 3.30 8.65 DocID12359 Rev 3 7/9 9 Ordering information 4 STTH3R02 Ordering information Table 9. Ordering information 5 Order code Marking Package Weight Base qty Delivery mode STTH3R02 STTH3R02 DO-201AD 1.16 g 600 Ammopack STTH3R02RL STTH3R02 DO-201AD 1.16 g 1900 Tape and reel STTH3R02Q STTH3R02 DO-15 0.4 g 1000 Ammopack STTH3R02QRL STTH3R02 DO-15 0.4 g 6000 Tape and reel STTH3R02S 3R2S SMC 0.243 g 2500 Tape and reel Revision history Table 10. Document revision history 8/9 Date Revision Changes 03-May-2006 1 First issue. 10-Oct-2006 2 Added SMC package. 17-Apr-2014 3 Updated ECOPACK statement. Reformatted to current standards. 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